JPH0458548A - Hybrid ic module - Google Patents

Abstract

PURPOSE:To make an adhesive creep into a U-shaped groove and to collectively bond the groove to a heat-dissipating metal base plate by a method wherein the U-shaped groove is formed at the circumference in the inner wall surface near the lower end face of a cylindrical insulating frame. CONSTITUTION:A U-shaped groove 4a is formed at the circumference in the inner wall surface near the lower end of a cylindrical resin frame 4. Then, one turn of a groove 2b having a proper depth is formed at the outside of a protruding stripe 2a which has been formed in a prescribed position on a heat-dissipating base plate 2. The lower end face of the resin frame 4 is fitted into the groove 2b and is bonded by using an adhesive 3. Since the U-shaped groove 4a has been formed at the circumference of the cylindrical resin frame at this time, the adhesive creeps into the U-shaped groove and this bonding operation is executed completely. Thereby, an insulating resin 5 which is filled into the resin frame 4 and with which a hybrid IC main body 1 is covered is not leaked out or does not flow out.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a hybrid IC module, and more particularly to a hybrid IC module that prevents leakage of mold resin that protects the hybrid IC body.

(Prior Art) In order to maintain good characteristics, so-called hybrid circuits have conventionally been known to have a structure in which a hybrid IC module is provided with heat dissipation properties in order to dissipate heat generated by driving. That is, as shown in FIG. 3, there is a hybrid IC main body 1 on which electronic components such as IC elements are mounted on a circuit board, and
A heat dissipating base plate 2 made of metal or the like on which the C main body 1 is arranged;
A cylindrical resin frame 4 is provided upright on a heat dissipating base plate 2 so as to surround the hybrid IC body 1 and its end face is bonded with an adhesive 3, and the hybrid IC body 1 is covered and molded within this resin frame 4. The structure includes a mold layer 5 made of insulating resin and a lid 7 made of resin, for example, which seals the upper end opening of the resin frame 4. Note that an external connection terminal 6 is arranged in the cylindrical resin frame 4 so as to penetrate through the side wall, and the terminal of the hybrid IC main body 1 and the external connection terminal 6 are as follows.
For example, they are connected via lead wires (not shown). Furthermore, in order to protect the internal electronic components, the insulating resin mold layer 5 that covers and molds the hybrid IC main body 1 is formed by injecting and filling liquid insulating resin into the resin frame 4 and hardening it. The required coating seal is achieved. In addition, in the figure, 2a indicates a protrusion that has already been formed in the vicinity of the adhesive portion of the main surface of the heat dissipating base plate 2 to the resin frame 4.

(Problems to be Solved by the Invention) However, the hybrid IC module having such a structure has the following problems. That is,
The adhesion between the heat dissipating base plate 2 and one end surface of the resin frame 4 is as follows:
A method is adopted in which the adhesive 3 is applied and stored in a groove 2b previously bored in the main surface of the heat dissipating base plate 2, and the lower end surface of the resin frame 4 is fitted into the groove 2b to integrate the adhesive. There is. In the above-mentioned adhesive integration, due to the amount of adhesive 3 applied or variations in the amount of application, adhesive may be formed between the side surface of the protrusion 2a of the heat dissipating base plate 2 and the inner circumferential surface of the resin frame 4. A gap where no agent 3 is present remains, often resulting in incomplete adhesion. In the past, in order to mold the hybrid module body 1, etc., the liquid insulating resin injected into the resin frame 4 leaked out of the resin frame 4 through the gap, causing damage to the product's appearance. The problem is that it is easy to understand. In other words, the incomplete adhesion (poor adhesion) may impair not only the mechanical strength such as impact resistance but also the dimensional accuracy and appearance of the product.

The present invention was made to solve these problems, and the heat dissipating base plate and the resin frame are sufficiently and tightly bonded to each other, and leakage of the insulating resin filled in the resin frame is also prevented. The purpose of this project is to provide an IC module.

[Structure of the Invention] (Means for Solving the Problems) A hybrid IC module according to the present invention includes a heat dissipating metal base plate, a hybrid IC body disposed on the base plate, and the A hybrid IC module comprising: an insulating cylindrical frame that stands on a base plate with its lower end surface bonded with adhesive so as to surround an IC body; and a resin mold layer that covers the hybrid IC body; A groove is provided around the inner wall surface near the lower end surface of the shaped insulating frame, and the adhesive enters into the groove and contributes to the bonding and integration.

(Function) In the hybrid IC module according to the invention, the groove is provided around the inner wall surface near the lower end of the cylindrical insulating frame that is fitted and bonded to the heat dissipating base plate. The adhesive penetrates up to the point where it contributes to the bonding and integration. That is, by entering the adhesive into the groove and storing it therein, a sufficient amount of adhesive is ensured to form a dense adhesive layer.

Therefore, a sufficient amount of adhesive will be present on the entire surface of the joint between the heat dissipating base plate and the resin frame. No leakage or leakage.

(Example) The present invention will be described in detail below with reference to FIGS. 1 and 2.

FIG. 1 is a cross-sectional view showing an example of the configuration of a hybrid IC module according to the present invention, and 1 is a hybrid IC module in which electronic components such as IC elements are mounted on a circuit board.
This /% hybrid IC main body 1 is disposed on a heat dissipating base plate 2 made of metal. On the heat dissipating base plate 2, a cylindrical resin frame 4, which is integrally molded and has external connection terminals 6 disposed so as to penetrate through the side wall surface, surrounds the hybrid IC main body 1. It is erected and glued as shown below. Note that a groove 4a is provided around the inner wall surface of the cylindrical resin frame 4 near its lower end.

That is, a groove 2b of an appropriate depth is bored around the outside of the protrusion 2a formed at a predetermined position on the surface of the heat dissipating base plate 2, and a groove 2b is formed around the inner wall near the lower end of the groove 2b. Concave groove 4
The lower end surface of the resin frame 4, which is provided around the frame a, is fitted and bonded with an adhesive 3. Incidentally, in the above bonding, a sufficient amount of adhesive 3 is used, and this adhesive 3 enters into the groove 4a of the resin frame 4 and is stored therein.

Further, the external connection terminals 6 which are closely inserted into the side wall portion of the resin frame 4 and the terminals of the hybrid IC main body 1 are connected via, for example, lead wires (not shown).

Furthermore, an insulating resin mold layer 5 is provided inside the resin frame 4 to cover and seal the hybrid IC body 1 housed inside. The insulating resin mold layer 5 is formed by injecting and filling a liquid insulating resin into the resin frame 4 and then curing the resin. The insulating resin mold layer 5 has the role of covering and sealing the hybrid IC body 1 housed inside to protect it. Furthermore, 7 is a lid made of resin that seals the upper end opening of the resin frame 4.

In the hybrid IC module according to the present invention having the above configuration, since a sufficient amount of adhesive 3 is present at the bonded portion between the heat dissipating base plate 2 and the resin frame 4, the bonded portion or between the bonded portions is not bonded. The adhesive 3 is used to tightly integrate the hybrid IC body 9 with no gaps, so that the covering and adhesion of the hybrid IC body 9 is completely maintained. Therefore, even if the liquid insulating resin is subsequently injected and filled into the resin frame 4, it will not leak or flow out from the bonded portion. Moreover, the concave groove 4a provided around the inner wall surface near the lower end of the resin frame 4 functions to store the excess adhesive 3, so that it is pushed out into the resin frame 4 and transferred to the Hyp IC main body 1 side. There is no possibility that it will enter the system and cause any problems.

Next, other embodiments of the present invention will be described.

In the case of the hybrid module according to the present invention shown cross-sectionally in FIG. 2, an annular backing 8 is fitted into a groove 4a provided on the inner peripheral surface near the lower end of the resin frame 4. This is the same as in the previous embodiment. Therefore, in the hybrid IC module having this structure, the backing 8 prevents the adhesive 3 from entering the hyped IC body 1 side and the filled liquid insulating resin from leaking out of the resin frame 4. is prevented.

[Effects of the Invention] As explained above, in the hybrid IC module of the present invention, the entire fitting and bonding portion between the heat dissipating base plate and the resin frame is completely bonded with the adhesive;
Since there is no adhesive in the required area, there are no gaps. Therefore, leakage or outflow of the insulating resin filled into the resin frame and coated onto the hybrid IC body is completely eliminated.

Moreover, the applied adhesive is Hybrid I
Since it does not enter or adhere to the C main body side, it functions as a high-quality module.

[Brief explanation of drawings]

FIG. 1 and FIG. 2 are cross-sectional views showing main parts of different configuration examples of a hybrid IC module according to the present invention, respectively;
FIG. 3 is a cross-sectional view showing the main structure of a conventional hybrid IC module. 1... Hybrid IC main body 2... Heat dissipating base plate 2a... Protrusion 2b of heat dissipating base plate... Fitting groove 3 of heat dissipating base plate. ...
Adhesive 4...Resin frame 4a...Inner groove of resin frame 5...
Insulating resin mold layer 6...External connection terminal 7...Insulating lid body 8...Backing Applicant: Toshiba Corporation

Claims (1)

[Scope of Claims] A heat dissipating metal base plate, a hybrid IC body disposed on the base plate, and a lower end surface adhered to the base plate with adhesive so as to surround the hybrid IC body, and stand upright. A hybrid I comprising an insulating cylindrical frame and a resin mold layer covering the hybrid IC body.
C module, wherein a groove is provided around the inner wall surface near the lower end surface of the cylindrical insulating frame, and the adhesive enters into the groove and contributes to adhesive integration. IC module.