JPH0459958U - - Google Patents

Info

Publication number
JPH0459958U
JPH0459958U JP1990102305U JP10230590U JPH0459958U JP H0459958 U JPH0459958 U JP H0459958U JP 1990102305 U JP1990102305 U JP 1990102305U JP 10230590 U JP10230590 U JP 10230590U JP H0459958 U JPH0459958 U JP H0459958U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
voltage
output
stabilization control
input
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990102305U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990102305U priority Critical patent/JPH0459958U/ja
Publication of JPH0459958U publication Critical patent/JPH0459958U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Continuous-Control Power Sources That Use Transistors (AREA)
JP1990102305U 1990-09-29 1990-09-29 Pending JPH0459958U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990102305U JPH0459958U (cs) 1990-09-29 1990-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990102305U JPH0459958U (cs) 1990-09-29 1990-09-29

Publications (1)

Publication Number Publication Date
JPH0459958U true JPH0459958U (cs) 1992-05-22

Family

ID=31846433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990102305U Pending JPH0459958U (cs) 1990-09-29 1990-09-29

Country Status (1)

Country Link
JP (1) JPH0459958U (cs)

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