JPS5937747U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5937747U
JPS5937747U JP13191782U JP13191782U JPS5937747U JP S5937747 U JPS5937747 U JP S5937747U JP 13191782 U JP13191782 U JP 13191782U JP 13191782 U JP13191782 U JP 13191782U JP S5937747 U JPS5937747 U JP S5937747U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
external lead
semiconductor device
semiconductor
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13191782U
Other languages
English (en)
Other versions
JPS6334286Y2 (ja
Inventor
佐村　敏郎
浜野　寿夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13191782U priority Critical patent/JPS5937747U/ja
Publication of JPS5937747U publication Critical patent/JPS5937747U/ja
Application granted granted Critical
Publication of JPS6334286Y2 publication Critical patent/JPS6334286Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のピングリッドアレイ形半導体装置を示す
断面図、第２図の４１０図はピングリッドアレイ形パッ
ケージのセラミック基板に形成される外部リード端子を
示し、イ図はセラミック基板に貫通形成される場合の斜
視図、０図は埋込形成される場合の斜視図、第３図は本
考案の一実施例である棒状端子を固定したセラミック基
板を示す斜視図である。 図中、１１・・・セラミック基板、１２・・・角棒状リ
ードピン。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体パッケージに取付けられる外部リードピン取付け
    が角棒状であることを特徴とする半導体−装置。
JP13191782U 1982-08-31 1982-08-31 半導体装置 Granted JPS5937747U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13191782U JPS5937747U (ja) 1982-08-31 1982-08-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13191782U JPS5937747U (ja) 1982-08-31 1982-08-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS5937747U true JPS5937747U (ja) 1984-03-09
JPS6334286Y2 JPS6334286Y2 (ja) 1988-09-12

Family

ID=30298080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13191782U Granted JPS5937747U (ja) 1982-08-31 1982-08-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS5937747U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197087U (ja) * 1986-06-05 1987-12-15

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5280452U (ja) * 1975-12-15 1977-06-15
JPS5769770A (en) * 1980-10-20 1982-04-28 Toshiba Corp Preliminary soldering method of outside leads

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5280452U (ja) * 1975-12-15 1977-06-15
JPS5769770A (en) * 1980-10-20 1982-04-28 Toshiba Corp Preliminary soldering method of outside leads

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197087U (ja) * 1986-06-05 1987-12-15

Also Published As

Publication number Publication date
JPS6334286Y2 (ja) 1988-09-12

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