JPH028145U - - Google Patents
Info
- Publication number
- JPH028145U JPH028145U JP1988086132U JP8613288U JPH028145U JP H028145 U JPH028145 U JP H028145U JP 1988086132 U JP1988086132 U JP 1988086132U JP 8613288 U JP8613288 U JP 8613288U JP H028145 U JPH028145 U JP H028145U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- sealing
- hybrid integrated
- circuit
- constituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図、第２図は各々この考案の第１、第２の
実施例による混成集積回路を示す一部断面図、第
３図、第４図は各々従来の混成集積回路の構成例
を示す断面図である。
３……半導体素子、２０，２１……多層回路基
板。
1 and 2 are partial cross-sectional views showing hybrid integrated circuits according to the first and second embodiments of this invention, respectively, and FIGS. 3 and 4 show configuration examples of conventional hybrid integrated circuits, respectively. FIG. 3...Semiconductor element, 20, 21...Multilayer circuit board.
Claims (1)
一方の素子を封止する封止部材を、内部に電子回
路を備えた複数の多層回路基板で構成し、前記素
子と前記電子回路とを電気的に接続したことを特
徴とする混成集積回路。 A sealing member for sealing at least one of a semiconductor element and a surface acoustic wave element is constituted by a plurality of multilayer circuit boards each having an electronic circuit therein, and the element and the electronic circuit are electrically connected. A hybrid integrated circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086132U JPH028145U (en) | 1988-06-29 | 1988-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988086132U JPH028145U (en) | 1988-06-29 | 1988-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028145U true JPH028145U (en) | 1990-01-19 |
Family
ID=31310777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988086132U Pending JPH028145U (en) | 1988-06-29 | 1988-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028145U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0779708A2 (en) | 1995-12-14 | 1997-06-18 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus |
-
1988
- 1988-06-29 JP JP1988086132U patent/JPH028145U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0779708A2 (en) | 1995-12-14 | 1997-06-18 | Murata Manufacturing Co., Ltd. | Surface acoustic wave apparatus |
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