JPH0465244A - Bond feeder - Google Patents

Abstract

PURPOSE:To easily replace a bond tray with another one corresponding to changes in the kinds of tips and bonds and easily adjust the transfer amount of bond by a method wherein a bond feeder consists of a transfer device which selectively transfer one among the two or more bond trays from the feeding position to the stand-by position and vice versa, a horizontal turning device and a squeegee. CONSTITUTION:A bond tray 2A is positioned at the feeding position (a) and another bond tray 2B is located at the stand-by position (b). Then, motors M1 and M2 are brought in operation to horizontally turn the bond trays 2A and 2B in the direction shown by arrows N. Thereby, a squeegee 26 smoothes the liquid surface of a bond 23 to keep the depth (d) of the bond 23 constant. A transfer element 30 is placed on the liquid surface, and bond 23A attaches on the back of the transfer element 30 and is transferred on a base plate 31. A knob 16 is operated to move up or down the bond tray 2A against the squeegee 26 so that the depth (d) is changed and the amount of the bond attached on the transfer element 30 is adjusted. When the kind of the bond 23 is changed, a cylinder 9 is operated to replace the tray 2A with the tray 2B.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a bond supply device, and the present invention relates to a bond supply device, and is capable of providing a bond supply device by providing a plurality of bond reservoirs and using these bond reservoirs appropriately according to the types of chips and bonds. , the amount of bond transferred is adjusted.

(Prior Art) Chips such as ICs and LSIs are bonded by applying a bond to a substrate such as a lead frame.

In general, such bond application is performed by storing the bond in a bond reservoir provided in a bond supply device, attaching the bond to a transfer element, and transferring the bond onto a substrate.

(Problem B to be Solved by the Invention) As described above, when transferring a bond onto a substrate, it is desirable to adjust the amount of transfer depending on the type of chip, especially its size, and the type of bond. However, the conventional bond supply device did not have a means to adjust the amount of transfer.

The amount of transfer is always constant regardless of the type of bond or type of bond, and therefore, there is a problem that in some cases there is a tendency to have too much bond or too little bond.

SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide a bond supply device that can adjust the amount of bond transferred depending on the type of chip or bond.

(Means for Solving the Problems) The present invention provides a plurality of bond reservoirs, a moving means for selectively moving these bond reservoirs to a supply position and a standby position, and a horizontal rotation mechanism for horizontally rotating these bond reservoirs. A bond supply device is constituted by a rotational drive means for causing the bond to flow, and a squeegee for smoothing the liquid surface of the bond stored in these bond reservoirs.

(Operation) In the above configuration, one of the plurality of bond reservoirs is positioned at the supply position, and the bond of this bond reservoir is attached to the transfer element and transferred to the substrate.

In addition, the other bond storage body is kept at the standby position, and while it is horizontally rotated during standby, the liquid level of the bond is adjusted to a predetermined height using a squeegee. Prepare the bond reservoir so that it can be replaced with the above bond reservoir at any time. When the amount of bond transferred or the type of bond changes due to a change in the type of chip, etc., the moving means is driven to exchange the bond reservoir at the supply position and the bond reservoir at the standby position.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view of the bond supply device, FIG. 2 is a side view, and FIG. 3 is a plan view. Reference numeral 1 denotes a main body frame, which is provided with two bond reservoirs 2A and 2B. Ml, M2
is a motor, and via belt 3 and boo IJ4 and 5,
The bond reservoirs 2A and 2B are horizontally rotated. Reference numeral 6 denotes a stand, and the main body frame 1 is supported by this stand 6 via a bracket 12. This platform 6 is placed on a rail 8 via a slider 7.

9 is the cylinder, 10 is its rond, and 11 is the plywood tip.

By protruding and retracting the rondo lO, the platform 6 slides on the rail 8, and the bond reservoir 2A.

2B is selectively positioned at the supply position a and the standby position.

That is, each of the above members 7 to 1o includes the bond reservoir 2A,
It constitutes the transportation means of 2B.

In Fig. 2, 13 indicates the main body frame 1 with the bracket 1
A mounting screw 14 for mounting on 2 is a long hole.

15 is a draw rod, which is screwed into the main body frame 1. When the operation part 16 is manually rotated, the main body frame 1 moves up and down along the bracket 12, and the bond reservoir 2
Adjust the height of A and 2B.

In FIG. 2, 20 is a bond stocker, and a bond 23 is stored in a recessed portion 21. In FIG. The bond reservoirs 2A and 2B are disk-shaped and have a reservoir 24 of the bond 23.
A reservoir 25 for storing the overflowing bond 23 is formed in a ring shape. As the bond 23, epoxy resin, silver paste, etc. are generally used. The two bond reservoirs 2A and 2B may store bonds of the same type, or may store bonds of different types. Due to its heavy viscosity, the bond 23 stored in the recessed portion 21 flows down little by little into the storage portion 24 and is replenished.

In FIG. 3, 26 and 27 are squeegees that smooth the liquid surface of the bond 23. 30 is a transcription element. This transfer element 30 attaches the bond 23 of the storage section 24 to the lower end,
The image is transferred onto a substrate 31 (see FIG. 4). In Figure 3,
P (PI.

P2...) is an attachment position where the transfer element 30 moves up and down and the bond 23 is attached to its lower surface.

This device has the above-mentioned configuration, and its operation will be explained next.

One bond reservoir 2A is located at the supply position a, and the other bond reservoir 2B is located at the standby position (.

In this state, motor Ml.

M2 is driven to horizontally rotate the bond reservoirs 2A and 2B in the direction of arrow N. Then, as shown in FIG. 4, the squeegee 26 smoothes the liquid surface of the bond 23 and maintains the depth d of the bond 23 constant. The transfer element 3o lands on this smoothed liquid surface, attaches the bond 23A to its lower surface, and transfers the bond 23A to the substrate 31. Transcriptor 30
The amount of bond 23A attached to substrate 31, that is, the amount of transfer transferred to substrate 31, is determined by the depth d of bond 23. Therefore, the depth d is adjusted by operating the operating section 16 to move the bond reservoir 2A up and down with respect to the squeegee 26.

Bond 23 has high viscosity. Therefore, when the transfer element 30 attaches and removes the bond 23 of the bond reservoir 2A, the liquid level of the bond 23 in that part is partially lowered as if being hollowed out.

If the transfer element 30 lands on this recessed portion after the bond reservoir 2A rotates once, the bond 23 cannot be sufficiently attached. Therefore, as shown in FIG.
The rotational speed of the motor M1 is controlled so that the rotational speed of the motor M1 is shifted in order.

Note that the vertical position of the transfer element 30 for attaching the bond 23 is always constant.

In this way, one bond reservoir 2A is placed at the supply position a.
When the bond 23 is being supplied to the transfer element 30, the other bond reservoir 2B is in the standby position, but during the standby, the motor M2 of this bond reservoir B is also driven. By smoothing the liquid surface of the bond 23 using the squeegee 27 so that the depth of the bond 23 reaches a desired depth, the bond reservoir 2A is prepared to be replaced at any time with the bond reservoir 2A being supplied at the supply position a. There is.

Now, when the transfer amount changes due to a change in the type of chip, or when the type of bond 23 changes, operate the cylinder 9,
The bond reservoir 2A and the bond reservoir 2B are exchanged. That is, by operating the cylinder 9, the bond reservoir 2A moves to the standby position, and the bond reservoir 2B moves to the supply position a. Therefore, similarly to the above case, the bond 23 of this bond reservoir 2B is attached to the transfer element 30 and transferred to the substrate 31. In this case, bond reservoir 2B
Since the liquid level was smoothed and adjusted to the desired depth at the standby position during standby, it can be immediately attached to the transfer element 30 and transferred to the substrate 31. Further, in the standby position, the bond reservoir 2A is horizontally rotated by driving the motor M1, the rough liquid surface is smoothed by the squeegee 26, and the depth of the bond 23 is adjusted.

By adjusting the depth of the bond 23 during standby in this manner, the bond reservoir 2A can be replaced with the bond reservoir 2B at any time and immediately to supply the bond 23 to the transfer element 30. In this way, according to the present means, the bond reservoir 2
By replacing A and 2B, the transfer amount of the bond 23 attached to the transfer element 30 can be easily adjusted.

In the above embodiment, there are two bond reservoirs, but three or more bond reservoirs may be provided.

(Effects of the Invention) As described above, the present invention provides a plurality of bond reservoirs, a moving means for selectively moving these bond reservoirs to a supply position and a standby position, and a horizontal movement means for moving these bond reservoirs to a supply position and a standby position. The bond supply device consists of a rotational drive means for rotating and a squeegee for smoothing the liquid surface of the bond stored in these bond reservoirs. By replacing the bond, the transfer amount of the bond can be easily adjusted, and by storing different types of bonds in each bond reservoir, the bond can be easily replaced. Moreover, in the standby position, the liquid level of the bond reservoir can be kept smooth to a predetermined depth while waiting, so the bond reservoir can be immediately replaced and bond can be supplied to the transfer element without loss time.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which FIG. 1 is a front view of a bond supply device, FIG. 2 is a side view, FIG. 3 is a plan view, and FIG. 4 is a sectional view of a main part. 2A, 2B... Bond reservoirs 7 to 10... Moving means 23... Bond 26.27... Squeegee Ml, M2... Rotation drive means

Claims (1)

[Claims] A plurality of bond reservoirs, a moving means for selectively moving these bond reservoirs to a supply position and a standby position, a rotation drive means for horizontally rotating these bond reservoirs, and a plurality of bond reservoirs for storing a plurality of bond reservoirs. A bond supply device comprising: a squeegee for smoothing the liquid surface of the bond.