JPH0465401U - - Google Patents

Info

Publication number
JPH0465401U
JPH0465401U JP10790790U JP10790790U JPH0465401U JP H0465401 U JPH0465401 U JP H0465401U JP 10790790 U JP10790790 U JP 10790790U JP 10790790 U JP10790790 U JP 10790790U JP H0465401 U JPH0465401 U JP H0465401U
Authority
JP
Japan
Prior art keywords
resin dip
terminal
main surface
resin
lower main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10790790U
Other languages
Japanese (ja)
Other versions
JP2538692Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990107907U priority Critical patent/JP2538692Y2/en
Publication of JPH0465401U publication Critical patent/JPH0465401U/ja
Application granted granted Critical
Publication of JP2538692Y2 publication Critical patent/JP2538692Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Details Of Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す断面図解図
である。第２Ａ図〜第２Ｃ図はこの実施例の製造
工程を示す断面図解図であり、第２Ａ図は樹脂デ
イツピングした状態、第２Ｂ図は加圧成形した状
態、第２Ｃ図は完成した状態である。第３図はこ
の実施例をキヤリアテープから吸引する状態を示
す断面図解図である。第４図は従来技術を示す断
面図解図である。 図において、１０は樹脂デイツプ型電子部品、
１２は樹脂デイツプ層、１４は端子、１６は上方
主面、１８は下方主面、２６は基板、３０，３８
は端部を示す。 FIG. 1 is an illustrative cross-sectional view showing one embodiment of this invention. Figures 2A to 2C are cross-sectional diagrams showing the manufacturing process of this example. Figure 2A shows the resin-dipped state, Figure 2B shows the pressure-molded state, and Figure 2C shows the completed state. . FIG. 3 is an illustrative cross-sectional view showing a state in which this embodiment is sucked from a carrier tape. FIG. 4 is an illustrative cross-sectional view showing the prior art. In the figure, 10 is a resin dip type electronic component;
12 is a resin dip layer, 14 is a terminal, 16 is an upper main surface, 18 is a lower main surface, 26 is a substrate, 30, 38
indicates the end.

Claims (1)

【実用新案登録請求の範囲】 樹脂デイツプ層および前記樹脂デイツプ層から
引き出される端子を有しかつ面実装される樹脂デ
イツプ型電子部品において、 前記樹脂デイツプ層の下方主面が、前記端子に
向かうにつれて傾斜するテーパ状に形成され、 基板上に載置したとき、前記樹脂デイツプ層の
下方主面のうち前記端子から遠い側の端部と前記
端子とで支持されることを特徴とする、樹脂デイ
ツプ型電子部品。[Claims for Utility Model Registration] In a surface-mounted resin dip type electronic component having a resin dip layer and a terminal drawn out from the resin dip layer, the lower main surface of the resin dip layer increases as the lower main surface of the resin dip layer approaches the terminal. The resin dip is formed in an inclined taper shape, and is supported by the terminal and an end of the lower main surface of the resin dip layer on the side farthest from the terminal when placed on a substrate. type electronic components.
JP1990107907U 1990-10-15 1990-10-15 Resin dip type electronic parts Expired - Lifetime JP2538692Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990107907U JP2538692Y2 (en) 1990-10-15 1990-10-15 Resin dip type electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990107907U JP2538692Y2 (en) 1990-10-15 1990-10-15 Resin dip type electronic parts

Publications (2)

Publication Number Publication Date
JPH0465401U true JPH0465401U (en) 1992-06-08
JP2538692Y2 JP2538692Y2 (en) 1997-06-18

Family

ID=31854636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990107907U Expired - Lifetime JP2538692Y2 (en) 1990-10-15 1990-10-15 Resin dip type electronic parts

Country Status (1)

Country Link
JP (1) JP2538692Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111005A (en) * 1988-10-20 1990-04-24 Matsushita Electric Ind Co Ltd Chip-type electronic component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111005A (en) * 1988-10-20 1990-04-24 Matsushita Electric Ind Co Ltd Chip-type electronic component

Also Published As

Publication number Publication date
JP2538692Y2 (en) 1997-06-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term