JPH0465465U - - Google Patents

Info

Publication number
JPH0465465U
JPH0465465U JP1990109204U JP10920490U JPH0465465U JP H0465465 U JPH0465465 U JP H0465465U JP 1990109204 U JP1990109204 U JP 1990109204U JP 10920490 U JP10920490 U JP 10920490U JP H0465465 U JPH0465465 U JP H0465465U
Authority
JP
Japan
Prior art keywords
led element
insulating substrate
electrodes
led
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990109204U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990109204U priority Critical patent/JPH0465465U/ja
Publication of JPH0465465U publication Critical patent/JPH0465465U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す側面発光型チ
ツプＬＥＤの図、第２図は実装用基板に本考案の
側面発光型チツプＬＥＤを実装した一実施例を示
す図、第３図、第４図、及び第５図は実装用基板
に対して平行に発光させる側面発光用ＬＥＤの従
来の実施例を示す図である。 １……プラスチツク絶縁体、２，３……金属パ
ターン、４……ＬＥＤ素子、５……ワイヤー、６
……透光性樹脂、７，８……半田付け電極、９…
…実装用基板、１０……配線パターン、１１……
半田。 Fig. 1 is a diagram of a side-emitting type chip LED showing an embodiment of the present invention, Fig. 2 is a diagram showing an embodiment of the side-emitting type chip LED of the present invention mounted on a mounting board, Fig. 3, FIGS. 4 and 5 are diagrams showing conventional embodiments of side-emitting LEDs that emit light parallel to a mounting board. 1... Plastic insulator, 2, 3... Metal pattern, 4... LED element, 5... Wire, 6
...Transparent resin, 7, 8...Soldering electrode, 9...
... Mounting board, 10... Wiring pattern, 11...
solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] メツキ配線により電極形成された絶縁基板上に
ＬＥＤ素子を実装し、透光性樹脂に封止てしたチ
ツプ型ＬＥＤに於いて、該絶縁基板に、直方体の
一面にへこみを付け、その表面にメツキ配線を施
したプラスチツク成形基板を用い、そのへこみ内
部にＬＥＤ素子を実装し、対向する一対の側面を
全面半田付け電極とすることにより、実装用基板
に対し平行に発光するような実装を可能にしたこ
とを特徴とする側面発光型ＬＥＤ。 In a chip-type LED in which an LED element is mounted on an insulating substrate on which electrodes are formed using plating wiring and sealed in a translucent resin, a dent is made on one side of a rectangular parallelepiped in the insulating substrate, and the surface is plated. By using a plastic molded board with wiring, mounting the LED element inside the recess, and using a pair of opposing sides as soldered electrodes on the entire surface, it is possible to mount the LED element so that it emits light parallel to the mounting board. A side-emitting type LED characterized by:
JP1990109204U 1990-10-18 1990-10-18 Pending JPH0465465U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990109204U JPH0465465U (en) 1990-10-18 1990-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990109204U JPH0465465U (en) 1990-10-18 1990-10-18

Publications (1)

Publication Number Publication Date
JPH0465465U true JPH0465465U (en) 1992-06-08

Family

ID=31856369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990109204U Pending JPH0465465U (en) 1990-10-18 1990-10-18

Country Status (1)

Country Link
JP (1) JPH0465465U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (en) * 1991-10-23 1993-05-07 Sharp Corp Optical semiconductor device
JPH08287178A (en) * 1995-04-13 1996-11-01 Keyence Corp Lighting device and optical information reader
WO2001082386A1 (en) * 2000-04-24 2001-11-01 Rohm Co., Ltd. Edge-emitting light-emitting semiconductor device and method of manufacture thereof
JP2003234507A (en) * 2002-02-07 2003-08-22 Koha Co Ltd Side-emitting LED lamp
JP2015170813A (en) * 2014-03-10 2015-09-28 日亜化学工業株式会社 Light emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02151086A (en) * 1988-12-01 1990-06-11 Matsushita Electric Ind Co Ltd Light emitting diode

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02151086A (en) * 1988-12-01 1990-06-11 Matsushita Electric Ind Co Ltd Light emitting diode

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05114751A (en) * 1991-10-23 1993-05-07 Sharp Corp Optical semiconductor device
JPH08287178A (en) * 1995-04-13 1996-11-01 Keyence Corp Lighting device and optical information reader
WO2001082386A1 (en) * 2000-04-24 2001-11-01 Rohm Co., Ltd. Edge-emitting light-emitting semiconductor device and method of manufacture thereof
JP2003234507A (en) * 2002-02-07 2003-08-22 Koha Co Ltd Side-emitting LED lamp
JP2015170813A (en) * 2014-03-10 2015-09-28 日亜化学工業株式会社 Light emitting device

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