JPS5758341A - Electronic parts with multiple metallayers - Google Patents
Electronic parts with multiple metallayersInfo
- Publication number
- JPS5758341A JPS5758341A JP55133868A JP13386880A JPS5758341A JP S5758341 A JPS5758341 A JP S5758341A JP 55133868 A JP55133868 A JP 55133868A JP 13386880 A JP13386880 A JP 13386880A JP S5758341 A JPS5758341 A JP S5758341A
- Authority
- JP
- Japan
- Prior art keywords
- metallic
- layers
- electronic parts
- chip
- cost
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/66—Conductive materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE:To reduce the cost of electronic parts and to obtain the preferable bonding strength of the parts having a metallic surface on an insulating substrate 1 by forming Ni-P and Pa layers on the metallic surface. CONSTITUTION:Metallic surfaces 2, 3 are formed on a ceramic housing 1, Ni-P metallic layers 4, 5 are formed directly above the metallic surfaces, and Pa metallic layers 6, 7 are respectively formed on the layers 4, 5. A semidonductor chip is mounted via a solder, e.g, Au-Si, etc., on the layer 7, the electrodes of the chip 8 are electrically connected to the metallic layers via wires 9, and are led to external leads 10. In this manner, the cost of the electric part can be largely reduced without using expensive Au but using inexpensive material. Further, is bonding strength, oxidation resistant. Property and discoloration resistant property do not alter, but preferable performance can be obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55133868A JPS6041867B2 (en) | 1980-09-25 | 1980-09-25 | Electronic components with multimetallic layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55133868A JPS6041867B2 (en) | 1980-09-25 | 1980-09-25 | Electronic components with multimetallic layers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5758341A true JPS5758341A (en) | 1982-04-08 |
| JPS6041867B2 JPS6041867B2 (en) | 1985-09-19 |
Family
ID=15114927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55133868A Expired JPS6041867B2 (en) | 1980-09-25 | 1980-09-25 | Electronic components with multimetallic layers |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6041867B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11330652A (en) * | 1997-06-10 | 1999-11-30 | Canon Inc | Substrate and method of manufacturing the same |
| EP0884934A3 (en) * | 1997-06-10 | 2000-03-15 | Canon Kabushiki Kaisha | Substrate and method for producing it |
-
1980
- 1980-09-25 JP JP55133868A patent/JPS6041867B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11330652A (en) * | 1997-06-10 | 1999-11-30 | Canon Inc | Substrate and method of manufacturing the same |
| EP0884934A3 (en) * | 1997-06-10 | 2000-03-15 | Canon Kabushiki Kaisha | Substrate and method for producing it |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6041867B2 (en) | 1985-09-19 |
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