JPH0465475U - - Google Patents
Info
- Publication number
- JPH0465475U JPH0465475U JP10822790U JP10822790U JPH0465475U JP H0465475 U JPH0465475 U JP H0465475U JP 10822790 U JP10822790 U JP 10822790U JP 10822790 U JP10822790 U JP 10822790U JP H0465475 U JPH0465475 U JP H0465475U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- insertion hole
- wiring pattern
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000037431 insertion Effects 0.000 claims description 13
- 238000003780 insertion Methods 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Control Of Resistance Heating (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の実施例１を示す分解斜視図、
第２図は同上の側面図、第３図は同上の要部の断
面図、第４図は本考案の実施例２を示す断面図、
第５図は同上の要部の断面図、第６図はプリント
基板に実装される回路の一例を示す回路図、第７
図は従来例を示す要部の平面図である。
１……第１のプリント基板、２……第２のプリ
ント基板、４……差込孔、５……差込脚、６……
配線パターン、７……ランドパターン、８……半
田、９……透孔、１１……絶縁基板、１２……導
電膜、１３……絶縁基板、１４……導電膜。
FIG. 1 is an exploded perspective view showing Embodiment 1 of the present invention;
FIG. 2 is a side view of the same as above, FIG. 3 is a sectional view of the main part of the same as above, and FIG. 4 is a sectional view showing Embodiment 2 of the present invention.
Figure 5 is a sectional view of the main parts of the same as above, Figure 6 is a circuit diagram showing an example of a circuit mounted on a printed circuit board, and Figure 7 is a circuit diagram showing an example of a circuit mounted on a printed circuit board.
The figure is a plan view of main parts showing a conventional example. DESCRIPTION OF SYMBOLS 1... First printed circuit board, 2... Second printed circuit board, 4... Insertion hole, 5... Insertion leg, 6...
Wiring pattern, 7... Land pattern, 8... Solder, 9... Through hole, 11... Insulating substrate, 12... Conductive film, 13... Insulating substrate, 14... Conductive film.
Claims (1)
２のプリント基板の端縁に上記差込孔に挿通する
差込脚を突設し、第１のプリント基板に対して第
２のプリント基板を立設するようにしたプリント
基板の連結構造において、第１のプリント基板は
絶縁基板の両面に導電膜を積層した両面基板であ
つて、第１のプリント基板の一面には差込孔に跨
がる配線パターンが形成され、第１プリント基板
の他面には差込孔の周囲でランドパターンが形成
され、差込孔を通して上記配線パターンとランド
パターンとが半田により電気的に接続されて成る
プリント基板の連結構造。 (2) 第１のプリント基板に差込孔を穿孔し、第
２のプリント基板の端縁に上記差込孔に挿通する
差込脚を突設し、第１のプリント基板に対して第
２のプリント基板を立設するようにしたプリント
基板の連結構造において、第１のプリント基板の
少なくとも一面には差込孔に跨がる配線パターン
が形成され、第２のプリント基板は絶縁基板の両
面に導電膜を積層した両面基板であつて、上記配
線パターンに対応する部位に透孔を有し、第２の
プリント基板の両面に形成された導電膜が透孔を
通して半田により電気的に接続されるとともに、
上記配線パターンが半田により第２のプリント基
板の導電膜に電気的に接続されて成るプリント基
板の連結構造。[Claims for Utility Model Registration] (1) An insertion hole is bored in the first printed circuit board, an insertion leg is provided projecting from the edge of the second printed circuit board to be inserted into the insertion hole, and In a printed circuit board connection structure in which a second printed circuit board is installed upright with respect to a printed circuit board, the first printed circuit board is a double-sided board in which a conductive film is laminated on both sides of an insulating board, and the first A wiring pattern spanning the insertion hole is formed on one side of the printed circuit board, a land pattern is formed around the insertion hole on the other side of the first printed circuit board, and the wiring pattern and the land pattern are connected through the insertion hole. A printed circuit board connection structure in which the and are electrically connected by solder. (2) An insertion hole is drilled in the first printed circuit board, an insertion leg is provided protruding from the edge of the second printed circuit board to be inserted into the insertion hole, and the second printed circuit board is inserted into the first printed circuit board. In a printed circuit board connection structure in which two printed circuit boards are installed vertically, a wiring pattern spanning the insertion hole is formed on at least one surface of the first printed circuit board, and a wiring pattern that spans the insertion hole is formed on both surfaces of the second printed circuit board. It is a double-sided board in which a conductive film is laminated on the second printed circuit board, and has a through hole in a portion corresponding to the wiring pattern, and the conductive film formed on both sides of the second printed circuit board is electrically connected by solder through the through hole. Along with
A printed circuit board connection structure in which the wiring pattern is electrically connected to a conductive film of a second printed circuit board by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10822790U JPH0723978Y2 (en) | 1990-10-15 | 1990-10-15 | Printed circuit board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10822790U JPH0723978Y2 (en) | 1990-10-15 | 1990-10-15 | Printed circuit board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0465475U true JPH0465475U (en) | 1992-06-08 |
| JPH0723978Y2 JPH0723978Y2 (en) | 1995-05-31 |
Family
ID=31855102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10822790U Expired - Lifetime JPH0723978Y2 (en) | 1990-10-15 | 1990-10-15 | Printed circuit board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723978Y2 (en) |
-
1990
- 1990-10-15 JP JP10822790U patent/JPH0723978Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723978Y2 (en) | 1995-05-31 |
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