JPH0468552A - Direction judgment equipment for semiconductor device - Google Patents

Abstract

PURPOSE:To make an accurate inspection by judging the direction of a semiconductor device with a relative difference in lightness between the ejector pin's trace and the molded surface. CONSTITUTION:Light is cast on a semiconductor device 12 at an angle from an illuminator 12 and a molded section 8 is photographed with a photoelectric transfer equipment 1. Then, an image of the molded section 8 is taken into a judgment equipment 15 to detect the lightness of the molded section 8, with the lightness detection range set for the trace of the ejector pin. A part between A and B is the ejector pin's trace and a part between C and D is the molded section. When these parts are converted to video signals, the A-B part comes out dark and has a lower lightness than the C-D part in a normally directed semiconductor device; there is a difference in lightness 11 between the A-B part and the C-D part in a normally directed semiconductor device. In the case of an abnormally directed semiconductor device, however, there is no difference in lightness between the A-B part and the C-D part. When the difference in lightness 11 is within the preliminarily set tolerance, the semiconductor device is judged good. When the difference in lightness 11 is not within the preliminarily set tolerance, the semiconductor device is judged no good.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a direction determining device for a semiconductor device.

[Conventional technology]

FIG. 8 is a block diagram showing the configuration of a conventional orientation determination device for a semiconductor device. In the figure, (1) is a photoelectric conversion device, an Oe
is a video signal threshold determination unit for converting the video signal into 2 (FI), 0η is a binarized image determination unit, (2a) and (2b) are inspections that memorize the positions of the ejector pin trace and mold part of the semiconductor device. Range setting section (18a) (18b) is a white point number counting section that counts the number of white points in the range specified by the inspection range setting section (2), (to) is a usage point comparison section that compares a plurality of white point numbers, ( 5) is an inspection judgment value setting section which is a judgment criterion of the inspection, and (6) is an inspection result judgment section which compares the output of the white point number comparison section (to) and the value of the inspection judgment value setting section (5). In Figure 9, (7) is the trace of idiectabine, (8
) is the mold part, and the tap is the semiconductor device in the normal direction.

In FIG. 10, (9) is a video signal when the illumination is bright, Ql is a video signal when the illumination is dark, and Ql is a video signal threshold set by the inspection judgment value setting section (5).

In FIG. 11, α-water is a semiconductor device in an abnormal direction.

Next, the operation will be explained. As shown in FIG. 6, the illumination device side is illuminated from an oblique direction of the semiconductor device surface, the mold part (8) is photographed by a photoelectric conversion device fi+, and the image is captured by a determination device α. Since the subsequent processing is performed by the microcomputer, the explanation will be given according to the flowchart shown in FIG. A binarized image is determined from the image taken in by the determination device 0 according to the video signal threshold value Os. Next, the detection range of the ejector pin mark (7) is determined, and the number of white spots in that range is counted. Then, the detection range of the mold part (8) is determined, and the number of white spots in that range is counted. This part is illustrated in Figures 9 to 12. FIG. 9 shows the case of a semiconductor device in the normal direction, with the ejector pin trace between points AB and the mold part between points C and D.

Figure 10 shows this part converted into a video signal.
When the video signal (9) in bright lighting is binarized using the video signal threshold, the ejector pin trace part of AB is early, and the trace part of the ejector pin of C is early.
The mold part between points -D appears white. FIG. 11 shows the position of the mold part between points A and B and between points C and D in the case of a semiconductor device in an abnormal direction. This part is converted into a video signal in the 12th time, and the difference in brightness between points A and B and between points CD is very small compared to that in FIG. These A-
The difference between the two types of white point numbers between points B and between points C and D was determined, and judgment as to whether the product was good or bad was made based on whether the value was within the inspection judgment value. FIG. 13 is a flowchart showing the operation of the above-described semiconductor device orientation determining device.

[Problem to be solved by the invention]

Conventional orientation determination devices for semiconductor devices have been configured as described above, so if the overall brightness changes even with the same bar cage, it is necessary to change the inspection threshold. If not, the test results may be misjudged, and the video signal side (when the lighting is bright)
If the setting is made so that the inspection can be performed normally at the time of 9), there is a problem that if the video signal becomes 0Φ due to deterioration of the illumination, an erroneous determination will be made.

This invention was made to solve the above-mentioned problems, and when the overall brightness changes in the same pancage or when the ejector pin traces and
It is an object of the present invention to provide a direction determination device for a semiconductor device that can normally perform direction determination even when the shading of a mold part changes slightly.

[Means to solve the problem]

An apparatus for determining the direction of a semiconductor device according to the present invention compares the brightness difference between the ejector pin trace portion and the mold portion with an inspection threshold.

[Effect]

The device for determining the direction of a semiconductor device according to the present invention makes a determination based on the relative brightness of the ejector pin trace and the mold.

〔Example〕

An embodiment of the present invention will be described below. 1st
In the figure, (1) is a photoelectric conversion device, (2) is an inspection range setting unit that stores the positions of the ejector pin trace and mold part of the semiconductor device, and (3) is the range specified by the inspection range setting unit (2). (4) is a brightness comparison unit that compares the brightness of a plurality of brightness detection units (3);
) is an inspection judgment value setting section which is a judgment criterion for the inspection, and (6) is an inspection result judgment section which compares the output of the brightness comparison section (4) with the value of the inspection judgment value setting section (5). In Figure 2, (
7) is the ejector pin mark, (8) is the mold part, and the side is the semiconductor device in the normal direction. In Figure 3, (9)
is a video signal when the illumination is bright, 0ω is a video signal when the illumination is dark, and at+ is the difference in brightness between the ejector pin trace part and the mold part. In FIG. 4, 03 is a semiconductor device in an abnormal direction. In FIG. 6, (b) is a lighting device, and α (ri) is a determination device.

As shown in FIG. 6, the illumination device at+ is used to illuminate the semiconductor device ω from an oblique direction, the mold part (8) is photographed by the photoelectric conversion device (11), and the image is captured by the determination device 051. The computer processing (Z) will be explained according to the flowchart in FIG.

The brightness detection range of the ejector pin trace is set based on the image captured by the determination device αω, and the brightness is detected.

Next, the brightness detection range of the mold part is set, and the brightness is detected. This part is illustrated in Figures 2 to 5. Figure 2 shows the case of a semiconductor device in the normal direction, with A
The part between points -B is the ejector pin trace, and the part between points C and D is the mold part. This portion is converted into a video signal as shown in FIG. 3. Since the area between points A and B appears darker and the brightness is lower than that between points C and D, a brightness difference Qll occurs.

Conversely, in the case of the abnormal direction in Figure 4, between points A and B, C
Since both points -D are on the mold surface, the difference in brightness of the video signal in FIG. 3 does not appear in the video signal in FIG.

It is determined whether this brightness difference αυ is greater than or equal to a preset value, and if it is within the allowable range, it is determined to be good; otherwise, it is determined to be bad.

Although the above embodiment has been described with respect to determining the orientation of a semiconductor device, the same method can also be applied to determining the front and back sides of a semiconductor device, and similar effects can be obtained.

〔Effect of the invention〕

As described above, according to the present invention, since the direction is determined based on the relative brightness difference between the brightness of the ejector pin mark of the semiconductor device and the brightness of the mold surface, there is an effect that highly accurate inspection can be performed.

[Brief explanation of the drawing]

Fig. 1 is a block diagram of a device for determining the orientation of a semiconductor device, which is an embodiment of the present invention, the second part is a diagram of a semiconductor device in the normal orientation, and Fig. 3 is the ejector pin of a semiconductor device in the normal orientation. A video signal waveform diagram of the trace part and the mold part, FIG. 4 is a diagram for a semiconductor device in an abnormal direction, FIG. 5 is a video signal waveform diagram of a mold part of a semiconductor device in an abnormal direction, and FIG. 6 is a diagram of the present invention. FIG. 7 is a flowchart showing the operation of the orientation determination device for a semiconductor device shown in FIG. 1, FIG. 8 is a block diagram of the conventional orientation determination device for a semiconductor device, and FIG. The figure shows a diagram of a semiconductor device in a normal orientation, Figure 1O is a video signal waveform diagram of the ejector pin trace and mold part of a semiconductor device in a normal orientation, and Figure 11 shows a diagram of a semiconductor device in an abnormal orientation. , FIG. 12 is a video signal waveform diagram of the ejector pin trace portion and the mold portion of the semiconductor device in an abnormal direction, and FIG. 13 is a flowchart showing the operation of the semiconductor device orientation determination device of FIG. 8. In the figure, (1, 1 is a photoelectric conversion device, (2) is an inspection range setting section, (3a) (3b) is a brightness detection section, (4) is a brightness comparison section, (5) is an inspection judgment value setting section, (6) indicates the inspection result determination section. In the figures, the same reference numerals indicate the same or corresponding parts. Agent Masuo Oiwa Standard hole wall 2 p3L0L, 3b
l! Month/Lii, t, IP4 Sun/Month/1ptJ'j
-1 Giant 5 Investigation Judgment 4 Village 2 Foot Scale Inspection (SL Published Fixed Scale No. 2 Figure 8 Mold Scale 12 Hands 4 {,!-So! ) ↓Easy @-) to Fukijun 1 review (
Sunny - Case) lI Brightness 15: Useful clothes! Figure 4 A, B, Color C, Beggar, Color, ILL Figure 11 Figure 12 Figure 9 Figure 10 Procedure Amendment 1 (Voluntary) & Contents of Amendment (1) Specification Page 8 Page 18 Correct the line ``minutes and diagrams'' to read ``r minutes as a diagram''. Name of the above invention: Semiconductor device orientation determination device 3; Relationship with the amended case Patent applicant address: 2-2-3 Marunouchi, Chiyoda-ku, Tokyo Name (601) Mamoru Shiki, Representative of Mitsubishi Electric Corporation Ya 4, Agent address Name: Mitsubishi Electric Corporation, 2-2-3 Marunouchi, Chiyoda-ku, Tokyo (7375) Patent attorney Masuo Oiwa

Claims (1)

[Claims] An illumination means for illuminating the surface of a semiconductor device from an oblique direction, a photoelectric conversion means for capturing an image of the surface of the semiconductor device illuminated by the illumination means and an ejector pin mark on the surface and outputting an electric signal, and a direction in which the semiconductor device is normal. and an ejector pin trace inspection range placed so as to switch between the ejector pin trace and the mold part when the direction is abnormal, and an inspection range placed on the mold part in either case or on the ejector pin trace in either case. a brightness detection means for detecting the brightness of the test range set by the test range setting means from the electric signal output from the photoelectric conversion means; a plurality of brightness values obtained by the brightness detection means; brightness comparison means for comparison, inspection judgment value setting means for setting a judgment value for direction determination from the value output by the brightness comparison means, an output of the brightness comparison means and an output of the inspection judgment value setting means. 1. A direction determining device for a semiconductor device, comprising an inspection result determining means for comparing and determining an inspection result.