JPH0470262U - - Google Patents
Info
- Publication number
- JPH0470262U JPH0470262U JP11061890U JP11061890U JPH0470262U JP H0470262 U JPH0470262 U JP H0470262U JP 11061890 U JP11061890 U JP 11061890U JP 11061890 U JP11061890 U JP 11061890U JP H0470262 U JPH0470262 U JP H0470262U
- Authority
- JP
- Japan
- Prior art keywords
- heating plate
- temperature
- temperature heating
- box
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ないし第３図は本考案に係る図面であつ
て、第１図は静置型半田リフロー装置の全体構成
の概略を示す平面図、第２図は箱体の全体構成の
概略を示す斜視図、第３図は中温加熱板および高
温加熱板の全体構成の概略を示す斜視図である。
１……静置型半田リフロー装置、２……箱体、
３……温調装置、３１……冷却板、３２……中温
加熱板、３３……高温加熱板、４……基板。
Figures 1 to 3 are drawings according to the present invention, in which Figure 1 is a plan view schematically showing the overall configuration of a stationary solder reflow apparatus, and Figure 2 is a perspective view schematically showing the overall configuration of the box body. FIG. 3 is a perspective view schematically showing the overall structure of a medium-temperature heating plate and a high-temperature heating plate. 1... Stationary solder reflow device, 2... Box body,
3...Temperature control device, 31...Cooling plate, 32...Medium temperature heating plate, 33...High temperature heating plate, 4...Substrate.
Claims (1)
て、基板に載せられた部品を半田付けするように
なされた装置であつて、 前記基板を静置可能とされた箱体と、冷却板、
中温加熱板および高温加熱板を具備した温調装置
とからなり、この温調装置の冷却板、中温加熱板
および高温加熱板が、前記箱体を構成する構成面
の一面もしくは全面に、切替可能に設けられ、箱
体内の温度雰囲気が調節可能となされたことを特
徴とする静止型半田リフロー装置。[Scope of Claim for Utility Model Registration] A device that is designed to solder components mounted on a board by going through various steps such as preheating, heating, and cooling, which allows the board to stand still. The box body and cooling plate,
It consists of a temperature control device equipped with a medium-temperature heating plate and a high-temperature heating plate, and the cooling plate, medium-temperature heating plate, and high-temperature heating plate of this temperature control device can be switched to one or the entire surface of the constituent surface constituting the box body. A stationary solder reflow device installed in a box, characterized in that the temperature atmosphere inside the box can be adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061890U JPH0470262U (en) | 1990-10-22 | 1990-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11061890U JPH0470262U (en) | 1990-10-22 | 1990-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470262U true JPH0470262U (en) | 1992-06-22 |
Family
ID=31857979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11061890U Pending JPH0470262U (en) | 1990-10-22 | 1990-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470262U (en) |
-
1990
- 1990-10-22 JP JP11061890U patent/JPH0470262U/ja active Pending
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