JPH0472626U - - Google Patents

Info

Publication number
JPH0472626U
JPH0472626U JP1990115413U JP11541390U JPH0472626U JP H0472626 U JPH0472626 U JP H0472626U JP 1990115413 U JP1990115413 U JP 1990115413U JP 11541390 U JP11541390 U JP 11541390U JP H0472626 U JPH0472626 U JP H0472626U
Authority
JP
Japan
Prior art keywords
island
view
electrode
plan
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990115413U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990115413U priority Critical patent/JPH0472626U/ja
Publication of JPH0472626U publication Critical patent/JPH0472626U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す樹脂封止型半導
体装置用リードフレームの平面図、第２図は第１
図のＡ−Ａ線断面図、第３図はダイスサイズが大
きい場合のダイスの実装状態を示す平面図、第４
図は第３図のＢ−Ｂ線断面図、第５図はダイスサ
イズが小さい場合のダイスの実装状態を示す平面
図、第６図は第５図のＣ−Ｃ線断面図、第７図は
ダイスサイズが更に小さい場合のダイスの実装状
態を示す平面図、第８図は第７図のＤ−Ｄ線断面
図、第９図は従来の第１のダイスの実装状態を示
す平面図、第１０図は従来の第２のダイスの実装
状態を示す平面図である。 ２１，３１，４１……アイランド、２２，３２
，４２……ポスト、２３，３３，４３，４３′…
…中間パツド、２４，３４，４４……絶縁層、２
５，３５，４５……開口部、２６，３６，４６…
…導電性ダイスボンド剤、２７，３７，４７……
ダイス、２８，３８，３８′，４８，４８′，４
８″……ワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. アイランド上に絶縁層を介して中間パツドを設
    け、該アイランド上の半導体素子のパツド電極と
    リード電極間を接続するワイヤを前記中間パツド
    にて中継可能にしてなる樹脂封止型半導体装置用
    リードフレーム。
JP1990115413U 1990-11-05 1990-11-05 Pending JPH0472626U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990115413U JPH0472626U (ja) 1990-11-05 1990-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990115413U JPH0472626U (ja) 1990-11-05 1990-11-05

Publications (1)

Publication Number Publication Date
JPH0472626U true JPH0472626U (ja) 1992-06-26

Family

ID=31863181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990115413U Pending JPH0472626U (ja) 1990-11-05 1990-11-05

Country Status (1)

Country Link
JP (1) JPH0472626U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007248064A (ja) * 2006-03-13 2007-09-27 Japan Electronic Materials Corp 半導体素子検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007248064A (ja) * 2006-03-13 2007-09-27 Japan Electronic Materials Corp 半導体素子検査装置

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