JPH0472640U - - Google Patents

Info

Publication number
JPH0472640U
JPH0472640U JP1990116314U JP11631490U JPH0472640U JP H0472640 U JPH0472640 U JP H0472640U JP 1990116314 U JP1990116314 U JP 1990116314U JP 11631490 U JP11631490 U JP 11631490U JP H0472640 U JPH0472640 U JP H0472640U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
heat dissipation
semiconductor chip
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116314U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116314U priority Critical patent/JPH0472640U/ja
Publication of JPH0472640U publication Critical patent/JPH0472640U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1990116314U 1990-11-06 1990-11-06 Pending JPH0472640U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116314U JPH0472640U (cs) 1990-11-06 1990-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116314U JPH0472640U (cs) 1990-11-06 1990-11-06

Publications (1)

Publication Number Publication Date
JPH0472640U true JPH0472640U (cs) 1992-06-26

Family

ID=31864130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116314U Pending JPH0472640U (cs) 1990-11-06 1990-11-06

Country Status (1)

Country Link
JP (1) JPH0472640U (cs)

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