JPH0472640U - - Google Patents

Info

Publication number
JPH0472640U
JPH0472640U JP1990116314U JP11631490U JPH0472640U JP H0472640 U JPH0472640 U JP H0472640U JP 1990116314 U JP1990116314 U JP 1990116314U JP 11631490 U JP11631490 U JP 11631490U JP H0472640 U JPH0472640 U JP H0472640U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
heat dissipation
semiconductor chip
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990116314U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990116314U priority Critical patent/JPH0472640U/ja
Publication of JPH0472640U publication Critical patent/JPH0472640U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】
第１図ａ，ｂ，ｃは本考案の一実施例の断面図
、正面図および側面図、第２図ａ，ｂ，ｃは本考
案の第二の実施例の断面図、正面図および側面図
、第３図ａ，ｂ，ｃは従来の半導体装置の断面図
、正面図および側面図、第４図は従来の絶縁型パ
ツケージの熱分布を示す模式的断面図、第５図は
従来と実施例の絶縁型のパツケージの最大許容損
失（自立）を比較した特性図である。 １，１ａ……半導体チツプマウント用フレーム
、２……半導体チツプ、３……アルミワイヤ、４
……リード、５，５ａ……放熱用フイン、６……
レーザー捺印用領域。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 半導体チツプマウント用フレーム上に半導体
    チツプを配設し、これを樹脂成形し封入して形成
    された半導体装置において、前記樹脂の表面にこ
    の樹脂を用いた放熱用フインが一体成形により形
    成されたことを特徴とする半導体装置。 ２ 半導体チツプマウント用フレームの一部が、
    放熱用フインの内部まで延長されている請求項１
    記載の半導体装置。 ３ 放熱用フインが、ストライプ状に形成された
    請求項１または２記載の半導体装置。
JP1990116314U 1990-11-06 1990-11-06 Pending JPH0472640U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990116314U JPH0472640U (ja) 1990-11-06 1990-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990116314U JPH0472640U (ja) 1990-11-06 1990-11-06

Publications (1)

Publication Number Publication Date
JPH0472640U true JPH0472640U (ja) 1992-06-26

Family

ID=31864130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990116314U Pending JPH0472640U (ja) 1990-11-06 1990-11-06

Country Status (1)

Country Link
JP (1) JPH0472640U (ja)

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