JPH04748U

JPH04748U -

Info

Publication number: JPH04748U
Application number: JP4007590U
Authority: JP
Priority date: 1990-04-13
Filing date: 1990-04-13
Publication date: 1992-01-07

Description

[Brief explanation of the drawing]

第１図は、本考案の一実施例を示すウエハ移し
換え装置の全体斜視図、第２図は、ウエハプツシ
ヤの構成を示す斜視図、第３図は、移し換え時の
動作態様を示す要部側面図、第４図は、従来のウ
エハ移し換え装置の一例を示す斜視図、第５図は
、従来のウエハ移し換え装置の動作説明図である
。１……ウエハアーム、２……ウエハチヤツク、
３……ウエハプツシヤ、４……キヤリア、５……
移載台、１１……ローラ、１１ａ……第１の載置
部、１１ｂ……第２の載置部、２０……第１のチ
ヤツク片、２０ａ……第１のチヤツク面、２０ｂ
……第２のチヤツク面、２１……第２のチヤツク
片、２１ａ……第１のチヤツク面、２１ｂ……第
２のチヤツク面、Ｗ……ウエハ。 Fig. 1 is an overall perspective view of a wafer transfer device showing an embodiment of the present invention, Fig. 2 is a perspective view showing the configuration of a wafer pusher, and Fig. 3 is a main part showing the operation mode during transfer. FIG. 4 is a side view, and FIG. 4 is a perspective view showing an example of a conventional wafer transfer device, and FIG. 5 is an explanatory diagram of the operation of the conventional wafer transfer device. 1...Wafer arm, 2...Wafer chuck,
3... Wafer pusher, 4... Carrier, 5...
Transfer table, 11...roller, 11a...first mounting section, 11b...second mounting section, 20...first chuck piece, 20a...first chuck surface, 20b
...Second chuck surface, 21...Second chuck piece, 21a...First chuck surface, 21b...Second chuck surface, W...Wafer.

Claims

[Claims for Utility Model Registration] (1) A wafer chuck is constructed by arranging a pair of chuck pieces facing each other on the main body of a transfer device, and a wafer stored in a predetermined position is sandwiched between the chuck pieces. In a wafer transfer device configured to transfer a wafer to another position, a plurality of clamping surfaces formed on each of the chuck pieces for clamping the wafer, and a plurality of clamping surfaces selectively facing each other. A wafer transfer apparatus characterized by comprising a holding surface selection mechanism that selects a usage mode according to the wafer to be transferred. (2) A wafer chuck is constructed by arranging a pair of chuck pieces facing each other on the main body of the transfer apparatus, and a wafer pusher is arranged so as to be movable up and down on the transfer table on which the wafers to be transferred are placed, and the wafer pusher is placed in a predetermined position. In the wafer transfer device, the wafer stored in the wafer is pushed upward by the wafer pusher and then transferred to another position by being held between the chuck pieces. a plurality of clamping surfaces formed on each of the wafer pushers; a clamping surface selection mechanism for selectively opposing the plurality of clamping surfaces to use a mode according to the wafer to be transferred; and a clamping surface selection mechanism formed on the upper part of the wafer pusher. A wafer transfer apparatus comprising: a plurality of wafer placement sections; and a wafer placement section selection mechanism that selectively orients each of the wafer placement sections upward in correspondence with the wafers to be transferred.