JPH04759U - - Google Patents
Info
- Publication number
- JPH04759U JPH04759U JP1990040790U JP4079090U JPH04759U JP H04759 U JPH04759 U JP H04759U JP 1990040790 U JP1990040790 U JP 1990040790U JP 4079090 U JP4079090 U JP 4079090U JP H04759 U JPH04759 U JP H04759U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- tab tape
- semiconductor device
- interposed
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990040790U JPH04759U (bs) | 1990-04-16 | 1990-04-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990040790U JPH04759U (bs) | 1990-04-16 | 1990-04-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04759U true JPH04759U (bs) | 1992-01-07 |
Family
ID=31550885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990040790U Pending JPH04759U (bs) | 1990-04-16 | 1990-04-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04759U (bs) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58107659A (ja) * | 1981-12-21 | 1983-06-27 | Seiko Keiyo Kogyo Kk | Ｉｃの実装装置 |
| JPH01280687A (ja) * | 1988-05-06 | 1989-11-10 | Natl Aerospace Lab | カスプ型イオンエンジン |
| JPH0222850A (ja) * | 1988-07-11 | 1990-01-25 | Hitachi Cable Ltd | 半導体装置用のリードフレーム |
-
1990
- 1990-04-16 JP JP1990040790U patent/JPH04759U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58107659A (ja) * | 1981-12-21 | 1983-06-27 | Seiko Keiyo Kogyo Kk | Ｉｃの実装装置 |
| JPH01280687A (ja) * | 1988-05-06 | 1989-11-10 | Natl Aerospace Lab | カスプ型イオンエンジン |
| JPH0222850A (ja) * | 1988-07-11 | 1990-01-25 | Hitachi Cable Ltd | 半導体装置用のリードフレーム |