JPH0476045U - - Google Patents

Info

Publication number
JPH0476045U
JPH0476045U JP1990119705U JP11970590U JPH0476045U JP H0476045 U JPH0476045 U JP H0476045U JP 1990119705 U JP1990119705 U JP 1990119705U JP 11970590 U JP11970590 U JP 11970590U JP H0476045 U JPH0476045 U JP H0476045U
Authority
JP
Japan
Prior art keywords
active metal
ceramic plate
copper
bonded
box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990119705U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990119705U priority Critical patent/JPH0476045U/ja
Publication of JPH0476045U publication Critical patent/JPH0476045U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Description

【図面の簡単な説明】
第１図、第２図はこの高考案一実施例を示す図
、第３図、第４図は従来の高熱伝導性気密パツケ
ージの例を示す図である。１はコバールフレーム
、２はコバールリード、３は貫通孔、４はハーメ
チツクガラス、５はベース、６はろう材、７はネ
ジ止め穴、８は高熱伝導性セラミツク基板、９は
半導体チツプ、１０は銅パターン、１１は銅板、
１２は活性金属層、１３，１４は半田、１５はボ
ンデイングワイヤ、２０は箱型銅ケース、２１は
シールリング、２２はセラミツク板である。なお
、図中同一符号は同一または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 貫通気密端子を有する箱型の銅ケースと、この
    銅ケースの内側底面に一方の面が活性金属接合さ
    れているセラミツク板と、このセラミツク板の他
    方の面に活性金属接合されている銅パターンとで
    構成されていることを特徴とする高熱伝導性気密
    パツケージ。
JP1990119705U 1990-11-15 1990-11-15 Pending JPH0476045U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990119705U JPH0476045U (ja) 1990-11-15 1990-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990119705U JPH0476045U (ja) 1990-11-15 1990-11-15

Publications (1)

Publication Number Publication Date
JPH0476045U true JPH0476045U (ja) 1992-07-02

Family

ID=31867647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990119705U Pending JPH0476045U (ja) 1990-11-15 1990-11-15

Country Status (1)

Country Link
JP (1) JPH0476045U (ja)

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