JPS62145341U - - Google Patents

Info

Publication number
JPS62145341U
JPS62145341U JP1986032802U JP3280286U JPS62145341U JP S62145341 U JPS62145341 U JP S62145341U JP 1986032802 U JP1986032802 U JP 1986032802U JP 3280286 U JP3280286 U JP 3280286U JP S62145341 U JPS62145341 U JP S62145341U
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor chip
metallized layer
ceramic
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986032802U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986032802U priority Critical patent/JPS62145341U/ja
Publication of JPS62145341U publication Critical patent/JPS62145341U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Description

【図面の簡単な説明】
第１図ａは本考案の一実施例のキヤツプなしの
平面図、同図ｂはキヤツプ付きの断面図、第２図
ａは従来の半導体装置のキヤツプなしの平面図、
同図ｂはキヤツプ付きの断面図である。 １…セラミツク基板、２Ｓ，２Ｄ，２Ｇ…メタ
ライズ層、４…ＦＥＴチツプ、５…ボンデイング
ワイヤ、６，１６…外部リード、７，１７…キヤ
ツプ、８，９…金―スズソルダ、１１…セラミツ
ク基体、１２，１３，１４…メタライズ層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 上面に複数個のメタライズ層の形成されたセラ
    ミツク基板と、このセラミツク基板のほぼ中央上
    面に固着された半導体チツプと、この半導体チツ
    プの電極と前記メタライズ層との間に接続された
    ボンデイングワイヤと、一端側が前記セラミツク
    基板の下面に沿つて形成され、かつ、前記メタラ
    イズ層とスルーホールを通して接続された外部リ
    ードと、前記セラミツク基板の周辺に気密に接合
    されたセラミツクキヤツプとを含むことを特徴と
    する半導体装置。
JP1986032802U 1986-03-06 1986-03-06 Pending JPS62145341U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986032802U JPS62145341U (ja) 1986-03-06 1986-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986032802U JPS62145341U (ja) 1986-03-06 1986-03-06

Publications (1)

Publication Number Publication Date
JPS62145341U true JPS62145341U (ja) 1987-09-12

Family

ID=30839825

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986032802U Pending JPS62145341U (ja) 1986-03-06 1986-03-06

Country Status (1)

Country Link
JP (1) JPS62145341U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121256A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Ceramic multilayer wiring structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121256A (en) * 1981-01-21 1982-07-28 Hitachi Ltd Ceramic multilayer wiring structure

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