JPH0476331B2 - - Google Patents

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Publication number
JPH0476331B2
JPH0476331B2 JP22480088A JP22480088A JPH0476331B2 JP H0476331 B2 JPH0476331 B2 JP H0476331B2 JP 22480088 A JP22480088 A JP 22480088A JP 22480088 A JP22480088 A JP 22480088A JP H0476331 B2 JPH0476331 B2 JP H0476331B2
Authority
JP
Japan
Prior art keywords
silicon
silicon carbide
filter
molten
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22480088A
Other languages
Japanese (ja)
Other versions
JPH0274513A (en
Inventor
Takashi Suhara
Kenkichi Yushimo
Yasuhiko Sakaguchi
Makoto Fukai
Matao Araya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
Original Assignee
Kawasaki Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Steel Corp filed Critical Kawasaki Steel Corp
Priority to JP22480088A priority Critical patent/JPH0274513A/en
Publication of JPH0274513A publication Critical patent/JPH0274513A/en
Publication of JPH0476331B2 publication Critical patent/JPH0476331B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】[Detailed description of the invention]

(産業上の利用分野) この発明は、太陽電池などに用いられるけい素
を、高純度シリカを高純度炭素によつて還元して
製造する際に、溶融けい素中に混在する炭化けい
素を迅速に除去することのできる溶融けい素中の
炭化けい素の除去方法に関するものである。 近年、太陽電池用のけい素を安価に製造する方
法として、例えば特開昭61−117110号公報に開示
されているように高純度シリカを高純度炭素によ
つて還元する方法が開発されている。 このような炭素を還元剤として用いるけい素の
製造方法では、得られたけい素中に必然的に炭素
成分が混在してしまう。例えば上掲特開昭61−
117110号公報の還元炉で製造されたけい素中に
は、500〜5000wt ppmの炭素成分が含まれてい
る。 このため得られたけい素を精製してけい素中の
炭素成分を除く必要がある。 この炭素成分のうち、溶存炭素Cに関しては、
溶融けい素に減圧処理又は酸素供給を行つて、C
+O→CO↑の反応を促進させ、COガスとして除
去する方法が有効である。しかし炭素と化合し析
出している炭素成分:炭化けい素(SiC)に関し
ては、減圧処理及び酸素供給を行つてもそれほど
効果はない。 この減圧処理、酸素供給の処理温度1500〜1600
℃では、ほとんどの炭素は、炭化けい素として溶
融けい素中に存在するので、前処理で炭化けい素
を除去する必要がある。 (従来の技術) 溶融けい素から、SiO2及びSiCのような固体反
応生成物を分離するために、特開昭60−239317号
公報では、溶融けい素を加熱されたSiC/Si複合
材料からなる層を通じて濾過し、高純度の黒鉛型
中に受け、方向性凝固を行う方法が提案されてい
る。 (発明が解決しようとする課題) 上述した特開昭60−239317号公報に開示の方法
ではフイルタ内に、けい素の流路径が3〜10μm
以下の層があり、従つてけい素の通過速度を著し
く低下させ、処理時間がかかるために高コストの
処理方法となつてしまう問題があつた。 この発明は、このような問題を有利に解決する
もので、溶融けい素中の炭化けい素を効率良く除
去し、短時間に多量のけい素を処理することので
きる溶融けい素中の炭化けい素の除去方法を提案
することを目的とする。 (課題を解決するための手段) 特開昭60−239317号公報では、効果的な濾過を
行うためには、流路径が3μm以下であることが
必要とされているが、発明者らが詳細に実験を行
つてみたところ、溶融けい素中の炭化けい素の除
去にあたつては、濾過処理の初期にフイルタ上に
けい素と炭化けい素との混合層(ケーク層)が形
成され、それ以後に処理される溶融けい素中の炭
化けい素は、その層上又は層内に捕捉されること
から流路径が10μm以上のフイルタを用いて炭化
けい素の除去を効果的に行い得ることが判明し
た。また、一般の表面濾過とは違つてケーク層に
よる目詰まりも起こらず、このため溶融けい素の
処理量により処理速度の変化は、ほとんどないこ
とも併せて判明した。 この発明は、上記の知見に立脚するものであ
る。すなわちこの発明は、シリカを炭素で還元し
て得られた溶融けい素中の炭化けい素の除去にあ
たり、流路径が10μm〜20mmのフイルタに溶融け
い素を通過させてフイルタ上に炭化けい素のケー
ク層を形成させる段階を経て、このケーク層にて
炭化けい素を捕捉し、溶融けい素から炭化けい素
を分離することを特徴とする溶融けい素中の炭化
けい素の除去方法である。 ここにフイルタの材質としては、石英、黒鉛、
炭化けい素及び窒化けい素のうち1種又は2種以
上が有利に適合する。 (作用) 第1図に濾過処理を中断し、ケークを凝固させ
て断面を見た場合のケークの固体状態を示す。1
は〓間、2はけい素、3は堆積した炭化けい素で
ある。同図のようなケークが、溶融けい素の濾過
の際にフイルタ上に形成されることから、流路径
が10μm以上のフイルタを使用して処理すること
により、処理速度が大きい濾過を実現できるので
ある。 第2図に、この発明の方法に有利な濾過装置を
示す。 フイルタ7は、石英粒、炭化けい素粒、炭化け
い素ペレツトなどの充填層、また石英、黒鉛など
の目皿などが適合する。さらに第3図に示すよう
に、処理容器5の底壁に孔を設けることによつて
もフイルタ7の代わりに使用できる。 フイルタ7の素材としては、けい素を汚染しな
い物質(C,O,Si,Nを主成分とする物質)
で、かつ1410℃以上の処理温度で変形、劣化しな
い物質であれば使用可能である。このことは、処
理容器5の素材に関しても同じことが言える。 フイルタ7の処理容器5の流路径は、ケーク層
がフイルタ上に形成される程度に小さい必要があ
る。処理するけい素の炭素濃度、除去すべき炭化
けい素の粒径、流路の数などによつて変化する
が、流路径を20mm以下とするほうがケークは形成
されやすい。また溶融けい素の通過の容易にする
ためには、流路径を10μm以上とすることが望ま
しい。従つてこの発明では、流路径を10μm〜20
mmの範囲とする。 第4図に、フイルタ厚さと濾過後の炭素濃度と
の関係を示す。同図から明らかなように、フイル
タを厚くしても濾過効率はそれほど変化しないの
でフイルタ厚さは100mm以下にして処理速度を上
げることが有利であり、フイルタの種類にもよる
が、40mm程度あれば十分で、小径のフイルタの場
合は5〜10mmのフイルタ厚さでもよい。 フイルタをそなえた処理容器に溶融けい素を注
入して濾過する際に、溶融けい素を1410〜1550℃
の温度範囲に保持することが望ましい。保持温度
が1410℃に満たないと溶融けい素が凝固しフイル
タを通過しなくなり、一方1550℃以上では容器お
よび炭化けい素中の炭素が溶融けい素中に溶解す
る量が多く純度を低下させるからである。低下さ
せるからである。 (実施例) 第2図及び第3図に示すような、種々の流路径
のフイルタを有する濾過装置内に、炭素濃度
500wt ppmの溶融けい素を注入し、処理容器5
中の溶融けい素の温度を1450℃に保持しつつ濾過
操業を行つた。 表1に、各流路径を持つフイルタ及び容器で処
理した際の1時間での処理量及び処理後の炭素濃
度を示す。
(Industrial Application Field) This invention is aimed at reducing silicon carbide mixed in molten silicon when producing silicon used in solar cells etc. by reducing high purity silica with high purity carbon. The present invention relates to a method for quickly removing silicon carbide from molten silicon. In recent years, a method of reducing high-purity silica with high-purity carbon has been developed as a method for manufacturing silicon for solar cells at low cost, for example, as disclosed in JP-A-61-117110. . In such a silicon manufacturing method using carbon as a reducing agent, a carbon component is inevitably mixed in the obtained silicon. For example, the above-mentioned JP-A-61-
The silicon produced in the reduction furnace of Publication No. 117110 contains a carbon component of 500 to 5000 wt ppm. For this reason, it is necessary to refine the obtained silicon to remove carbon components from the silicon. Among these carbon components, regarding dissolved carbon C ,
By performing depressurization treatment or supplying oxygen to molten silicon, C
An effective method is to promote the reaction of + O → CO↑ and remove it as CO gas. However, with regard to silicon carbide (SiC), which is a carbon component that is combined with carbon and precipitated, even reduced pressure treatment and oxygen supply do not have much effect. This depressurization treatment, oxygen supply treatment temperature 1500-1600
℃, most of the carbon is present in the molten silicon as silicon carbide, so it is necessary to remove the silicon carbide in a pretreatment. (Prior art) In order to separate solid reaction products such as SiO 2 and SiC from molten silicon, JP-A-60-239317 discloses that molten silicon is separated from a heated SiC/Si composite material. A method has been proposed in which carbon dioxide is filtered through a layer of carbon dioxide, placed in a high-purity graphite mold, and directional solidified. (Problems to be Solved by the Invention) In the method disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 60-239317, the diameter of the silicon flow path is 3 to 10 μm in the filter.
There are the following layers, which significantly reduces the passage speed of silicon and requires a long processing time, resulting in a high-cost processing method. The present invention advantageously solves these problems, and is capable of efficiently removing silicon carbide from molten silicon and processing a large amount of silicon in a short period of time. The purpose of this study is to propose a method for removing elements. (Means for Solving the Problems) According to Japanese Patent Application Laid-open No. 60-239317, in order to perform effective filtration, the channel diameter must be 3 μm or less. When we conducted an experiment, we found that when removing silicon carbide from molten silicon, a mixed layer (cake layer) of silicon and silicon carbide is formed on the filter at the beginning of the filtration process. Since silicon carbide in the molten silicon that is subsequently processed is trapped on or within the layer, silicon carbide can be effectively removed using a filter with a flow path diameter of 10 μm or more. There was found. It was also found that unlike general surface filtration, clogging due to a cake layer does not occur, and therefore there is almost no change in processing speed depending on the amount of molten silicon processed. This invention is based on the above knowledge. That is, in removing silicon carbide from molten silicon obtained by reducing silica with carbon, this invention passes the molten silicon through a filter with a channel diameter of 10 μm to 20 mm, and deposits silicon carbide on the filter. This method of removing silicon carbide from molten silicon is characterized by forming a cake layer, trapping silicon carbide in this cake layer, and separating silicon carbide from molten silicon. Here, the filter materials include quartz, graphite,
One or more of silicon carbide and silicon nitride are advantageously suitable. (Function) FIG. 1 shows the solid state of the cake when the filtration process is interrupted and the cake is solidified and a cross section is viewed. 1
2 is silicon, and 3 is deposited silicon carbide. Since a cake like the one shown in the figure is formed on the filter when molten silicon is filtered, filtration with a high processing speed can be achieved by using a filter with a flow path diameter of 10 μm or more. be. FIG. 2 shows a filtration device advantageous for the method of the invention. For the filter 7, a packed layer of quartz grains, silicon carbide grains, silicon carbide pellets, etc., a perforated plate of quartz, graphite, etc. are suitable. Furthermore, as shown in FIG. 3, the filter 7 can also be used by providing holes in the bottom wall of the processing container 5. The material for the filter 7 is a substance that does not contaminate silicon (a substance whose main components are C, O, Si, and N).
Any material can be used as long as it does not deform or deteriorate at processing temperatures of 1410°C or higher. The same can be said of the material of the processing container 5. The flow path diameter of the processing container 5 of the filter 7 needs to be small enough to form a cake layer on the filter. Although it varies depending on the carbon concentration of the silicon to be treated, the particle size of the silicon carbide to be removed, the number of channels, etc., cake is more likely to form if the channel diameter is 20 mm or less. Further, in order to facilitate the passage of molten silicon, it is desirable that the diameter of the channel be 10 μm or more. Therefore, in this invention, the flow path diameter is set to 10 μm to 20 μm.
The range is mm. FIG. 4 shows the relationship between filter thickness and carbon concentration after filtration. As is clear from the figure, the filtration efficiency does not change much even if the filter is thickened, so it is advantageous to increase the processing speed by keeping the filter thickness at 100 mm or less. In the case of a small diameter filter, a filter thickness of 5 to 10 mm may be sufficient. When pouring molten silicon into a processing container equipped with a filter and filtering it, the temperature of the molten silicon is 1410 to 1550℃.
It is desirable to maintain the temperature within the range of . If the holding temperature is lower than 1410℃, the molten silicon will solidify and will not pass through the filter, while if it is higher than 1550℃, a large amount of carbon in the container and silicon carbide will dissolve into the molten silicon, reducing purity. It is. This is because it reduces the (Example) As shown in FIGS. 2 and 3, carbon concentration was
Inject 500wt ppm of molten silicon into processing vessel 5.
Filtration operation was carried out while maintaining the temperature of the molten silicon inside at 1450°C. Table 1 shows the amount of treatment in one hour and the carbon concentration after treatment when treated with filters and containers having various flow path diameters.

【表】 また、第5図に流路径10mmの孔を持つ処理容器
(実施例2)と流路径3μmのフイルタ(比較例
1)を用いた場合の処理量の経時変化を示す。 表1及び第5図から、この発明に従う実施例1
〜6は、十分な処理量が得られ、比較例1の約1/
100という短時間で炭化けいを除去できることが
わかる。また、処理後に炭素濃度は比較例1より
やや高めとなつて後工程での脱炭に時間がかかる
としても全工程での時間は短縮される。 (発明の効果) この発明によれば、溶融けい素中の炭化けい素
を、従来のほぼ1/100の短時間で除去することが
でき、低コストで太陽電池等に用いられる高純度
けい素を製造することができる。
[Table] Furthermore, Fig. 5 shows the change over time in the throughput when a processing container with holes with a flow path diameter of 10 mm (Example 2) and a filter with a flow path diameter of 3 μm (Comparative Example 1) were used. From Table 1 and FIG. 5, Example 1 according to the present invention
- 6, a sufficient throughput was obtained and was about 1/1 of that of Comparative Example 1.
It can be seen that silicon carbide can be removed in a short time of 100%. Further, even though the carbon concentration after treatment is slightly higher than that of Comparative Example 1 and decarburization in the subsequent process takes time, the time required for the entire process is shortened. (Effects of the Invention) According to the present invention, silicon carbide in molten silicon can be removed in a short time approximately 1/100 of the conventional method, and high-purity silicon used in solar cells etc. can be removed at low cost. can be manufactured.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、ケークの拡大(2.5倍)顕微鏡写真
スケツチ図、第2図は、この発明に従う濾過装置
の断面図、第3図は、この発明に従う処理容器の
断面図、第4図は、フイルタ厚さと濾過後の炭素
濃度との関係を示すグラフ、第5図は、流路径に
よる処理速度の違いを示すグラフである。 1…〓間、2…けい素、3…炭化けい素、4…
けい素融液、5…容器、6…ケーク、7…フイル
タ、8…加熱コイル。
Fig. 1 is an enlarged (2.5x) microphotograph sketch of a cake, Fig. 2 is a cross-sectional view of a filtration device according to the present invention, Fig. 3 is a cross-sectional view of a processing container according to the present invention, and Fig. 4 is a FIG. 5 is a graph showing the relationship between filter thickness and carbon concentration after filtration, and is a graph showing differences in processing speed depending on the channel diameter. 1... = between, 2... silicon, 3... silicon carbide, 4...
Silicon melt, 5...container, 6...cake, 7...filter, 8...heating coil.

Claims (1)

【特許請求の範囲】 1 シリカを炭素で還元して得られた溶融けい素
中の炭化けい素の除去にあたり、 流路径が10μm〜20mmのフイルタに溶融けい素
を通過させてフイルタ上に炭化けい素のケーク層
を形成させる段階を経て、 このケーク層にて炭化けい素を捕捉し、溶融け
い素から炭化けい素を分離する ことを特徴とする溶融けい素中の炭化けい素の除
去方法。 2 フイルタが、石英、黒鉛、炭化けい素及び窒
化けい素のうちの1種又は2種以上である請求項
1記載の溶融けい素中の炭化けい素の除去方法。
[Claims] 1. In removing silicon carbide from molten silicon obtained by reducing silica with carbon, the molten silicon is passed through a filter with a channel diameter of 10 μm to 20 mm, and silicon carbide is deposited on the filter. A method for removing silicon carbide from molten silicon, which comprises a step of forming a plain cake layer, capturing silicon carbide in this cake layer, and separating the silicon carbide from the molten silicon. 2. The method for removing silicon carbide from molten silicon according to claim 1, wherein the filter is one or more of quartz, graphite, silicon carbide, and silicon nitride.
JP22480088A 1988-09-09 1988-09-09 Method for removing silicon carbide in molten silicon Granted JPH0274513A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22480088A JPH0274513A (en) 1988-09-09 1988-09-09 Method for removing silicon carbide in molten silicon

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22480088A JPH0274513A (en) 1988-09-09 1988-09-09 Method for removing silicon carbide in molten silicon

Publications (2)

Publication Number Publication Date
JPH0274513A JPH0274513A (en) 1990-03-14
JPH0476331B2 true JPH0476331B2 (en) 1992-12-03

Family

ID=16819401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22480088A Granted JPH0274513A (en) 1988-09-09 1988-09-09 Method for removing silicon carbide in molten silicon

Country Status (1)

Country Link
JP (1) JPH0274513A (en)

Also Published As

Publication number Publication date
JPH0274513A (en) 1990-03-14

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