JPH04765U - - Google Patents

Info

Publication number
JPH04765U
JPH04765U JP1990039088U JP3908890U JPH04765U JP H04765 U JPH04765 U JP H04765U JP 1990039088 U JP1990039088 U JP 1990039088U JP 3908890 U JP3908890 U JP 3908890U JP H04765 U JPH04765 U JP H04765U
Authority
JP
Japan
Prior art keywords
light emitting
microlens
emitting device
optical filter
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990039088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990039088U priority Critical patent/JPH04765U/ja
Publication of JPH04765U publication Critical patent/JPH04765U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Description

【図面の簡単な説明】
第１図はこの考案の一実施例である半導体発光
装置の側面図、第２図は第１図の半導体発光装置
のスペクトル特性曲線図、第３図は従来の発光ダ
イオードの側面図、第４図は第３図の発光ダイオ
ードのスペクトル特性曲線図である。 図において、１……ヘツダー、２……サブマウ
ント、３……発光ダイオードチツプ、４……マイ
クロレンズ、５……リード端子、６……Ａｕワイ
ヤ、７……光フイルター膜を示す。なお、図中、
同一符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. マイクロレンズを光出射面に装着した半導体発
    光装置において、前記マイクロレンズに光フイル
    ター機能に持たせた事を特徴とする半導体発光装
    置。
JP1990039088U 1990-04-11 1990-04-11 Pending JPH04765U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990039088U JPH04765U (ja) 1990-04-11 1990-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990039088U JPH04765U (ja) 1990-04-11 1990-04-11

Publications (1)

Publication Number Publication Date
JPH04765U true JPH04765U (ja) 1992-01-07

Family

ID=31547680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990039088U Pending JPH04765U (ja) 1990-04-11 1990-04-11

Country Status (1)

Country Link
JP (1) JPH04765U (ja)

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