JPH0476908A - Laminated ceramic capacitor - Google Patents
Laminated ceramic capacitorInfo
- Publication number
- JPH0476908A JPH0476908A JP19125590A JP19125590A JPH0476908A JP H0476908 A JPH0476908 A JP H0476908A JP 19125590 A JP19125590 A JP 19125590A JP 19125590 A JP19125590 A JP 19125590A JP H0476908 A JPH0476908 A JP H0476908A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- copper
- ceramic
- melting point
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 10
- 239000000843 powder Substances 0.000 claims abstract description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 7
- 239000011162 core material Substances 0.000 claims abstract description 5
- 239000002904 solvent Substances 0.000 claims abstract description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 6
- 230000032798 delamination Effects 0.000 abstract description 5
- 229910002113 barium titanate Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は積層セラミックコンデンサの内部を極の改良に
間する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is directed to improving the internal poles of a multilayer ceramic capacitor.
従来の技術
従来の積層セラミックコンデンサは、セラミックグリー
ンシートの表面に内部’に％を印刷塗布して誘電体シー
トを作り、この誘電体シートを複数枚積層し、熱圧着し
て一体化後、所定寸法に切断加工してコンデンサ素子を
作製し、この素子を焼成した後外部電極を形成してコン
デンサを製作している。Conventional technology Conventional multilayer ceramic capacitors are made by printing and coating the inside of a ceramic green sheet to create a dielectric sheet, then laminating multiple dielectric sheets, bonding them together by thermocompression, and then forming them into a predetermined shape. A capacitor element is produced by cutting to size, and after firing this element, external electrodes are formed to produce a capacitor.
この内部電極を形成するための印刷用インク状ペースト
には銅粉末と有機ビヒクルと溶剤とからなる導電性ペー
ストを用いている。高周波特性はニッケル粉や銀／パラ
ジウム合金粉を用いたベストに比べ改良された。しかし
銅の融点が１０８３ ’Ｃであるため、１０８３”Ｃ未
満で焼成するセラミック誘電体粉には適用することがで
きなかった。A conductive paste made of copper powder, an organic vehicle, and a solvent is used as the printing ink paste for forming the internal electrodes. The high frequency characteristics are improved compared to vests using nickel powder or silver/palladium alloy powder. However, since the melting point of copper is 1083'C, it could not be applied to ceramic dielectric powder fired at less than 1083''C.
発明が解決しようとする課題
従来、内部ｔ ［ｉのペーストとして銅粉ペーストを使
用する場合は、銅の融点２２上の焼成温度か必要なセラ
ミック誘電体粉に適用すると、焼成中に銅粉が溶融して
膨脂し、セラミック誘電体層間を剥離する力を生じ、層
内剥離（デラミネーション）不良を発生する重大要因と
なっていた。Problems to be Solved by the Invention Conventionally, when copper powder paste is used as the paste for internal It melts and swells, creating a force that causes the ceramic dielectric layers to peel off, which is a major factor in causing delamination defects.
課題を解決するための手段
本発明は１２００°Ｃまでの焼成温度を有するセラミン
ク誘電体にも適用でき、かつ高周波特性の優れたコンデ
ンサを提供しようとするものである。Means for Solving the Problems The present invention aims to provide a capacitor that can be applied to ceramic dielectrics having a firing temperature of up to 1200°C and has excellent high frequency characteristics.
本発明の積層セラミンクコンデンサは、セラミック誘電
体層上に内部電極を形成する誘電体シートにおいて、こ
の内部！極として芯材に銅より融点の高い金属の粉末を
用い、この金属粉の表面を銅で被覆した導電性金属粉と
有機ビヒクル及び溶射とからなる印刷用インク状ペース
トを用いることを特徴とする。The multilayer ceramic capacitor of the present invention has a dielectric sheet that forms internal electrodes on a ceramic dielectric layer. It is characterized by using a metal powder with a higher melting point than copper for the core material as the electrode, and using an ink-like paste for printing consisting of a conductive metal powder whose surface is coated with copper, an organic vehicle, and thermal spraying. .
また、導電性金属として、芯材に銅粉１６を用い、この
銅粉の表面に銅より融点の高い金属１７でコートしたら
のも用いられる。Further, as a conductive metal, a copper powder 16 may be used as a core material, and the surface of the copper powder may be coated with a metal 17 having a higher melting point than copper.
作用
従来の銅粉を用いたものに対し、本発明はセラミック誘
電体に対する銅の相対的な体積が減少するので、溶融膨
張量が押えられ、デラミネーションの発生を防ぐことが
できる。Function: Compared to the conventional method using copper powder, in the present invention, the relative volume of copper to the ceramic dielectric is reduced, so the amount of melt expansion is suppressed and the occurrence of delamination can be prevented.
実施例 本発明の実施例を図面に基づき説明する。Example Embodiments of the present invention will be described based on the drawings.
セラミック誘電体としてＢａＴｉＯ３９５％以上からな
るセラミック粉を用い厚さ３０μｍのグリーンシート１
１を製作する。このシート１１の表面に平均粒径１μｍ
の高融点金属粉に平均００８μｍ厚の銅層１３を被覆し
た導電性金属粉１４を５２重量パーセントー有機ビヒク
ル４８重量パーセントを用い、よく混練し、溶削を加え
て粘度１２０ボイズに調整した内部を極印開用インク状
ペースト１４を印刷塗布し、誘電体シート１５をうる。A green sheet 1 with a thickness of 30 μm using ceramic powder consisting of 395% or more of BaTiO as a ceramic dielectric material.
Produce 1. The surface of this sheet 11 has an average particle size of 1 μm.
A conductive metal powder 14 coated with a copper layer 13 having an average thickness of 0.08 μm is thoroughly kneaded using a high melting point metal powder of 52% by weight and an organic vehicle of 48% by weight. An ink-like paste 14 for opening the pole mark is applied by printing, and a dielectric sheet 15 is obtained.
この誘電体シート１５を複数枚積層して定格５０ｖ、０
．１μＦの積層セラミックコンデンサ素子を製作し、３
００ ’Ｃで脱脂した後、焼成温度１１５０’Ｃ２１２
００℃、１２５０℃の３種類のものを作った。A plurality of these dielectric sheets 15 are laminated to give a rating of 50V and 0V.
．． Fabricate a 1 μF multilayer ceramic capacitor element, and
After degreasing at 00'C, firing temperature 1150'C212
Three types were made: 00℃ and 1250℃.
この結果、１２５０ ”Ｃで焼成したものにはデラミネ
ルジョンか発生したが、１１５０″Ｃと１２００°Ｃで
焼成したものにはデラミネーションは発生しなかった。As a result, delamination occurred in those fired at 1250"C, but no delamination occurred in those fired at 1150"C and 1200°C.
高周波特性について同時に作製したニッケル粉ペースト
及び銀／パラジウム合金粉ペーストで内部電極を形成し
た同定格の積層セラミックコンデンサのインピーダンス
を比較した。その結果は、９Ｍ／パラジウムペーストを
用いた場合のインピーダンスを１００としたとき、５０
０ＭＨｚではニッケル粉９０、銅コーテイング高融点金
属粉は８０と低く、銅より高融点の金属粉としては銅と
の反え性、コストなどの点から、Ｃｒ−Ｍｎ−Ｆｅ、Ｃ
０１ＮｉがＩｋも望ましいものであることがわかった。Regarding high frequency characteristics, we compared the impedance of multilayer ceramic capacitors with the same rating, in which internal electrodes were formed using nickel powder paste and silver/palladium alloy powder paste, which were simultaneously produced. The results show that when the impedance when using 9M/palladium paste is 100, 50
At 0 MHz, nickel powder is 90, and copper coating high melting point metal powder is low at 80. Metal powders with higher melting points than copper are Cr-Mn-Fe, C
It has been found that 01Ni is also desirable for Ik.
発明の効果
本発明のコンデンサは、以上に述べた如き構成のもので
、従来公知の銀／パラジウムペーストを内部Ｓ極として
用いたものに対し、５００ＭＨｚの高周波におけるイン
ピーダンス値か本発明品は８５％と低い値を持つもので
、かつ、１２００°Ｃまでの焼成温度領域のセラミック
誘電体粉に適用することができる導電性ペーストをうろ
ことができた。Effects of the Invention The capacitor of the present invention has the configuration as described above, and the impedance value at a high frequency of 500 MHz is 85% lower than that of the conventional capacitor using silver/palladium paste as the internal S pole. We were able to find a conductive paste that has a low value of 1200°C and can be applied to ceramic dielectric powder in the firing temperature range up to 1200°C.
第１図は本発明の斜視図、箪２図はグリーンシトにペー
ストを塗布した状態を示す正面図、第３図は誘電体シー
トの正面図である。
１１・・・グリーンシート、 １２・・・銅コート、
１３・・・金属粉、 １４・・・ペースト、１５・・
・誘電体シート。
特許出願人 日立コンデンサ株式会社FIG. 1 is a perspective view of the present invention, FIG. 2 is a front view showing a state in which a paste is applied to a green sheet, and FIG. 3 is a front view of a dielectric sheet. 11...Green sheet, 12...Copper coat,
13...Metal powder, 14...Paste, 15...
・Dielectric sheet. Patent applicant Hitachi Capacitor Co., Ltd.
Claims (2)
体シートを複数枚積層してなる積層セラミックコンデン
サにおいて、この内部電極として芯材を銅より融点の高
い金属粉を用い、この金属粉の表面に銅層を形成した導
電性金属粉と有機ビヒクル及び溶剤とからなる印刷用イ
ンク状ペーストを用いることを特徴とする積層セラミッ
クコンデンサ。(1) In a multilayer ceramic capacitor made by laminating multiple dielectric sheets with internal electrodes formed on a ceramic dielectric layer, a metal powder with a higher melting point than copper is used as the core material for the internal electrodes. A multilayer ceramic capacitor characterized by using a printing ink-like paste consisting of conductive metal powder with a copper layer formed on its surface, an organic vehicle, and a solvent.
、この銅粉の表面を融点の高い金属で被覆した導電性金
属粉を用いてなる積層セラミックコンデンサ。(2) A multilayer ceramic capacitor formed by using conductive metal powder in which the core material is copper powder and the surface of the copper powder is coated with a metal having a high melting point, as the internal electrode according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19125590A JPH0476908A (en) | 1990-07-19 | 1990-07-19 | Laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19125590A JPH0476908A (en) | 1990-07-19 | 1990-07-19 | Laminated ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476908A true JPH0476908A (en) | 1992-03-11 |
Family
ID=16271497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19125590A Pending JPH0476908A (en) | 1990-07-19 | 1990-07-19 | Laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476908A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999038176A1 (en) * | 1998-01-22 | 1999-07-29 | Matsushita Electric Industrial Co., Ltd. | Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device |
-
1990
- 1990-07-19 JP JP19125590A patent/JPH0476908A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999038176A1 (en) * | 1998-01-22 | 1999-07-29 | Matsushita Electric Industrial Co., Ltd. | Ink for electronic component, method for producing electronic component by using the ink for electronic component, and ink-jet device |
| US6487774B1 (en) | 1998-01-22 | 2002-12-03 | Matsushita Electric Industrial Co., Ltd. | Method of forming an electronic component using ink |
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