JPH04776U - - Google Patents
Info
- Publication number
- JPH04776U JPH04776U JP3980490U JP3980490U JPH04776U JP H04776 U JPH04776 U JP H04776U JP 3980490 U JP3980490 U JP 3980490U JP 3980490 U JP3980490 U JP 3980490U JP H04776 U JPH04776 U JP H04776U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- terminal
- connection structure
- conductive layer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010030 laminating Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
第１図は本考案の一実施例である液晶表示装置
の平面図、第２図は４層基板の断面図、第３図は
コモン基板７の構成を示す拡大断面図、第４図は
本考案の他の実施例における４層基板の斜視図、
第５図は従来の液晶表示装置の平面図である。
１……液晶表示装置、２……液晶表示パネル、
３……セグメントＴＡＢＬＳＩ、４……セグメン
ト基板、５……セグメント基板、６……コモンＴ
ＡＢＬＳＩ、７……コモン基板、８……銅箔、９
……プリプレグ、１０……銅箔、１１……硬質基
板、１２……銅箔、１３……プリプレグ、１４…
…銅箔、１５……シールド層、１６……４層基板
。
FIG. 1 is a plan view of a liquid crystal display device that is an embodiment of the present invention, FIG. 2 is a cross-sectional view of a four-layer board, FIG. 3 is an enlarged cross-sectional view showing the configuration of the common board 7, and FIG. A perspective view of a four-layer board in another embodiment of the invention,
FIG. 5 is a plan view of a conventional liquid crystal display device. 1...Liquid crystal display device, 2...Liquid crystal display panel,
3...Segment TABLSI, 4...Segment board, 5...Segment board, 6...Common T
ABLSI, 7... Common board, 8... Copper foil, 9
... Prepreg, 10 ... Copper foil, 11 ... Hard substrate, 12 ... Copper foil, 13 ... Prepreg, 14 ...
...Copper foil, 15...Shield layer, 16...4-layer board.
Claims (1)
子が形成された第２回路基板とを接続する回路基
板の接続構造において、 第２回路基板は、それぞれ絶縁層を介して、３
層以上の導電層を順次積層して形成され、該導電
層に第２端子が形成されていることを特徴とする
回路基板の接続構造。[Claims for Utility Model Registration] In a circuit board connection structure that connects a first circuit board on which a first terminal is formed and a second circuit board on which a second terminal is formed, each of the second circuit boards 3 through an insulating layer
1. A connection structure for a circuit board, characterized in that it is formed by sequentially laminating more than one conductive layer, and a second terminal is formed on the conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3980490U JPH04776U (en) | 1990-04-13 | 1990-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3980490U JPH04776U (en) | 1990-04-13 | 1990-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04776U true JPH04776U (en) | 1992-01-07 |
Family
ID=31549034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3980490U Pending JPH04776U (en) | 1990-04-13 | 1990-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04776U (en) |
-
1990
- 1990-04-13 JP JP3980490U patent/JPH04776U/ja active Pending
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