JPH0479417U - - Google Patents
Info
- Publication number
- JPH0479417U JPH0479417U JP12131490U JP12131490U JPH0479417U JP H0479417 U JPH0479417 U JP H0479417U JP 12131490 U JP12131490 U JP 12131490U JP 12131490 U JP12131490 U JP 12131490U JP H0479417 U JPH0479417 U JP H0479417U
- Authority
- JP
- Japan
- Prior art keywords
- wafer stage
- wafer
- reduction lens
- foreign matter
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 5
Description
第１図は本考案実施例の作用部位、又、他の間
連部位の縮小投影露光装置概略構成正面図、第２
図は本考案実施例の作用機能正面図、第３図は本
考案実施例の異物保護膜付フレームの正面および
平面を示す図である。
１……照明系、２……レテイクル原画、３……
縮小レンズ、４……ウエハステージ、５……ウエ
ハ保持台、６……ウエハ、７……自動焦点機構、
８……レンズ、９……自動焦点機構、１０……異
物保護膜付フレーム、１１……ウエハ、１２……
ウエハステージ、１３……異物保護膜付フレーム
、１４……異物保護膜。
FIG. 1 is a front view of the schematic configuration of a reduction projection exposure apparatus of the working part of the embodiment of the present invention and other interlocking parts;
The figure is a functional front view of the embodiment of the present invention, and FIG. 3 is a front and plan view of the frame with a foreign matter protection film of the embodiment of the present invention. 1...Lighting system, 2...Reticle original picture, 3...
Reduction lens, 4... wafer stage, 5... wafer holding stand, 6... wafer, 7... automatic focus mechanism,
8... Lens, 9... Automatic focus mechanism, 10... Frame with foreign matter protective film, 11... Wafer, 12...
Wafer stage, 13...frame with foreign matter protective film, 14... foreign matter protective film.
Claims (1)
テージと、このウエハステージを駆動するウエハ
ステージ制御部と、ウエハステージ上方に配置さ
れた縮小レンズと、この縮小レンズ上方に配置さ
れたレテイクルと、このレテイクル上の回路パタ
ーンを前述ウエハ上に転写する露光の光源と、装
置全体を制御する全体制御部を具備する投影露光
装置に於いて、縮小レンズ下面への異物付着を防
止する手段として、エアマイクロ方式へ内装する
異物保護膜取付部、更に保護膜交換機能、これら
を構成しオートフオカス機能を維持することを特
徴とする投影露光装置。 A wafer stage on which a wafer, etc. is placed and step-feeded, a wafer stage control unit that drives this wafer stage, a reduction lens placed above the wafer stage, a reticle placed above this reduction lens, and this reticle. In a projection exposure apparatus that is equipped with an exposure light source that transfers the above circuit pattern onto the wafer and an overall control section that controls the entire apparatus, the air micro method is used as a means to prevent foreign matter from adhering to the lower surface of the reduction lens. What is claimed is: 1. A projection exposure apparatus comprising: a foreign matter protective film attachment part installed in the interior of the screen, a protective film exchange function, and an autofocus function.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12131490U JPH0479417U (en) | 1990-11-21 | 1990-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12131490U JPH0479417U (en) | 1990-11-21 | 1990-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479417U true JPH0479417U (en) | 1992-07-10 |
Family
ID=31869174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12131490U Pending JPH0479417U (en) | 1990-11-21 | 1990-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479417U (en) |
-
1990
- 1990-11-21 JP JP12131490U patent/JPH0479417U/ja active Pending
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