JPH04797U - - Google Patents
Info
- Publication number
- JPH04797U JPH04797U JP3919990U JP3919990U JPH04797U JP H04797 U JPH04797 U JP H04797U JP 3919990 U JP3919990 U JP 3919990U JP 3919990 U JP3919990 U JP 3919990U JP H04797 U JPH04797 U JP H04797U
- Authority
- JP
- Japan
- Prior art keywords
- base
- groove
- wiring conductor
- conductor
- convex
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第1図は従来の構造を示す組立て部分断面図、
第2図は本考案の第1の実施例を示す組立て縦断
面図、第3図は本考案の第2の実施例を示す組立
て縦断面図、第4図A,Bは第3図のキヤツプの
底面図とベースの平面図である。
1……ベース基板、2……ケース、3……プリ
ント配線板、4……回路素子、5……端子ピン、
11……ベース、12……キヤツプ、13,17
……回路素子、14,18……配線導体、15…
…端子パツド、16……電磁シールド導体面、1
9……凸部、20……溝。
Figure 1 is an assembled partial sectional view showing the conventional structure;
Fig. 2 is an assembled longitudinal sectional view showing the first embodiment of the present invention, Fig. 3 is an assembled longitudinal sectional view showing the second embodiment of the invention, and Figs. 4 A and B are the caps of Fig. 3. FIG. 2 is a bottom view and a plan view of the base. 1... Base board, 2... Case, 3... Printed wiring board, 4... Circuit element, 5... Terminal pin,
11...Base, 12...Cap, 13,17
...Circuit element, 14, 18...Wiring conductor, 15...
...Terminal pad, 16...Electromagnetic shield conductor surface, 1
9...Protrusion, 20...Groove.
Claims (1)
むように連続一周した溝を有する樹脂製の平板状
ベースと、 底面が開口部となり該開口部の下端面に前記ベ
ースの前記溝に嵌合するための連続一周した凸部
を有し該凸部を前記ベースの溝に嵌合し接着した
状態のとき内部の気密性が保たれるように形成さ
れた樹脂製のキヤツプとを備え、 前記ベースには、上面の前記溝の内側部分に形
成された配線導体と該配線導体の所定の位置に装
着された回路素子とが設けられ前記溝の外側部分
に配線導体が設けられるとともに、裏面に前記上
面の前記配線導体とスルホールめつきによつて接
続された端子パツドが設けられ、 前記キヤツプには、表面全体と前記開口部の下
端面の前記凸部の外側部とに電磁シールドのため
の導体面が設けられるとともに、内面と前記開口
部の下端面の前記凸部の内側部とに前記外側部の
導体面と該凸部によつて絶縁された状態で形成さ
れた配線導体と該配線導体の所定の位置に装着さ
れた回路素子とが設けられ、 前記ベースの前記溝に前記キヤツプの前記凸部
が嵌合接着された状態のとき該溝と該凸部のそれ
ぞれ内側及び外側部分の配線導体が接続されると
ともに内部の気密性が保たれるように構成された
電子回路モジユール。[Claims for Utility Model Registration] A flat plate-like base made of resin having a continuous groove surrounding an electronic circuit portion that is to be airtightly housed on the top surface, and an opening at the bottom of the base. The base is made of resin and has a continuous convex portion that fits into the groove of the base, and is formed so that the internal airtightness is maintained when the convex portion is fitted into the groove of the base and bonded. The base is provided with a wiring conductor formed in the inner part of the groove on the upper surface and a circuit element mounted at a predetermined position of the wiring conductor, and the wiring conductor is provided in the outer part of the groove. A terminal pad connected to the wiring conductor on the upper surface by through-hole plating is provided on the back surface, and the cap is provided with a terminal pad connected to the entire surface and the outer side of the convex portion on the lower end surface of the opening. is provided with a conductor surface for electromagnetic shielding, and the inner surface and the inner part of the convex part on the lower end surface of the opening are insulated by the conductor surface of the outer part and the convex part. a wiring conductor and a circuit element mounted at a predetermined position of the wiring conductor, and when the convex part of the cap is fitted and bonded to the groove of the base, the groove and the convex part are connected to each other. An electronic circuit module configured so that the wiring conductors on the inner and outer parts are connected and the interior is kept airtight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3919990U JPH04797U (en) | 1990-04-12 | 1990-04-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3919990U JPH04797U (en) | 1990-04-12 | 1990-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04797U true JPH04797U (en) | 1992-01-07 |
Family
ID=31547895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3919990U Pending JPH04797U (en) | 1990-04-12 | 1990-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04797U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1022679A (en) * | 1996-07-05 | 1998-01-23 | Saitama Nippon Denki Kk | Shielding structure for multilayered printed board |
-
1990
- 1990-04-12 JP JP3919990U patent/JPH04797U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1022679A (en) * | 1996-07-05 | 1998-01-23 | Saitama Nippon Denki Kk | Shielding structure for multilayered printed board |