JPH0480065U - - Google Patents

Info

Publication number
JPH0480065U
JPH0480065U JP1990124512U JP12451290U JPH0480065U JP H0480065 U JPH0480065 U JP H0480065U JP 1990124512 U JP1990124512 U JP 1990124512U JP 12451290 U JP12451290 U JP 12451290U JP H0480065 U JPH0480065 U JP H0480065U
Authority
JP
Japan
Prior art keywords
connection conductor
internal connection
metal base
semiconductor elements
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990124512U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990124512U priority Critical patent/JPH0480065U/ja
Publication of JPH0480065U publication Critical patent/JPH0480065U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07651—Connecting or disconnecting of strap connectors characterised by changes in properties of the strap connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/651—Materials of strap connectors
    • H10W72/652—Materials of strap connectors comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案にかかる電力用半導体装置の一
実施例を説明するための図であり、そのＡは正面
から、そのＢは側からみた概略図である。第２図
は本考案に用いられる内部接続導体の一実施例を
示し、第３図Ａ，Ｂはそれぞれ本考案に用いられ
る別の内部接続導体の実施例を示す。第４図Ａ，
Ｂは従来例を説明するための図である。 １……金属ベース、２……枠体、３Ａ，３Ｂ，
３Ｃ……外部引出導体、４Ａ，４Ａ′，４Ｂ，４
Ｂ′，４Ｃ，４Ｃ′……半導体素子、６Ａ，６Ｂ
，６Ｃ……内部接続導体、６ａ，６ｂ……接続部
、６ｃ，６ｄ……脚部、６ｅ……橋絡部、６ｆ…
…切込み、６ｇ……ろう付け部。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 金属ベース、金属小片を介して前記金属ベ
    ースに載置される複数の半導体素子、およびこれ
    ら半導体素子の２個以上を互いに電気的接続する
    と共に外部接続導体に接続する内部接続導体を備
    えた半導体装置において、前記内部接続導体は前
    記半導体素子が接続される箇所と箇所の間に切り
    込みを備えたことを特徴とする電力用半導体装置
    。 (2) 金属ベース、金属小片を介して前記金属ベ
    ースに載置される複数の半導体素子、およびこれ
    半導体素子の２個以上を互いに電気的接続すると
    共に外部接続導体に接続する内部接続導体を備え
    た半導体装置において、前記内部接続導体は前記
    半導体素子が接続される箇所近傍から立ち上がる
    脚部を有し、該脚部と脚部との間に切り込みを備
    えることを特徴とする電力半導体装置。
JP1990124512U 1990-11-27 1990-11-27 Pending JPH0480065U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990124512U JPH0480065U (ja) 1990-11-27 1990-11-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990124512U JPH0480065U (ja) 1990-11-27 1990-11-27

Publications (1)

Publication Number Publication Date
JPH0480065U true JPH0480065U (ja) 1992-07-13

Family

ID=31872160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990124512U Pending JPH0480065U (ja) 1990-11-27 1990-11-27

Country Status (1)

Country Link
JP (1) JPH0480065U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2897165A4 (en) * 2012-09-12 2016-01-06 Calsonic Kansei Corp SEMICONDUCTOR COMPONENT

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03174747A (ja) * 1989-09-20 1991-07-29 Fuji Electric Co Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03174747A (ja) * 1989-09-20 1991-07-29 Fuji Electric Co Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2897165A4 (en) * 2012-09-12 2016-01-06 Calsonic Kansei Corp SEMICONDUCTOR COMPONENT
US9607931B2 (en) 2012-09-12 2017-03-28 Calsonic Kansei Corporation Semiconductor device for suppressing a temperature increase in beam leads

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