JPH048429U - - Google Patents

Info

Publication number
JPH048429U
JPH048429U JP4923390U JP4923390U JPH048429U JP H048429 U JPH048429 U JP H048429U JP 4923390 U JP4923390 U JP 4923390U JP 4923390 U JP4923390 U JP 4923390U JP H048429 U JPH048429 U JP H048429U
Authority
JP
Japan
Prior art keywords
waveguide
heat extraction
dielectric window
extraction body
interposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4923390U
Other languages
English (en)
Other versions
JP2510166Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4923390U priority Critical patent/JP2510166Y2/ja
Publication of JPH048429U publication Critical patent/JPH048429U/ja
Application granted granted Critical
Publication of JP2510166Y2 publication Critical patent/JP2510166Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係るプラズマプロセス装置の
概略縦断面図、第２図は本案装置の要部拡大縦断
面図、第３図は従来装置の概略縦断面図、第４図
は従来装置の要部拡大縦断面図である。 １……抜熱体、１ａ……冷却水路、１ｂ……導
入管、１ｃ……排出管、２……弾性部材、３……
シート、４……ベローズ、５ａ，５ｂ……固定リ
ング、３１……プラズマ生成室、３３……導波管
、３６……誘電体窓、４０……Ｏリング、４１…
…冷却水路。

Claims (1)

  1. 【実用新案登録請求の範囲】 プラズマ生成室の開口部を誘電体窓によつて封
    止し、その外側にマイクロ波導波管を着設し、該
    導波管と該誘電体窓との間に抜熱体を介在させて
    あるプラズマプロセス装置において、 前記導波管と前記抜熱体との間に、該抜熱体を
    前記誘電体窓に圧接させるように弾性部材を介在
    させてあることを特徴とするプラズマプロセス装
    置。
JP4923390U 1990-05-11 1990-05-11 プラズマプロセス装置 Expired - Lifetime JP2510166Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4923390U JP2510166Y2 (ja) 1990-05-11 1990-05-11 プラズマプロセス装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4923390U JP2510166Y2 (ja) 1990-05-11 1990-05-11 プラズマプロセス装置

Publications (2)

Publication Number Publication Date
JPH048429U true JPH048429U (ja) 1992-01-27
JP2510166Y2 JP2510166Y2 (ja) 1996-09-11

Family

ID=31566746

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4923390U Expired - Lifetime JP2510166Y2 (ja) 1990-05-11 1990-05-11 プラズマプロセス装置

Country Status (1)

Country Link
JP (1) JP2510166Y2 (ja)

Also Published As

Publication number Publication date
JP2510166Y2 (ja) 1996-09-11

Similar Documents

Publication Publication Date Title
GB2316530A (en) Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source
TW341615B (en) Vacuum double layer glass and its manufacturing method
JPS56152973A (en) Sputter etching device
SE8305568D0 (sv) Forfarande och anordning for kontinuerlig gjutning
JPH048429U (ja)
GB2078018A (en) Device for mounting frontal parts of high-voltage winding of the stator of a generator
DK483585A (da) Presse med et oppusteligt kammer
HK82188A (en) Thermal insulating window for application in curtain walls
GB2120148A (en) Wall-ironed cans
JPH0413658U (ja)
JPH0528757Y2 (ja)
JPS5784955A (en) Solar heat collector
CN216177360U (zh) 一种老炼用防漏液的模具
WO2002009241A3 (en) Electrode for plasma processing system
JPS6428064A (en) Device adsorbed by and movable along wall face
JPS61206650U (ja)
JPS6245830U (ja)
JPS56146933A (en) Cooking apparatus
JPS5834375Y2 (ja) 太陽熱集熱器
SU632461A1 (ru) Устройство дл гор чей штамповки
JPH0334610U (ja)
JPS63119235U (ja)
JPS61106028U (ja)
JPH0415832U (ja)
JPS58105463U (ja) 端部加熱炉のシ−ル機構

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term