JPH02114931U - - Google Patents
Info
- Publication number
- JPH02114931U JPH02114931U JP1989024503U JP2450389U JPH02114931U JP H02114931 U JPH02114931 U JP H02114931U JP 1989024503 U JP1989024503 U JP 1989024503U JP 2450389 U JP2450389 U JP 2450389U JP H02114931 U JPH02114931 U JP H02114931U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bonding
- pattern
- bonding pattern
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図はこの考案の一実施例のボンデイングパ
ターンの要部平面図、第２図は従来例の要部平面
図である。 １Ａ，１Ｂ……第二ボンデイングパターン、１
ａ，１ｂ……第二ボンデイングパターン、２……
ＩＣチツプ、３……第一ボンデイングパターン、
４……回路基板、５……リードワイヤ。
ターンの要部平面図、第２図は従来例の要部平面
図である。 １Ａ，１Ｂ……第二ボンデイングパターン、１
ａ，１ｂ……第二ボンデイングパターン、２……
ＩＣチツプ、３……第一ボンデイングパターン、
４……回路基板、５……リードワイヤ。
Claims (1)
- 回路基板上にＩＣチツプを塔載し、ＩＣチツプ
上の第一ボンデイングパターンと回路基板上の第
二ボンデイングパターンとの間をワイヤボンデイ
ングによつて接続をとる回路基板のボンデイング
パターンにおいて、第二ボンデイングパターンが
第一の端子配設部及び第二の端子配設部に相対応
してそれぞれ千鳥状に配設されるとともに、それ
らの形状が噛合状に形成配置されていることを特
徴としたボンデイングパターン。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024503U JPH073637Y2 (ja) | 1989-03-03 | 1989-03-03 | ボンディングパターン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989024503U JPH073637Y2 (ja) | 1989-03-03 | 1989-03-03 | ボンディングパターン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02114931U true JPH02114931U (ja) | 1990-09-14 |
| JPH073637Y2 JPH073637Y2 (ja) | 1995-01-30 |
Family
ID=31244405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989024503U Expired - Lifetime JPH073637Y2 (ja) | 1989-03-03 | 1989-03-03 | ボンディングパターン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073637Y2 (ja) |
-
1989
- 1989-03-03 JP JP1989024503U patent/JPH073637Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073637Y2 (ja) | 1995-01-30 |