JPH048450B2 - - Google Patents
Info
- Publication number
- JPH048450B2 JPH048450B2 JP27649686A JP27649686A JPH048450B2 JP H048450 B2 JPH048450 B2 JP H048450B2 JP 27649686 A JP27649686 A JP 27649686A JP 27649686 A JP27649686 A JP 27649686A JP H048450 B2 JPH048450 B2 JP H048450B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyquinoxaline
- curing
- oligomer
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000013006 addition curing Methods 0.000 claims description 18
- 239000011159 matrix material Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000003733 fiber-reinforced composite Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 description 45
- 239000011347 resin Substances 0.000 description 45
- 239000003795 chemical substances by application Substances 0.000 description 13
- -1 phenylglyoxalyl Chemical group 0.000 description 12
- 238000000465 moulding Methods 0.000 description 11
- 229920000049 Carbon (fiber) Polymers 0.000 description 10
- 239000004917 carbon fiber Substances 0.000 description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 10
- 239000003085 diluting agent Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- 230000009477 glass transition Effects 0.000 description 7
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 238000009835 boiling Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- FUEGWHHUYNHBNI-UHFFFAOYSA-N 1-[4-(2-oxo-2-phenylacetyl)phenyl]-2-phenylethane-1,2-dione Chemical compound C=1C=CC=CC=1C(=O)C(=O)C(C=C1)=CC=C1C(=O)C(=O)C1=CC=CC=C1 FUEGWHHUYNHBNI-UHFFFAOYSA-N 0.000 description 3
- RQBIGPMJQUKYAH-UHFFFAOYSA-N 4-(3,4-diaminophenoxy)benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1OC1=CC=C(N)C(N)=C1 RQBIGPMJQUKYAH-UHFFFAOYSA-N 0.000 description 3
- KSSJBGNOJJETTC-UHFFFAOYSA-N COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC Chemical compound COC1=C(C=CC=C1)N(C1=CC=2C3(C4=CC(=CC=C4C=2C=C1)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC(=CC=C1C=1C=CC(=CC=13)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)N(C1=CC=C(C=C1)OC)C1=C(C=CC=C1)OC)C1=CC=C(C=C1)OC KSSJBGNOJJETTC-UHFFFAOYSA-N 0.000 description 3
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 229920006015 heat resistant resin Polymers 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 239000011208 reinforced composite material Substances 0.000 description 3
- HDUMIPYKGJIBDC-UHFFFAOYSA-N 1-(3,4-diaminophenyl)pyrrole-2,5-dione Chemical compound C1=C(N)C(N)=CC=C1N1C(=O)C=CC1=O HDUMIPYKGJIBDC-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- PUQRJGODUZWXMF-UHFFFAOYSA-N 4-[2-(4-hydroxy-2-prop-2-enylphenyl)propan-2-yl]-3-prop-2-enylphenol Chemical compound C=1C=C(O)C=C(CC=C)C=1C(C)(C)C1=CC=C(O)C=C1CC=C PUQRJGODUZWXMF-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- NLNRQJQXCQVDQJ-UHFFFAOYSA-N bis(3,4-diaminophenyl)methanone Chemical compound C1=C(N)C(N)=CC=C1C(=O)C1=CC=C(N)C(N)=C1 NLNRQJQXCQVDQJ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- VATYWCRQDJIRAI-UHFFFAOYSA-N p-aminobenzaldehyde Chemical compound NC1=CC=C(C=O)C=C1 VATYWCRQDJIRAI-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- ROLAGNYPWIVYTG-UHFFFAOYSA-N 1,2-bis(4-methoxyphenyl)ethanamine;hydrochloride Chemical compound Cl.C1=CC(OC)=CC=C1CC(N)C1=CC=C(OC)C=C1 ROLAGNYPWIVYTG-UHFFFAOYSA-N 0.000 description 1
- MEZJQXVOMGUAMP-UHFFFAOYSA-N 1-(2-methylnaphthalen-1-yl)pyrrole-2,5-dione Chemical compound CC1=CC=C2C=CC=CC2=C1N1C(=O)C=CC1=O MEZJQXVOMGUAMP-UHFFFAOYSA-N 0.000 description 1
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- HVHNMNGARPCGGD-UHFFFAOYSA-N 2-nitro-p-phenylenediamine Chemical compound NC1=CC=C(N)C([N+]([O-])=O)=C1 HVHNMNGARPCGGD-UHFFFAOYSA-N 0.000 description 1
- OWFBLWBTJZJMNU-UHFFFAOYSA-N 2-oxo-n,n-diphenylacetamide Chemical compound C=1C=CC=CC=1N(C(=O)C=O)C1=CC=CC=C1 OWFBLWBTJZJMNU-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical group C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- JKETWUADWJKEKN-UHFFFAOYSA-N 4-(3,4-diaminophenyl)sulfonylbenzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1S(=O)(=O)C1=CC=C(N)C(N)=C1 JKETWUADWJKEKN-UHFFFAOYSA-N 0.000 description 1
- ILPWTQGYOZFLBN-UHFFFAOYSA-N 4-[(3,4-diaminophenyl)methyl]benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1CC1=CC=C(N)C(N)=C1 ILPWTQGYOZFLBN-UHFFFAOYSA-N 0.000 description 1
- BEOMBVNRKRUXIL-UHFFFAOYSA-N 4-[4-(3,4-diaminophenoxy)phenoxy]benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C(N)=C1 BEOMBVNRKRUXIL-UHFFFAOYSA-N 0.000 description 1
- WIKKJZPLMMVPNY-UHFFFAOYSA-N 4-[4-[4-(3,4-diaminophenoxy)phenyl]sulfonylphenoxy]benzene-1,2-diamine Chemical compound C1=C(N)C(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=C(N)C(N)=CC=3)=CC=2)C=C1 WIKKJZPLMMVPNY-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000397 acetylating effect Effects 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 230000000850 deacetylating effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000003431 oxalo group Chemical group 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
[産業上の利用分野]
本発明は、優れた耐熱、耐水性と機械的特性を
有する、付加硬化型ポリキノキサリンオリゴマを
マトリツクスとする炭素繊維強化複合材料用プリ
プレグに関するものである。さらに詳しくは、耐
熱性が良好でかつ成形性の優れた炭素繊維強化複
合材料(以下CFRPと略称する)用の付加硬化型
ポリキノキサリンオリゴマをマトリツクスとする
炭素繊維強化複合材料用プリプレグに関するもの
である。
[従来の技術と発明が解決しようとする問題点]
従来から、耐熱性CFRPとしてはポリイミド系
の樹脂がマトリツクス樹脂として研究されてい
る。しかし、ポリイミド系の樹脂は耐熱性は優れ
ているが吸水性が大きいので、ポリイミド系の複
合材料は大気中の水分を吸収して耐熱性が低下す
るという欠点がある。一方、ポリキノキサリン系
樹脂は耐熱性、耐水性が優れているが、ポリイミ
ド樹脂に比べて成形が困難なことから実用化が遅
れている。一般に高耐熱性の樹脂は、ガラス転移
温度や融点が高く、かつ溶融樹脂の流動性が悪い
ため成形は高温、高圧下で行なう必要がある。そ
のため、形状の複雑な成形品や大型部品の成形は
きわめて困難であつた。そのため、耐熱性複合材
料を実用化するためには、成形性の改善が必須の
課題であつた。
ところで、ポリフエニルキノキサリン樹脂は有
機溶剤に可溶でしかも300℃程度のガラス転移温
度を有し溶融流動性もあり、耐熱ポリマーのなか
ではプロセス性は良好である。しかし高分子量ポ
リフエニルキノキサリン樹脂をマトリツクスとす
る複合材料は、成形時の樹脂の流動性が悪いため
成形性は著しく劣る。そこでポリフエニルキノキ
サリン樹脂の成形性の改善を目的として付加硬化
型樹脂への改質が研究されている。例えばアセチ
ル末端[ナシヨナル サンペ シンポジウム
(Natiol SAMPE Symposium),21(1976)83]、
アセチルフエノキシベンジイル末端[ナシヨナル
サンペ テクニカル コンフアレンス
(National SAMPE Technical Conference)、
8(1976),106]、ニトリル末端[ナシヨナル サ
ンペ テクニカル コンフアレンス
(National SAMPE Technical Conference),
8(1976),114]、及びビフエニレン末端[ジヤー
ナル オブ マクロモレキユラー サイエンス
ケミストリー (J,Macromol. Sci.Chem.),
A21(8&9)(1984),913]などの付加硬化型ポ
リフエニルキノキサリン系樹脂が研究されてい
る。このように高分子量のポリフエニルキノキサ
リン樹脂を付加硬化型樹脂に改質することによつ
て成形性は大幅に改善された。しかし、これらの
付加硬化型ポリフエニルキノキサリン樹脂は、成
形温度が高いため成形機や成形用副資材が高価に
なるという問題の他に、物性の優れた成形品が得
られないという欠点があつた。そのため低温で成
形可能な付加硬化型ポリフエニルキノキサリン樹
脂の開発が強く望まれていた。
そこで、本発明者らは優れた耐熱性、耐水性お
よび機械的特性を有し、かつ低温成形性の優れた
ポリキノキサリン系樹脂について鋭意研究した結
果、本発明に到達した。
[問題点を解決するための手段]
上記問題点を解決するために本発明は次の構成
を有する。すなわち、一般式[]または/およ
び[]で表される付加硬化型ポリオノキサリン
オリゴマをマトリツクスとする炭素繊維強化複合
材料用プリプレグである。
R1:nil,CH2,O,CO,SO2,S,
[Industrial Application Field] The present invention relates to a prepreg for carbon fiber-reinforced composite materials having an addition-curing polyquinoxaline oligomer matrix, which has excellent heat resistance, water resistance, and mechanical properties. More specifically, the present invention relates to a prepreg for carbon fiber reinforced composite materials that has good heat resistance and excellent moldability and has an addition-curing polyquinoxaline oligomer matrix for carbon fiber reinforced composite materials (hereinafter abbreviated as CFRP). . [Prior art and problems to be solved by the invention] Conventionally, polyimide resins have been studied as matrix resins for heat-resistant CFRP. However, polyimide-based resins have excellent heat resistance but high water absorption, so polyimide-based composite materials have the disadvantage of absorbing moisture in the atmosphere and decreasing their heat resistance. On the other hand, polyquinoxaline resins have excellent heat resistance and water resistance, but their practical application has been delayed because they are difficult to mold compared to polyimide resins. In general, highly heat-resistant resins have high glass transition temperatures and melting points, and the fluidity of the molten resin is poor, so molding must be carried out at high temperatures and high pressures. Therefore, it has been extremely difficult to mold molded products with complex shapes or large parts. Therefore, in order to put heat-resistant composite materials into practical use, improving moldability has been an essential issue. Incidentally, polyphenylquinoxaline resin is soluble in organic solvents, has a glass transition temperature of about 300°C, has melt fluidity, and has good processability among heat-resistant polymers. However, composite materials having a matrix of high molecular weight polyphenylquinoxaline resin have extremely poor moldability due to the poor fluidity of the resin during molding. Therefore, with the aim of improving the moldability of polyphenylquinoxaline resins, research is being conducted on modifying them into addition-curing resins. For example, acetyl terminal [Natiol SAMPE Symposium, 21 (1976) 83],
Acetyl phenoxybendiyl terminal [National SAMPE Technical Conference,
8 (1976), 106], nitrile-terminated [National Sanpe Technical Conference
(National SAMPE Technical Conference),
8 (1976), 114], and biphenylene-terminated [Journal of Macromolecular Science
Chemistry (J, Macromol. Sci.Chem.),
A21 (8 & 9) (1984), 913] and other addition-curing polyphenylquinoxaline resins have been studied. In this way, by modifying the high molecular weight polyphenylquinoxaline resin into an addition-curing resin, the moldability was greatly improved. However, these addition-curing polyphenylquinoxaline resins have the disadvantage that molding machines and molding auxiliary materials are expensive due to high molding temperatures, and molded products with excellent physical properties cannot be obtained. . Therefore, there has been a strong desire to develop an addition-curing polyphenylquinoxaline resin that can be molded at low temperatures. Accordingly, the present inventors have conducted extensive research on polyquinoxaline resins that have excellent heat resistance, water resistance, and mechanical properties, and are also excellent in low-temperature moldability, and as a result, have arrived at the present invention. [Means for Solving the Problems] In order to solve the above problems, the present invention has the following configuration. That is, it is a prepreg for a carbon fiber reinforced composite material whose matrix is an addition-curing polyonoxaline oligomer represented by the general formula [] or/and []. R 1 : nil, CH 2 , O, CO, SO 2 , S,
【式】【formula】
【式】 Ar1:[Formula] Ar 1 :
【式】【formula】
【式】
Y1:H,CH3
従来の付加硬化型ポリキノキサリン樹脂オリゴ
マは成形には290℃以上の高温を必要とし、さら
に十分な耐熱性を発現するためには310℃以上の
アフターキユアーを必要とするため、成形品には
成形時の熱残留歪が大きくサーマルクラツクや熱
サイクルによるマイクロクラツクの発生が多い。
そのため複合材料物性が低下するという欠点があ
つた。そこで本発明者らは低温硬化型のポリキノ
キサリン樹脂の開発を行なつた。すなわち、ポリ
フエニルキノキサリンオリゴマの両末端にフエニ
ル−N−マレイミド型の末端封止剤(一般式:
[Formula] Y 1 : H, CH 3 Conventional addition-curing polyquinoxaline resin oligomers require high temperatures of 290°C or higher for molding, and after-cure temperatures of 310°C or higher to develop sufficient heat resistance. As a result, molded products have large thermal residual strains during molding, and thermal cracks and microcracks due to thermal cycles often occur.
Therefore, there was a drawback that the physical properties of the composite material deteriorated. Therefore, the present inventors developed a low temperature curing polyquinoxaline resin. That is, a phenyl-N-maleimide type end-capping agent (general formula:
【式】を導入したマレイミド
末端のポリキノキサリンオリゴマは硬化開始温度
が低く230℃〜250℃の低温で成形可能であり、上
記の欠点のない良好な成形品が得られることを見
出した。一般にマレイミド末端樹脂の硬化開始温
度は低く、例えばビスマレイミドでは成形温度は
180℃〜220℃であり、必要により220℃〜250℃の
アフターキユアーを行なうのが必要である[ナシ
ヨナル サンペ シンポジウム(National
SAMPE Symposium),29,(1984),1043]。し
かし、ポリキノキサリン樹脂オリゴマはガラス転
移温度が高いため200℃以下では成形が困難であ
る。そこで本発明者らは低温硬化型ポリキノキサ
リン樹脂オリゴマの末端封止剤について鋭意研究
を行なつた結果、フエニル−N−マレイミド型の
末端封止剤を用いることにより230℃〜250℃の成
形を可能としたのである。
さて、本発明に用いるマレイミド型末端ポリキ
ノキサン系オリゴマを合成するためのフエニル−
N−マレイミド型の末端封止剤は、ベンゼン環の
オルソ位に2個のアミノ基を有するジアミン型
と、フエニル基にフエニルグリオキサリル型の2
種類の化合物を使用することができる。ジアミン
型の末端封止剤は、たとえば2−ニトロ−p−フ
エニレンジアミンと無水マレイン酸をジメチルア
セトアミド溶液中で反応させて中間体として1−
アミノ−2−ニトロ−4−マレイミドベンゼンを
合成し、これを塩化第一スズを用いて還元するこ
とによつてジアミン型末端封止剤(1,2−アミ
ノ−4−マレイミドベンゼン)が得られる。一
方、グリオキサリル型の末端封止剤は、たととえ
ば、p−アミノベンズアルデヒドをアセチル化
し、これとベンゾアルデヒドをベンゾイン縮合さ
せ、これを酢酸銅と硝酸アンモニウムを用いて酸
化した後、脱アセチル化することによつて、p−
フエニルグリオキサリルアニリンを合成する。次
で得られたp−フエニルグリオキサリルアニリン
と無水マレイン酸をジメチルアセトアミド溶液中
で反応させることによつてグリオキサリル型の末
端封止剤(1−フエニルグリオキサリル−4−マ
レイミドベンゼン)が得られる。無水マレイン酸
の代りにメチル置換無水マレイン酸(無水シトラ
コン酸)を用いると、末端封止剤の反応開始温度
が若干低下し、硬化物の耐熱性がやや低下する
が、オリゴマの溶融温度が低下するため成形性が
向上する。そのため無水マレイン酸とシトランコ
ン酸を必要により混合使用することにより、耐熱
性や成形性をコントロールすることができる。
次にマレイミド末端付加硬化型ポリオキサリン
系樹脂は、通常以下の順序によつて合成すること
ができる。例えば特許請求範囲に記載の一般式
[]で表されるオリゴマは、テトラアミン型モ
ノマとビスグリオキサリル型モノマをクレゾール
中で縮合反応させた後、ジアミン型の末端封止剤
を添加し、縮合反応を完了させることによつて得
られる。オリゴマの繰返し単位数をnとすると、
テトラアミン:ビスグリオキサリル:末端封止剤
のモル比がn:(n+1):2になるように調整す
ることによつて、任意の平均分子量を有するオリ
ゴマを合成することができる。一方、一般式
[]で表されるオリゴマはグリオキサリル型の
末端封止剤を用いる他は上記の方法と同様の手順
で合成することができるが、この場合には各モノ
マの割合はテトラアミン:ビスグリオキサリル:
末端封止剤のモル比を(n+1):n:2モルに
なるように調整する。
本発明に用いるマレイミド型末端付加硬化型ポ
リキノキサリンオリゴマは、テトラアミン型モノ
マとビスグリオキサリル型モノマの化学構造やオ
リゴマの平均分子量をコントロールすることによ
つて耐熱性や物性、成形性等の異なる樹脂が得ら
れるが、ポリキノキサリン系樹脂の優れた耐熱性
や耐水性を損なうことなく、成形性や機械的特性
の優れたマレイミド型末端ポリキノキサリン樹脂
を得るためには、テトラアミン型モノマとしては
3,3′,4,4′−テトラアミノジフエニル[N]、
3,3′,4,4′−テトラアミノベンゾフエノン
[C]、3,3′,4,4′−テトラアミノジフエニル
スルホン[S]、3,3′,4,4′−テトラアミノ
ジフエニルエーテル[E]、3,3′,4,4′−テ
トラアミノジフエニルメタン、3,3′,4,4′−
テトラアミノジフエニルスルフイド、2,2′−ビ
ス[4−(3,4−ジアミノフエノキシ)フエニ
ル]プロパン、ビス[4−(3,4−ジアミノフ
エノキシ)フエニル]スルホン、1,4−ビス
(3,4−ジアミノフエノキシ)ベンゼン等が好
適であり、ビスグリオキサリル型モノマとして
は、p−ビス(フエニルグリオキサリル)ベンゼ
ン[b]、p−ビス(フエニルグリオキサリル)
ジフエニルエーテル[e]、p−ビス(フエニル
グリオキサリル)ジフエニルスルフイド[s]、
p−ビス(フエニルグリオキサリル)ジフエニル
ベンゼン等が好適である。さらりこれらのモノマ
から選ばれるポリキノキサリン樹脂の中では、耐
熱性並びに成形性の点からテトラアミン型モノマ
とビスグリオキサリル型モノマの組合わせとして
は、[N−e],[N−s],[C−b],[C−e]
,
[E−b]等が適しており、特に[C−b],[E
−b]は耐熱性、成形性の点で優れた特性を有し
ている。付加硬化型ポリキノキサリン樹脂はオリ
ゴマの平均分子量が大きくなるほど機械的特性は
向上するが、耐熱性や成形性が低下するため、オ
リゴマの平均繰返し単位数nは0〜10の範囲が適
しており特にnが0.4〜4の範囲が耐熱性、成形
性、物性の点でバランスがとれており付加硬化型
ポリキノキサリンオリゴマとして好適である。
本発明に用いるマレイミド型末端の付加硬化型
ポリキノキサリン樹脂は優れた耐熱性と成形性を
有しかつ従来から知られている付加硬化型ポリキ
ノキサリン樹脂に比べて低温で成形できるので成
形時の硬化歪みがちいさくなるため機械的特性も
優れているという特徴を有する。しかしながら本
発明による付加硬化型ポリキノキサリン樹脂も
250℃以上の耐熱性を有する複合材料用のマトリ
ツクス樹脂としては、オリゴマのガラス転移温度
が170℃〜210℃程度となる。そのため成形時に十
分オリゴマが溶融流動しないうちに末端封止剤の
硬化反応が開始するので、形状の複雑な成形品や
大型部品の成形は困難である。そのため本発明に
よる耐熱性の優れた付加硬化型ポリキノキサリン
の成形性をさらに向上するためには、低分子量の
反応性希釈剤の添加が有効である。本発明のマレ
イミド型のポリキノキサリン樹脂オリゴマに添加
する反応性希釈剤としてはジアリル化合物、特に
室温で液状のジアリルイソフタレート、3,3′−
ジアリルビスフエノールAなどが好適である。マ
レイミド型末端のポリキノキサリン樹脂オリゴマ
は、末端マレイミドとアリル化合物が共重合して
三次元架橋構造を作るため、耐熱樹脂として必要
な性能を損なうことなく成形性の優れたキノキサ
リン系樹脂を得ることができるのみならず、優れ
た機械的特性をも有するものである。しかも、反
応性希釈剤の添加によりプリプレグのタツクやド
レープ性(軟らかさ)が改善されるため、復合材
料特にCFRP用マトリツクス樹脂として優れた特
性を有している。
マレイミド型末端ポリキノキサリン樹脂オリゴ
マと反応性希釈剤の混合比率はモル比で1/0.1
〜1/3の範囲が望ましく、より好ましくは、
1/0.5〜1/1.5が望ましい。反応性希釈剤の添
加量が増えるほど樹脂の流動性が良くなるが、逆
に耐熱性が低下する。そのため耐熱樹脂として必
要な性能を保持するためには、オリゴマ1モルに
対して反応性希釈剤の添加量は3モルを越えては
いけない。一方、添加量が少なすぎると十分な溶
融流動性が得られないので、オリゴマ1モルに対
して反応性希釈剤の添加量は0.1モル以上でなけ
ればいけない。
このように本発明に用いる付加硬化型ポリキノ
キサリン系樹脂は優れた耐熱性と機械的特性を有
し、さらにプリプレグのタツクやドレープ性が優
れていて、かつ優れた成形性を有するため、繊維
強化復合材料用マトリツクス樹脂として優れてい
るほか、接着剤や成形材料としても好適である。
なお本発明に用いるマレイミド型末端ポリキノ
キサリン樹脂には、反応性希釈剤としてジアリル
化合物の他に必要によりビスマレイミドや、ジシ
アネート化合物、ビニル化合物などを併用して添
加してもさしつかえない。
さらに本発明の付加硬化型ポリキノキサリンオ
リゴマをマトリツクスとする炭素繊維強化複合材
料用プリプレグにおいて、とくに高強度の炭素繊
維の場合に最も優れた効果が得られるが、強化繊
維として、炭素繊維に加えてガラス繊維など、ほ
かの繊維と混合使用してもさしつかえないし、繊
維の形態も長繊維、織物、編物、マツト、カツト
フアイバーなど何れの形態であつてもさしつかえ
ない。
[実施例]
以下の実施例によつて本発明をさらに詳細に説
明する。
実施例 1
3,3′,4,4′−テトラアミノジフエニルエー
テルを2モル、p−ビス(フエニルグリオキサリ
ル)ジフエニルエーテルを3モルの割合でジオキ
サンに溶解し、沸点下で3時間反応させた。次い
でこの溶液に1,2−ジアミノ−4−マレイミド
ベンゼンを2モル添加し、さらに沸点下で3時間
反応させた。得られた反応溶液と東レ株式会社製
“トレガ”T400を用いてドラムワインド法でプリ
プレグを作成した。得られたプリプレグの樹脂含
有量は39.6%であつた。そこで得られたプリプレ
グを長さ30cm、幅20cmに切断し、これを積層して
オートクレーブ中で160℃で14Kg/cm2に加圧した
のち250℃まで昇温し、2時間保持した後冷却し
てからオートクレーブから成形品を取り出した。
得られた成形品を260℃で6時間アフターキユア
ーして成形品を得た。得られた成形品中の炭素繊
維の体積含有量は60.2%で、DSC法で測定したガ
ラス転移温度は263℃で良好な耐熱性を有してい
ることが分かつた。
次に得られた成形品からASTM,D−638並び
にD−790に準じて試験片を切出して引張特性並
びに曲げ特性の測定を行なつたところ、引張強度
225Kg/mm2、引張弾性率14.3t/mm2、曲げ強度190
Kg/mm2、曲げ弾性率13.8t/mm2で優れた機械特性
を有していた。
実施例 2
3,3′,4,4′−テトラアミノベンゾフエノン
を2モル、p−ビス(フエニルグリオキサリル)
ベンゼンを3モルの割合でジオキサンに溶解し、
沸点下で3時間反応させた。次いでこの溶液に
1,2−ジアミノ−4−マレイミドベンゼンを2
モル添加し、さらに沸点下で3時間反応させた。
得られたマレイミド型末端ポリオキサリンオリゴ
マ1.0モルと3,3−ジアイルビスフエノール
A0.8モルの割合でジオキサンに溶解し、得られ
たプリプレグ用樹脂と東レ株式会社“トレカ”
T400を用いて湿式法でプリプレグを作成した。
プリプレグ中の樹脂の含有量は40.3%で、炭素繊
維の目付は252g/m2であつた。そこで得られた
プリプレグを長さ30cm、幅20cmに切断し、これを
積層してオートクレーブ中で160℃で7Kg/cm2に
加圧したのち250℃まで昇温し、2時間保持した
後室温まで冷却した後オートクレーブから成形品
を取り出した。得られた成形品を280℃で6時間
アフターキユアーして成形形品を得た。得られた
成形品中の炭素繊維の体積含有量は61.8%で、
DSC法で測定したガラス転移温度は310℃で良好
な耐熱性を有していることが分かつた。
次に得られた成形品からASTM,D−638並び
にD−790に準じて試験片を切出して引張特性並
びに曲げ特性の測定を行なつたところ、引張強度
230Kg/mm2、引張弾性率14.7t/mm2、曲げ強度197
Kg/mm2、曲げ弾性率14.2t/mm2で優れた機械特性
を有していた。
実施例 3
3,3′,4,4′−テトラアミノジフエニルエー
テルを3モル、p−ビス(フエニルグリオキサリ
ル)ベンゼンを2モルの割合でジオキサンに溶解
し、沸点下で3時間反応させた。次いでこの溶液
に1−フエニルグリオキサリル−4−マレイミド
ベンゼンを2モル添加し、さらに沸点下で3時間
反応させた。得られたマレイミド型末端ポリキノ
キサリンオリゴマ0.8モルと3,3′−ジアリルビ
スフエノールA1.0モルの割合でジオキサンに溶
解し、50℃で暫く攪拌してジオキサン含量を1%
以下にまで濃縮して、プリプレグ用樹脂を得た。
得られたプリプレグ用樹脂と東レ株式会社製“ト
レカ”T400を用いてホツトメルト法でプリプレ
グを作成した。プリプレグ中の樹脂の含有量は
40.3%で、炭素繊維の目付は249g/m2であつた。
そこで得られたプリプレグを長さ30cm、幅20cmに
切断し、これを積層してオートクレーブ中で160
℃で7Kg/cm2に加圧したのち250℃まで昇温し、
2時間保持した後室温まで冷却した後オートクレ
ーブから成形品を取り出した。得られた成形品を
270℃で6時間アフターキユアーして成形品を得
た。得られた成形品中の炭素繊維の体積含有量は
59.8%で、DSC法で測定したガラス転移温度は
293℃で良好な耐熱性を有していることが分かつ
た。
次に得られた成形品からASTM,D−638並び
にD−790に準じて試験片を切出して引張特性並
びに曲げ特性の測定を行なつたところ、引張強度
222Kg/mm2、引張弾性率14.3t/mm2、曲げ強度187
Kg/mm2、曲げ弾性率13.8t/mm2で優れた機械特性
を有していた。
[発明の効果]
本発明の付加硬化型ポリキノキサリンオリゴマ
をマトリツクスとする炭素繊維強化複合材料用プ
リプレグを成形性に優れ、また、これを用いて得
られる炭素繊維強化複合材料は耐熱性が良好であ
る。It has been found that a maleimide-terminated polyquinoxaline oligomer incorporating the formula has a low curing initiation temperature and can be molded at a low temperature of 230°C to 250°C, and that good molded products without the above-mentioned drawbacks can be obtained. Generally, the curing initiation temperature of maleimide-terminated resins is low; for example, in the case of bismaleimide, the molding temperature is
The temperature is 180℃ to 220℃, and if necessary, it is necessary to perform after-cure at 220℃ to 250℃ [National Sanpe Symposium
SAMPE Symposium), 29, (1984), 1043]. However, polyquinoxaline resin oligomers have a high glass transition temperature and are difficult to mold at temperatures below 200°C. Therefore, the present inventors conducted intensive research on end-capping agents for low-temperature curing polyquinoxaline resin oligomers, and found that molding at 230°C to 250°C was possible by using a phenyl-N-maleimide type end-capping agent. It made it possible. Now, phenyl-terminated polyquinoxane oligomers used in the present invention are synthesized.
N-maleimide type terminal capping agents include a diamine type having two amino groups at the ortho position of the benzene ring, and a phenylglyoxalyl type having two phenyl groups on the phenyl group.
Compounds of various types can be used. A diamine type terminal capping agent is produced by reacting 2-nitro-p-phenylenediamine and maleic anhydride in a dimethylacetamide solution to form a 1-
A diamine type terminal capping agent (1,2-amino-4-maleimidobenzene) is obtained by synthesizing amino-2-nitro-4-maleimidobenzene and reducing it using stannous chloride. . On the other hand, glyoxalyl-type end capping agents are produced by, for example, acetylating p-aminobenzaldehyde, condensing this and benzaldehyde with benzoin, oxidizing this with copper acetate and ammonium nitrate, and then deacetylating it. In particular, p-
Synthesize phenylglyoxalylaniline. A glyoxalyl-type terminal capping agent (1-phenylglyoxalyl-4-maleimidobenzene) was obtained by reacting p-phenylglyoxalylaniline obtained in the following with maleic anhydride in a dimethylacetamide solution. can get. When methyl-substituted maleic anhydride (citraconic anhydride) is used instead of maleic anhydride, the reaction initiation temperature of the terminal capping agent is slightly lowered, and the heat resistance of the cured product is slightly lowered, but the melting temperature of the oligomer is lowered. This improves moldability. Therefore, heat resistance and moldability can be controlled by mixing maleic anhydride and citranconic acid as necessary. Next, the maleimide-terminated addition-curable polyoxaline resin can be synthesized usually in the following order. For example, the oligomer represented by the general formula [ Obtained by completing . If the number of repeating units of the oligomer is n, then
By adjusting the molar ratio of tetraamine: bisglyoxalyl: terminal capping agent to n:(n+1):2, an oligomer having an arbitrary average molecular weight can be synthesized. On the other hand, the oligomer represented by the general formula [ ] can be synthesized by the same procedure as the above method except for using a glyoxalyl type terminal capping agent, but in this case, the proportion of each monomer is tetraamine: Bisglyoxalyl:
The molar ratio of the terminal capping agent is adjusted to be (n+1):n:2 mol. The maleimide-type terminal addition-curable polyquinoxaline oligomer used in the present invention is a resin with different heat resistance, physical properties, moldability, etc. by controlling the chemical structure of the tetraamine type monomer and bisglyoxalyl type monomer and the average molecular weight of the oligomer. However, in order to obtain a maleimide type terminal polyquinoxaline resin with excellent moldability and mechanical properties without impairing the excellent heat resistance and water resistance of the polyquinoxaline resin, 3, 3',4,4'-tetraaminodiphenyl [N],
3,3',4,4'-tetraaminobenzophenone [C], 3,3',4,4'-tetraamino diphenyl sulfone [S], 3,3',4,4'-tetraamino Diphenyl ether [E], 3,3',4,4'-tetraaminodiphenylmethane, 3,3',4,4'-
Tetraaminodiphenyl sulfide, 2,2'-bis[4-(3,4-diaminophenoxy)phenyl]propane, bis[4-(3,4-diaminophenoxy)phenyl]sulfone, 1 , 4-bis(3,4-diaminophenoxy)benzene, etc. are suitable, and examples of bisglyoxalyl type monomers include p-bis(phenylglyoxalyl)benzene [b], p-bis(phenylglyoxalyl) oxalyl)
diphenyl ether [e], p-bis(phenylglyoxalyl) diphenyl sulfide [s],
Preferred are p-bis(phenylglyoxalyl)diphenylbenzene and the like. Among the polyquinoxaline resins selected from these monomers, [N-e], [N-s], [N-e], [N-s], [N-e], [N-s], [ C-b], [C-e]
,
[E-b] etc. are suitable, especially [C-b], [E
-b] has excellent properties in terms of heat resistance and moldability. The mechanical properties of addition-curing polyquinoxaline resins improve as the average molecular weight of the oligomer increases, but heat resistance and moldability decrease, so it is suitable for the average number of repeating units n of the oligomer to be in the range of 0 to 10. A range of n from 0.4 to 4 is well-balanced in terms of heat resistance, moldability, and physical properties, and is suitable as an addition-curing polyquinoxaline oligomer. The maleimide-terminated addition-curing polyquinoxaline resin used in the present invention has excellent heat resistance and moldability, and can be molded at a lower temperature than conventionally known addition-curing polyquinoxaline resins, so it hardens during molding. It is characterized by excellent mechanical properties due to less distortion. However, the addition-curing polyquinoxaline resin according to the present invention also
As a matrix resin for composite materials having heat resistance of 250°C or higher, the glass transition temperature of the oligomer is approximately 170°C to 210°C. Therefore, during molding, the curing reaction of the terminal capping agent starts before the oligomer has sufficiently melted and flowed, making it difficult to mold molded products with complex shapes or large parts. Therefore, in order to further improve the moldability of the addition-curable polyquinoxaline having excellent heat resistance according to the present invention, it is effective to add a low molecular weight reactive diluent. The reactive diluent to be added to the maleimide-type polyquinoxaline resin oligomer of the present invention is a diallyl compound, particularly diallyl isophthalate, 3,3'-
Diallylbisphenol A and the like are preferred. Polyquinoxaline resin oligomers with maleimide-type terminals copolymerize with maleimide terminals and allyl compounds to create a three-dimensional crosslinked structure, making it possible to obtain quinoxaline-based resins with excellent moldability without sacrificing the performance required as heat-resistant resins. Not only is this possible, but it also has excellent mechanical properties. Moreover, since the tack and drape (softness) of the prepreg are improved by adding a reactive diluent, it has excellent properties as a composite material, especially as a matrix resin for CFRP. The mixing ratio of the maleimide-terminated polyquinoxaline resin oligomer and the reactive diluent is 1/0.1 in molar ratio.
A range of ~1/3 is desirable, and more preferably,
1/0.5 to 1/1.5 is desirable. As the amount of reactive diluent added increases, the fluidity of the resin improves, but on the contrary, the heat resistance decreases. Therefore, in order to maintain the performance required as a heat-resistant resin, the amount of reactive diluent added should not exceed 3 moles per mole of oligomer. On the other hand, if the amount added is too small, sufficient melt fluidity cannot be obtained, so the amount of reactive diluent added should be 0.1 mol or more per 1 mol of oligomer. As described above, the addition-curing polyquinoxaline resin used in the present invention has excellent heat resistance and mechanical properties, and also has excellent prepreg tack and drapability as well as excellent moldability. In addition to being excellent as a matrix resin for composite materials, it is also suitable as an adhesive or a molding material. In addition to the diallyl compound, bismaleimide, a dicyanate compound, a vinyl compound, etc. may be added in combination as a reactive diluent to the maleimide-terminated polyquinoxaline resin used in the present invention, if necessary. Furthermore, in the prepreg for carbon fiber-reinforced composite materials using the addition-curing polyquinoxaline oligomer of the present invention as a matrix, the most excellent effects can be obtained especially in the case of high-strength carbon fiber; however, in addition to carbon fiber as reinforcing fiber, It may be mixed with other fibers such as glass fibers, and the fibers may be in any form such as long fibers, woven fabrics, knitted fabrics, matte fibers, or cut fibers. [Example] The present invention will be explained in further detail by the following example. Example 1 2 moles of 3,3',4,4'-tetraaminodiphenyl ether and 3 moles of p-bis(phenylglyoxalyl) diphenyl ether were dissolved in dioxane and heated at boiling point for 3 hours. Made it react. Next, 2 moles of 1,2-diamino-4-maleimidobenzene was added to this solution, and the mixture was further reacted at the boiling point for 3 hours. A prepreg was produced by the drum winding method using the obtained reaction solution and "Torega" T400 manufactured by Toray Industries, Inc. The resin content of the obtained prepreg was 39.6%. The prepreg obtained there was cut into pieces of 30 cm in length and 20 cm in width, which were stacked and placed in an autoclave at 160°C and pressurized to 14 kg/ cm2 , then heated to 250°C, held for 2 hours, and then cooled. After that, the molded product was removed from the autoclave.
The obtained molded product was after-cured at 260° C. for 6 hours to obtain a molded product. The volume content of carbon fiber in the obtained molded product was 60.2%, and the glass transition temperature measured by the DSC method was 263°C, indicating that it had good heat resistance. Next, test pieces were cut out from the molded product obtained in accordance with ASTM, D-638 and D-790, and the tensile and bending properties were measured.
225Kg/mm 2 , tensile modulus 14.3t/mm 2 , bending strength 190
It had excellent mechanical properties with Kg/mm 2 and flexural modulus of 13.8 t/mm 2 . Example 2 2 moles of 3,3',4,4'-tetraaminobenzophenone, p-bis(phenylglyoxalyl)
Benzene is dissolved in dioxane in a proportion of 3 moles,
The reaction was carried out at boiling point for 3 hours. Then, 1,2-diamino-4-maleimidobenzene was added to this solution.
mol was added and further reacted for 3 hours at the boiling point.
1.0 mol of the obtained maleimide-type terminal polyoxaline oligomer and 3,3-diylbisphenol
Prepreg resin obtained by dissolving A in dioxane at a ratio of 0.8 mole and Toray Industries'"Torayca"
Prepreg was created using T400 using a wet method.
The resin content in the prepreg was 40.3%, and the carbon fiber basis weight was 252 g/m 2 . The prepreg obtained there was cut into pieces of 30 cm in length and 20 cm in width, which were then laminated and pressurized to 7 kg/cm 2 at 160°C in an autoclave, heated to 250°C, held for 2 hours, and then brought to room temperature. After cooling, the molded product was taken out from the autoclave. The obtained molded product was after-cured at 280° C. for 6 hours to obtain a molded product. The volume content of carbon fiber in the obtained molded product was 61.8%,
The glass transition temperature measured by the DSC method was 310°C, indicating that it had good heat resistance. Next, test pieces were cut out from the obtained molded product according to ASTM, D-638 and D-790, and the tensile properties and bending properties were measured.
230Kg/mm 2 , tensile modulus 14.7t/mm 2 , bending strength 197
It had excellent mechanical properties with Kg/mm 2 and flexural modulus of 14.2 t/mm 2 . Example 3 3,3',4,4'-tetraamino diphenyl ether and 2 moles of p-bis(phenylglyoxalyl)benzene were dissolved in dioxane and reacted at boiling point for 3 hours. Ta. Next, 2 moles of 1-phenylglyoxalyl-4-maleimidobenzene was added to this solution, and the mixture was further reacted at the boiling point for 3 hours. A ratio of 0.8 mol of the obtained maleimide-type terminal polyquinoxaline oligomer and 1.0 mol of 3,3'-diallylbisphenol A was dissolved in dioxane and stirred for a while at 50°C to reduce the dioxane content to 1%.
The resin for prepreg was obtained by concentrating to the following amount.
A prepreg was made using the hot melt method using the obtained prepreg resin and "Torayca" T400 manufactured by Toray Industries, Inc. The resin content in prepreg is
40.3%, and the basis weight of the carbon fiber was 249 g/m 2 .
The prepreg obtained was cut into pieces of 30 cm long and 20 cm wide, which were then stacked and placed in an autoclave for 160 min.
After pressurizing to 7Kg/cm 2 at ℃, the temperature was raised to 250℃,
After holding for 2 hours and cooling to room temperature, the molded product was taken out from the autoclave. The obtained molded product
A molded product was obtained by after-curing at 270°C for 6 hours. The volume content of carbon fiber in the obtained molded product is
59.8%, and the glass transition temperature measured by DSC method is
It was found that it had good heat resistance at 293°C. Next, test pieces were cut out from the obtained molded product according to ASTM, D-638 and D-790, and the tensile properties and bending properties were measured.
222Kg/mm 2 , tensile modulus 14.3t/mm 2 , bending strength 187
It had excellent mechanical properties with Kg/mm 2 and flexural modulus of 13.8 t/mm 2 . [Effects of the Invention] The prepreg for carbon fiber-reinforced composite materials using the addition-curing polyquinoxaline oligomer of the present invention as a matrix has excellent moldability, and the carbon fiber-reinforced composite materials obtained using the prepreg have good heat resistance. be.
Claims (1)
る付加硬化型ポリキノキサリンオリゴマをマトリ
ツクスとする炭素繊維強化複合材料用プリプレ
グ。 R1:nil,CH2,O,CO,SO2,S,
【式】 【式】【式】 Ar1:【式】【式】 【式】 Y1:H,CH3。[Claims] 1. A prepreg for carbon fiber-reinforced composite material having an addition-curing polyquinoxaline oligomer represented by the general formula [] or/and [] as a matrix. R 1 : nil, CH 2 , O, CO, SO 2 , S,
[Formula] [Formula] [Formula] Ar 1 : [Formula] [Formula] [Formula] Y 1 : H, CH 3 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27649686A JPS63130632A (en) | 1986-11-21 | 1986-11-21 | Addition-curable polyquinoxaline resin composition and intermediate material for carbon fiber-reinforced composite material, having said composition as matrix |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27649686A JPS63130632A (en) | 1986-11-21 | 1986-11-21 | Addition-curable polyquinoxaline resin composition and intermediate material for carbon fiber-reinforced composite material, having said composition as matrix |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63130632A JPS63130632A (en) | 1988-06-02 |
| JPH048450B2 true JPH048450B2 (en) | 1992-02-17 |
Family
ID=17570271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27649686A Granted JPS63130632A (en) | 1986-11-21 | 1986-11-21 | Addition-curable polyquinoxaline resin composition and intermediate material for carbon fiber-reinforced composite material, having said composition as matrix |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63130632A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4995347A (en) * | 1988-12-06 | 1991-02-26 | Toyota Jidosha Kabushiki Kaisha | Intake device of a two stroke engine with supercharger bypass passage |
| JP5243151B2 (en) * | 2008-09-01 | 2013-07-24 | 旭化成イーマテリアルズ株式会社 | Epoxy resin curable composition, resin varnish, prepreg, metal-clad laminate and cured product |
-
1986
- 1986-11-21 JP JP27649686A patent/JPS63130632A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63130632A (en) | 1988-06-02 |
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