JPH0484748A - Humidity sensor - Google Patents
Humidity sensorInfo
- Publication number
- JPH0484748A JPH0484748A JP2199905A JP19990590A JPH0484748A JP H0484748 A JPH0484748 A JP H0484748A JP 2199905 A JP2199905 A JP 2199905A JP 19990590 A JP19990590 A JP 19990590A JP H0484748 A JPH0484748 A JP H0484748A
- Authority
- JP
- Japan
- Prior art keywords
- humidity
- insulating substrate
- water molecules
- humidity sensor
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 29
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 18
- 230000004044 response Effects 0.000 abstract description 14
- 239000012298 atmosphere Substances 0.000 abstract description 10
- 238000001179 sorption measurement Methods 0.000 abstract description 6
- 238000003795 desorption Methods 0.000 abstract description 3
- 230000008859 change Effects 0.000 abstract description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、湿度を検出するための湿度センサに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a humidity sensor for detecting humidity.
[従来の技術]
現在、湿度センサとしては、相対湿度を電極間に塗布し
た感湿体の電気抵抗を含むインピーダンス、または静電
容量の変化として捕え、検知する湿度センサが使用され
ており、一般に高い感度を有し、安定性に優れ、また、
比較的容易に使用することができることから、ニアコン
ディショナ、加湿器、除湿器、或いは工業プロセスにお
ける湿度計測などにおいて高い需要を有している。[Prior Art] Humidity sensors currently in use are humidity sensors that capture and detect relative humidity as changes in impedance, including electrical resistance, or capacitance of a humidity sensing element applied between electrodes. It has high sensitivity, excellent stability, and
Since it is relatively easy to use, it is in high demand for near conditioners, humidifiers, dehumidifiers, and humidity measurement in industrial processes.
このような湿度センサは、通常、アルミナやガラス基板
上に、金、白金、銀パラジウム、或いは銀などの金属薄
膜によって、対向する一対のくし形電極を形成し、この
電極上に、感湿体である酸化亜鉛を主成分とした導電性
セラミック粉末を混練したものを塗布後焼成したり、或
いは、この電極上にアクリル系導電性高分子などの被膜
を形成し、架橋し、相対湿度の変化を電気抵抗及びイン
ピーダンスの変化として捕えたり、前記電極上にポリイ
ミド樹脂などの被膜を形成し、相対湿度の変化を静電容
量の変化として捕えたりしていた。Such humidity sensors usually have a pair of opposing comb-shaped electrodes formed on an alumina or glass substrate using thin metal films such as gold, platinum, silver palladium, or silver, and a humidity sensing element is placed on these electrodes. A conductive ceramic powder mainly composed of zinc oxide is applied and fired, or a film of acrylic conductive polymer is formed on the electrode and cross-linked to change the relative humidity. In some cases, changes in relative humidity have been detected as changes in capacitance by forming a film of polyimide resin or the like on the electrodes.
[発明が解決しようとする課題]
ところで、湿度センサを低湿度雰囲気中に放置した状態
から次第に湿度を上げて高湿状態とし、次いで、高湿状
態から低湿状態に戻していった時、同じ相対湿度でも低
湿から高湿に向かう時と高湿から低湿に戻る時では、湿
度センサからの出力が異なるが、このような特性は、ヒ
ステリシス特性と称されている。[Problems to be Solved by the Invention] By the way, when a humidity sensor is left in a low-humidity atmosphere, the humidity is gradually increased to a high-humidity state, and then the high-humidity state returns to a low-humidity state. Even with regard to humidity, the output from the humidity sensor differs when going from low humidity to high humidity and when returning from high humidity to low humidity, and such characteristics are called hysteresis characteristics.
このヒステリシス特性(ヒステリシス幅)は、湿度の測
定値における再現性を損い、測定精度を低下させるため
、できるだけ小さくしなければならないが、前述した構
造の従来の湿度センサにあっては、相対湿度換算で通常
7%RH以上と大きく、問題となっていた。This hysteresis characteristic (hysteresis width) impairs the reproducibility of humidity measurement values and reduces measurement accuracy, so it must be kept as small as possible. However, in conventional humidity sensors with the structure described above, relative humidity The converted RH was usually 7%RH or higher, which was a problem.
また、湿度の変化に対するセンサ出力の追従性を表す応
答時間も、前記構造の従来の湿度センサにあっては、5
〜15分と遅く、その改善が要求されていた。Furthermore, the response time, which indicates the followability of the sensor output to changes in humidity, is 5.
It was slow at ~15 minutes, and an improvement was requested.
本発明は、上記のような従来技術の課題を解決するため
に提案されたものであり、その目的は、ヒステリシス特
性を格段に改善して、測定精度が高く、且つ湿度の変化
に対する応答速度の速い、優れた湿度センサを提供する
ことである。The present invention was proposed to solve the problems of the prior art as described above, and its purpose is to significantly improve hysteresis characteristics, achieve high measurement accuracy, and improve response speed to changes in humidity. The objective is to provide a fast and excellent humidity sensor.
[課題を解決するための手段]
本発明による湿度センサは、絶縁基板と、この絶縁基板
の一面に対向して形成された一対のくし形電極と、この
くし形電極上に形成された感湿体、及びくし形電極対の
それぞれから引出された外部リード線を有してなる湿度
センサにおいて、絶縁基板が、空孔率15%以上である
ことを特徴としている。[Means for Solving the Problems] A humidity sensor according to the present invention includes an insulating substrate, a pair of comb-shaped electrodes formed opposite to each other on one surface of the insulating substrate, and a humidity-sensitive sensor formed on the comb-shaped electrodes. The humidity sensor has external lead wires drawn out from each of the body and the comb-shaped electrode pair, and is characterized in that the insulating substrate has a porosity of 15% or more.
[作用]
以上のような構成を有する本発明の湿度センサの作用を
以下に説明する。[Function] The function of the humidity sensor of the present invention having the above configuration will be explained below.
まず、湿度センサにおけるヒステリシス特性の発生は、
感湿体への水分子の吸着性と、感湿体からの水分子の離
脱性が異なることに起因するが、このような感湿体にお
ける吸着性・離脱性の差異は、絶縁基板が水分子を吸着
する一方で、吸着した水分子を離脱し難いことにさらに
起因する。すなわち、湿度センサが高湿度雰囲気中に放
置された後、低湿度雰囲気中に置かれると、感湿体は、
薄い被膜状のため、水分子を離脱し易いが、逆に絶縁基
板に吸着された水分子は離脱し難い上、この絶縁基板に
吸着された水分子が、感湿体側に移動し、感湿体がこの
水分子を再び吸着することにより、実際の低湿度雰囲気
とは異なる、高湿度雰囲気に相当する出力が湿度センサ
から発せられることになり、このことが、ヒステリシス
特性を高くしている。First, the occurrence of hysteresis characteristics in a humidity sensor is
This is due to the difference in adsorption of water molecules to the moisture sensitive element and separation of water molecules from the moisture sensitive element. This is further due to the fact that while adsorbing molecules, it is difficult to release adsorbed water molecules. That is, when the humidity sensor is left in a high humidity atmosphere and then placed in a low humidity atmosphere, the humidity sensor will
Since it is a thin film, it is easy for water molecules to separate, but on the other hand, water molecules adsorbed to the insulating substrate are difficult to separate, and the water molecules adsorbed to the insulating substrate move toward the moisture sensing element, causing moisture sensitivity. As the body adsorbs these water molecules again, the humidity sensor emits an output corresponding to a high humidity atmosphere, which is different from the actual low humidity atmosphere, which increases the hysteresis characteristic.
本発明は、このような考察を前提とし、絶縁基板におけ
る水分子の離脱性を高めることで、感湿体の再吸着を防
止し、ヒステリシス特性の低下を図ったものである。The present invention is based on such considerations, and aims to prevent re-adsorption of a moisture sensitive element and reduce hysteresis characteristics by increasing the ability of water molecules to separate from an insulating substrate.
すなわち、空孔率15%以上の多孔質体を絶縁基板とし
て使用してなる本発明においては、絶縁基板に対して水
分子が吸着、離脱し易くなり、周囲雰囲気が、高湿度雰
囲気から低湿度雰囲気に変化した場合にも、絶縁基板に
吸着された水分子は絶縁基板から速やかに離脱するため
、感湿体が絶縁基板の水分子を再吸着することも少なく
、また、再吸着しても速やかに離脱するため、ヒステリ
シス特性が格段に改善される。That is, in the present invention in which a porous body with a porosity of 15% or more is used as an insulating substrate, water molecules are easily adsorbed and detached from the insulating substrate, and the surrounding atmosphere changes from a high humidity atmosphere to a low humidity atmosphere. Even when the atmosphere changes, the water molecules adsorbed to the insulating substrate quickly leave the insulating substrate, so the moisture sensitive element is less likely to re-adsorb water molecules on the insulating substrate, and even if they are re-adsorbed, Since it is quickly released, the hysteresis characteristics are significantly improved.
また、絶縁基板が多孔質であるため、感湿体の絶縁基板
に密着している側でも、水分子の吸着性・離脱性が高く
なり、吸着・離脱の実効表面積が広くなり、湿度の変化
に対する応答速度が速くなる利点もある。In addition, since the insulating substrate is porous, even on the side of the moisture sensitive element that is in close contact with the insulating substrate, the adsorption and desorption properties of water molecules are high, and the effective surface area for adsorption and desorption is widened, resulting in changes in humidity. There is also the advantage that the response speed to
[実施例]
以下に、本発明による一実施例(第1実施例)を、第1
図を参照して具体的に説明する。[Example] An example (first example) according to the present invention will be described below.
This will be explained in detail with reference to the drawings.
まず、第1図に示すように、空孔率15%〜20%を有
する厚み0.63mmのアルミナまたはマグネシア製多
孔質絶縁基板1に、金、白金、銀パラジウム、或いは銀
などの金属ペーストを使用し、スクリーン印刷法により
、所定の対向するくし形電極対パターンを塗布し、この
後、金属ペーストの種類に応じて600〜1200℃で
焼成し、くし形電極対2を形成した。続いて、このくし
形電極対20表面に、予め粉砕し、有機溶剤でスラリー
状に混練したZnCr2O4を主成分とする感湿体3を
電極と同じスクリーン印刷法により印刷した後、500
〜1000℃で焼成した。さらに、くし形電極2の各々
に、外部リード線4を接続した。First, as shown in Fig. 1, a metal paste such as gold, platinum, silver palladium, or silver is applied to a porous insulating substrate 1 made of alumina or magnesia and having a porosity of 15% to 20% and a thickness of 0.63 mm. A predetermined pattern of opposing comb-shaped electrode pairs was applied by screen printing, and then fired at 600 to 1200°C depending on the type of metal paste to form the comb-shaped electrode pair 2. Subsequently, on the surface of this comb-shaped electrode pair 20, a moisture sensitive material 3 whose main component is ZnCr2O4, which had been crushed in advance and kneaded into a slurry with an organic solvent, was printed using the same screen printing method as the electrodes.
Calcined at ~1000°C. Furthermore, external lead wires 4 were connected to each of the comb-shaped electrodes 2.
以上のような構成を有する第1実施例の湿度センサの作
用を、第2図及び第3図を参照して説明する。The operation of the humidity sensor of the first embodiment having the above configuration will be explained with reference to FIGS. 2 and 3.
第2図は、本発明の第1実施例の湿度センサと従来の湿
度センサの相対湿度換算における湿度抵抗特性を示す図
である。すなわち、第2図に示すように、低湿から高湿
に向かう場合の湿度−抵抗特性曲線C(L−H)に対し
て、従来の湿度センサにおける高湿から低湿に戻る場合
の湿度−抵抗特性曲線Co は、大きな幅を有し
て下方に位(H−L)
置しているのに比べ、本発明の第1実施例における高湿
から低湿に戻る場合の湿度−抵抗特性曲線C1(11−
L)は、曲線Cにはるかに接近して(L−11)
おり、第1実施例のヒステリシス特性が、従来に比べて
大幅に改善されていることが明らかである。FIG. 2 is a diagram showing the humidity resistance characteristics of the humidity sensor according to the first embodiment of the present invention and the conventional humidity sensor in terms of relative humidity. That is, as shown in FIG. 2, compared to the humidity-resistance characteristic curve C (L-H) when going from low humidity to high humidity, the humidity-resistance characteristic curve when returning from high humidity to low humidity in the conventional humidity sensor The curve Co has a large width and is located downward (H-L), whereas the humidity-resistance characteristic curve C1 (11) when returning from high humidity to low humidity in the first embodiment of the present invention is −
L) is much closer to curve C (L-11), and it is clear that the hysteresis characteristic of the first embodiment is significantly improved compared to the conventional one.
より具体的には、従来の湿度センサにおけるヒステリシ
ス幅は、はぼ7%RHであったのに対し、本発明の第1
実施例の湿度センサにおけるヒステリシス幅は、はぼ3
%RHと、格段に低減されている。More specifically, the hysteresis width in the conventional humidity sensor was approximately 7%RH, whereas the hysteresis width in the first humidity sensor of the present invention
The hysteresis width in the humidity sensor of the example is approximately 3
%RH, which is significantly reduced.
第3図は、第1実施例の湿度センサと従来の湿度センサ
の応答速度特性を示す図である。すなわち、この第3図
に示すように、従来の湿度センサの応答速度(特性曲線
Co)は、センサ抵抗の増大時(90%RH−30%R
H時)及びセンサ抵抗の低減時(30%RH−90%R
H時)のいずれにおいても、はぼ8分程度と遅いのに対
し、第1実施例の湿度センサの応答速度(特性曲線C+
)は、センサ抵抗の増大時(90%RH−30%RH時
)及びセンサ抵抗の低減時(30%RH→90%RH時
)のいずれにおいても、はぼ3分程度と、格段に早くな
っている。FIG. 3 is a diagram showing the response speed characteristics of the humidity sensor of the first embodiment and the conventional humidity sensor. That is, as shown in FIG. 3, the response speed (characteristic curve Co) of the conventional humidity sensor changes when the sensor resistance increases (90% RH - 30% R
H) and when sensor resistance is reduced (30%RH-90%R
The response speed of the humidity sensor of the first embodiment (characteristic curve C+
) is much faster, approximately 3 minutes, both when the sensor resistance increases (90%RH - 30%RH) and when the sensor resistance decreases (30%RH → 90%RH). ing.
続いて、本発明による第2実施例を、前記第1実施例と
同様に、第1図を参照して具体的に説明する。Next, a second embodiment of the present invention will be specifically described with reference to FIG. 1, similar to the first embodiment.
すなわち、第1図に示すように、空孔率15%〜20%
を有する厚み0.63mmのアルミナまたはマグネシア
性多孔質絶縁基板1に、金、白金、銀パラジウム、或い
は銀などの金属ペーストを使用し、スクリーン印刷法に
より、所定の対向するくし形電極対パターンを塗布し、
この後、金属ペーストの種類に応じて600〜1200
℃で焼成し、くし形電極対2を形成した。続いて、この
くし形電極対2の表面に、アクリル系ポリマーに官能基
として第4級アンモニウム塩を付加した高分子と架橋剤
を添加したものを溶剤に希釈した溶液を塗布して、加熱
架橋し、感湿体3を形成した後、くし形電極2の各々に
、外部リード線4を接続した。That is, as shown in FIG. 1, the porosity is 15% to 20%.
A predetermined pattern of opposing comb-shaped electrode pairs is formed on an alumina or magnesia porous insulating substrate 1 with a thickness of 0.63 mm by screen printing using a metal paste such as gold, platinum, silver palladium, or silver. Apply,
After this, 600 to 1200 depending on the type of metal paste.
C. to form a comb-shaped electrode pair 2. Next, on the surface of this comb-shaped electrode pair 2, a solution of a polymer prepared by adding a quaternary ammonium salt as a functional group to an acrylic polymer and a crosslinking agent diluted in a solvent is applied, and thermal crosslinking is carried out. After forming the moisture sensitive body 3, external lead wires 4 were connected to each of the comb-shaped electrodes 2.
以上のような構成を有する第2実施例の湿度センサの作
用を、第4図及び第5図を参照して説明する。この場合
、第4図は、前述の第2図に対応する図面であり、第2
実施例の湿度センサと従来の湿度センサの相対湿度換算
における湿度−抵抗特性を示す図である。同様に、第5
図は、前述の第3図に対応する図面であり、第2実施例
の湿度センサと従来の湿度センサの応答速度特性を示す
図である。The operation of the humidity sensor of the second embodiment having the above configuration will be explained with reference to FIGS. 4 and 5. In this case, FIG. 4 is a drawing corresponding to the above-mentioned FIG.
It is a figure which shows the humidity-resistance characteristic in relative humidity conversion of the humidity sensor of an Example, and a conventional humidity sensor. Similarly, the fifth
This figure corresponds to the above-mentioned FIG. 3, and is a diagram showing the response speed characteristics of the humidity sensor of the second embodiment and the conventional humidity sensor.
すなわち、第4図に示すように、低湿から高湿に向かう
場合の湿度−抵抗特性曲線C(L−11)に対して、従
来の湿度センサにおける高湿から低湿に戻る場合の湿度
−抵抗特性曲線Co は、大(11−L)
きな幅を有して下方に位置しているのに比べ、本発明の
第2実施例における高湿から低湿に戻る場合の湿度−抵
抗特性曲線C2(II−L)は、はるかに曲線C(L−
IOに接近しており、前述の第1実施例と同様に、ヒス
テリシス特性が従来に比べて大幅に改善されていること
は明らかである。That is, as shown in FIG. 4, compared to the humidity-resistance characteristic curve C (L-11) when going from low humidity to high humidity, the humidity-resistance characteristic when returning from high humidity to low humidity in the conventional humidity sensor The curve Co has a large (11-L) width and is located downward, whereas the humidity-resistance characteristic curve C2 (when returning from high humidity to low humidity in the second embodiment of the invention) II-L) is much more similar to the curve C(L-
IO, and it is clear that the hysteresis characteristic is greatly improved compared to the conventional one, similar to the first embodiment described above.
また、第5図に示すように、従来の湿度センサの応答速
度(特性曲線Co)は、センサ抵抗の増大時(90%R
H→30%RH時)及びセンサ抵抗の低減時(30%R
H−90%RH時)のいずれにおいても、はぼ5分程度
と遅いのに対し、第2実施例の湿度センサの応答速度(
特性曲線C2)は、センサ抵抗の増大時(90%RH−
30%RH時)及びセンサ抵抗の低減時(30%RH→
90%RH時)のいずれにおいても、はぼ2.5分程度
と、格段に早くなっている。Furthermore, as shown in Fig. 5, the response speed (characteristic curve Co) of the conventional humidity sensor changes when the sensor resistance increases (90% R
H→30%RH) and when sensor resistance is reduced (30%RH)
The response speed of the humidity sensor of the second embodiment was slow (about 5 minutes) in both cases (H-90% RH).
The characteristic curve C2) shows that when the sensor resistance increases (90% RH-
at 30%RH) and when sensor resistance is reduced (at 30%RH→
In both cases (at 90% RH), it takes about 2.5 minutes, which is significantly faster.
なお、本発明は前記各実施例に限定されるものではなく
、具体的に使用する各構成要素、すなわち絶縁基板、く
し形電極、感湿体、リード線などの寸法形状及び使用す
る材料は適宜選択可能である。It should be noted that the present invention is not limited to the above embodiments, and the dimensions and shapes of the specifically used components, such as the insulating substrate, comb-shaped electrodes, moisture sensitive body, and lead wires, and the materials used may be changed as appropriate. Selectable.
[発明の効果コ
以上説明したように、本発明においては、絶縁基板を空
孔率15%以上とすることにより、絶縁基板に対して水
分子が吸着、離脱し易くなり、また、吸着・離脱の実効
表面積が広くなるため、従来に比べて、ヒステリシス特
性が格段に改善され、測定精度が高く、且つ湿度の変化
に対する応答速度の速い、優れた湿度センサを提供する
ことができる。[Effects of the Invention] As explained above, in the present invention, by making the insulating substrate have a porosity of 15% or more, water molecules can be easily adsorbed and detached from the insulating substrate; Since the effective surface area of the sensor is increased, it is possible to provide an excellent humidity sensor with significantly improved hysteresis characteristics, high measurement accuracy, and fast response speed to changes in humidity compared to conventional ones.
第1図は、本発明による湿度センサの一実施例を示す斜
視図、第2図は、本発明による第1実施例の湿度センサ
と従来の湿度センサの相対湿度換算における湿度−抵抗
特性を比較的に示すグラフ、第3図は、本発明による第
1実施例の湿度センサと従来の湿度センサの応答速度特
性を比較的に示すグラフ、第4図は、本発明による第2
実施例の湿度センサと従来の湿度センサの相対湿度換算
における湿度−抵抗特性を比較的に示すグラフ、第5図
は、本発明による第2実施例の湿度センサと従来の湿度
センサの応答速度特性を比較的に示すグラフである。
1・・・多孔質絶縁基板、2・・・くし形電極対、3・
・・感湿体、4・・・外部リード線。FIG. 1 is a perspective view showing an embodiment of the humidity sensor according to the present invention, and FIG. 2 is a comparison of humidity-resistance characteristics in terms of relative humidity between the humidity sensor of the first embodiment of the present invention and a conventional humidity sensor. FIG. 3 is a graph comparatively showing the response speed characteristics of the humidity sensor of the first embodiment according to the present invention and the conventional humidity sensor, and FIG.
A graph showing comparative humidity-resistance characteristics in terms of relative humidity between the humidity sensor of the embodiment and the conventional humidity sensor, and FIG. 5 shows the response speed characteristics of the humidity sensor of the second embodiment of the present invention and the conventional humidity sensor. This is a graph showing comparatively. DESCRIPTION OF SYMBOLS 1... Porous insulating substrate, 2... Comb-shaped electrode pair, 3...
...Moisture sensing element, 4...External lead wire.
Claims (1)
た一対のくし形電極と、このくし形電極上に形成された
感湿体、及びくし形電極対のそれぞれから引出された外
部リード線を有してなる湿度センサにおいて、 前記絶縁基板が、空孔率15%以上であることを特徴と
する湿度センサ。[Scope of Claims] An insulating substrate, a pair of comb-shaped electrodes formed opposite to each other on one surface of the insulating substrate, a moisture sensitive body formed on the comb-shaped electrodes, and each of the comb-shaped electrode pairs. A humidity sensor comprising an external lead wire drawn out, wherein the insulating substrate has a porosity of 15% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199905A JPH0484748A (en) | 1990-07-26 | 1990-07-26 | Humidity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199905A JPH0484748A (en) | 1990-07-26 | 1990-07-26 | Humidity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0484748A true JPH0484748A (en) | 1992-03-18 |
Family
ID=16415557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2199905A Pending JPH0484748A (en) | 1990-07-26 | 1990-07-26 | Humidity sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0484748A (en) |
-
1990
- 1990-07-26 JP JP2199905A patent/JPH0484748A/en active Pending
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