JPH0485731U - - Google Patents
Info
- Publication number
- JPH0485731U JPH0485731U JP1990126410U JP12641090U JPH0485731U JP H0485731 U JPH0485731 U JP H0485731U JP 1990126410 U JP1990126410 U JP 1990126410U JP 12641090 U JP12641090 U JP 12641090U JP H0485731 U JPH0485731 U JP H0485731U
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- wafer
- semiconductor wafer
- processing
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案の一実施例を示す断面図、第２
図は平面図、第３図は動作説明図、第４図は他の
実施例を示す図、第５図、第６図は従来の技術を
示す図である。
１……平板、２……ウエハー接触面、３……ウ
エハー、４……真空穴。
Fig. 1 is a sectional view showing one embodiment of the present invention;
3 is a plan view, FIG. 3 is an explanatory diagram of the operation, FIG. 4 is a diagram showing another embodiment, and FIGS. 5 and 6 are diagrams showing a conventional technique. 1... Flat plate, 2... Wafer contact surface, 3... Wafer, 4... Vacuum hole.
Claims (1)
固定させてプロセス処理をおこなう装置において
平板のウエハー吸着面を凸又は凹の球面とし、半
導体ウエハーを平板に全面にわたり密着させるこ
とを特徴とするウエハー処理用平板。 A flat plate for wafer processing, characterized in that the wafer suction surface of the flat plate is a convex or concave spherical surface, and the semiconductor wafer is brought into close contact with the flat plate over the entire surface, in an apparatus for performing processing by placing a semiconductor wafer on a flat plate and fixing it by vacuum suction. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126410U JPH0485731U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990126410U JPH0485731U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485731U true JPH0485731U (en) | 1992-07-24 |
Family
ID=31873969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990126410U Pending JPH0485731U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485731U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349050A (en) * | 1999-06-09 | 2000-12-15 | Disco Abrasive Syst Ltd | Method and apparatus for cutting workpiece |
| JP2014045144A (en) * | 2012-08-28 | 2014-03-13 | Fujitsu Semiconductor Ltd | Dicing method and dicing device |
-
1990
- 1990-11-30 JP JP1990126410U patent/JPH0485731U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000349050A (en) * | 1999-06-09 | 2000-12-15 | Disco Abrasive Syst Ltd | Method and apparatus for cutting workpiece |
| JP2014045144A (en) * | 2012-08-28 | 2014-03-13 | Fujitsu Semiconductor Ltd | Dicing method and dicing device |