JPH0485731U - - Google Patents

Info

Publication number
JPH0485731U
JPH0485731U JP1990126410U JP12641090U JPH0485731U JP H0485731 U JPH0485731 U JP H0485731U JP 1990126410 U JP1990126410 U JP 1990126410U JP 12641090 U JP12641090 U JP 12641090U JP H0485731 U JPH0485731 U JP H0485731U
Authority
JP
Japan
Prior art keywords
flat plate
wafer
semiconductor wafer
processing
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990126410U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990126410U priority Critical patent/JPH0485731U/ja
Publication of JPH0485731U publication Critical patent/JPH0485731U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す断面図、第２
図は平面図、第３図は動作説明図、第４図は他の
実施例を示す図、第５図、第６図は従来の技術を
示す図である。 １……平板、２……ウエハー接触面、３……ウ
エハー、４……真空穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ウエハーを平板に載せ、真空吸着により
    固定させてプロセス処理をおこなう装置において
    平板のウエハー吸着面を凸又は凹の球面とし、半
    導体ウエハーを平板に全面にわたり密着させるこ
    とを特徴とするウエハー処理用平板。
JP1990126410U 1990-11-30 1990-11-30 Pending JPH0485731U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990126410U JPH0485731U (ja) 1990-11-30 1990-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990126410U JPH0485731U (ja) 1990-11-30 1990-11-30

Publications (1)

Publication Number Publication Date
JPH0485731U true JPH0485731U (ja) 1992-07-24

Family

ID=31873969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990126410U Pending JPH0485731U (ja) 1990-11-30 1990-11-30

Country Status (1)

Country Link
JP (1) JPH0485731U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349050A (ja) * 1999-06-09 2000-12-15 Disco Abrasive Syst Ltd 被加工物の切削方法及び切削装置
JP2014045144A (ja) * 2012-08-28 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000349050A (ja) * 1999-06-09 2000-12-15 Disco Abrasive Syst Ltd 被加工物の切削方法及び切削装置
JP2014045144A (ja) * 2012-08-28 2014-03-13 Fujitsu Semiconductor Ltd ダイシング方法及びダイシング装置

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