JPH0485736U - - Google Patents
Info
- Publication number
- JPH0485736U JPH0485736U JP12774990U JP12774990U JPH0485736U JP H0485736 U JPH0485736 U JP H0485736U JP 12774990 U JP12774990 U JP 12774990U JP 12774990 U JP12774990 U JP 12774990U JP H0485736 U JPH0485736 U JP H0485736U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pellet
- sealed
- sealing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の第１実施例を示し、同図ａは
内部構造の平面図、同図ｂはそのＡ−Ａ線断面図
、第２図は本考案の第２実施例を示し、同図ａは
内部構造の平面図、同図ｂはそのＢ−Ｂ線断面図
、第３図は従来の半導体装置を示し、同図ａは内
部構造の平面図、同図ｂはそのＣ−Ｃ線断面図で
ある。
１……ペレツトマウント部、２……ペレツト、
３，３ａ……リード、４……ボンデイングワイヤ
、５……内部リード、６……樹脂。
FIG. 1 shows a first embodiment of the present invention, FIG. 1A shows a plan view of the internal structure, FIG. 3 shows a conventional semiconductor device; FIG. It is a sectional view taken along line C. 1... Pellet mount part, 2... Pellet,
3, 3a... Lead, 4... Bonding wire, 5... Internal lead, 6... Resin.
Claims (1)
トをマウントし、このペレツトをボンデイングワ
イヤによりリードに電気接続するとともに、これ
らを樹脂で封止してなる樹脂封止型半導体装置に
おいて、前記ペレツトマウント部の裏面を封止用
の樹脂から露呈させたことを特徴とする樹脂封止
型半導体装置。 ２ リードの端部は封止用樹脂の側面から外部に
突出され、ペレツトマウント部の裏面は封止用樹
脂の底面に露呈されてなる実用新案登録請求の範
囲第１項記載の樹脂封止型半導体装置。[Claims for Utility Model Registration] 1. A resin-sealed type in which a pellet is mounted on the surface of a metal pellet mount, the pellet is electrically connected to a lead using a bonding wire, and these are sealed with a resin. 1. A resin-sealed semiconductor device, characterized in that a back surface of the pellet mount portion is exposed from a sealing resin. 2. The resin sealing according to claim 1, wherein the ends of the leads protrude outward from the side surfaces of the sealing resin, and the back surface of the pellet mount portion is exposed at the bottom of the sealing resin. type semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12774990U JPH0485736U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12774990U JPH0485736U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0485736U true JPH0485736U (en) | 1992-07-24 |
Family
ID=31875237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12774990U Pending JPH0485736U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0485736U (en) |
-
1990
- 1990-11-30 JP JP12774990U patent/JPH0485736U/ja active Pending