JPH0485767U - - Google Patents

Info

Publication number
JPH0485767U
JPH0485767U JP12857790U JP12857790U JPH0485767U JP H0485767 U JPH0485767 U JP H0485767U JP 12857790 U JP12857790 U JP 12857790U JP 12857790 U JP12857790 U JP 12857790U JP H0485767 U JPH0485767 U JP H0485767U
Authority
JP
Japan
Prior art keywords
molten solder
printed circuit
soldering
circuit boards
solder tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12857790U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087654Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990128577U priority Critical patent/JPH087654Y2/ja
Publication of JPH0485767U publication Critical patent/JPH0485767U/ja
Application granted granted Critical
Publication of JPH087654Y2 publication Critical patent/JPH087654Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP1990128577U 1990-11-29 1990-11-29 プリント基板を半田処理する装置 Expired - Lifetime JPH087654Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990128577U JPH087654Y2 (ja) 1990-11-29 1990-11-29 プリント基板を半田処理する装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990128577U JPH087654Y2 (ja) 1990-11-29 1990-11-29 プリント基板を半田処理する装置

Publications (2)

Publication Number Publication Date
JPH0485767U true JPH0485767U (de) 1992-07-24
JPH087654Y2 JPH087654Y2 (ja) 1996-03-04

Family

ID=31876032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990128577U Expired - Lifetime JPH087654Y2 (ja) 1990-11-29 1990-11-29 プリント基板を半田処理する装置

Country Status (1)

Country Link
JP (1) JPH087654Y2 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591191A (en) * 1978-12-28 1980-07-10 Schmid T Geb Gmbh & Co Device for applying metallic brazing filler to printed circuit board
JPS6331194A (ja) * 1986-07-24 1988-02-09 冨士プラント工業株式会社 プリント基板への半田膜形成方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5591191A (en) * 1978-12-28 1980-07-10 Schmid T Geb Gmbh & Co Device for applying metallic brazing filler to printed circuit board
JPS6331194A (ja) * 1986-07-24 1988-02-09 冨士プラント工業株式会社 プリント基板への半田膜形成方法

Also Published As

Publication number Publication date
JPH087654Y2 (ja) 1996-03-04

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