JPH0487639U - - Google Patents
Info
- Publication number
- JPH0487639U JPH0487639U JP12972590U JP12972590U JPH0487639U JP H0487639 U JPH0487639 U JP H0487639U JP 12972590 U JP12972590 U JP 12972590U JP 12972590 U JP12972590 U JP 12972590U JP H0487639 U JPH0487639 U JP H0487639U
- Authority
- JP
- Japan
- Prior art keywords
- processed
- semiconductor manufacturing
- electrode plate
- processing liquid
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Formation Of Insulating Films (AREA)
Description
第１図は本考案の浮遊式メツキ治具の分解断面
図、第２図はこの治具を用いたメツキ装置を示す
概略構成図、第３図は従来のメツキ治具の分解断
面図、第４図は従来のメツキ装置の概略構成図で
ある。
１１……半導体ウエーハ、１２……メツキ液（
処理液）、１３……平形Ｏリング、１４……治具
本体、１５……吸着ステージ、１６……電極端子
、１７……本体、１８……メツキ槽（処理槽）、
１９……電極板。
Figure 1 is an exploded sectional view of the floating plating jig of the present invention, Figure 2 is a schematic configuration diagram showing a plating device using this jig, Figure 3 is an exploded sectional view of a conventional plating jig, and Figure 3 is an exploded sectional view of a conventional plating jig. FIG. 4 is a schematic diagram of a conventional plating device. 11... Semiconductor wafer, 12... Plating liquid (
treatment liquid), 13...Flat O-ring, 14...Jig body, 15...Adsorption stage, 16...Electrode terminal, 17...Main body, 18...Plating tank (processing tank),
19...Electrode plate.
Claims (1)
漬し、この処理対象物と電極板間に電圧を印加す
る半導体製造装置において、 処理対象物をＯリングを介してステージ上に吸
着させたことを特徴とする半導体製造装置。 (2) 請求項１において、処理対象物を処理液中
に水平に配設したことを特徴とする半導体製造装
置。[Claims for Utility Model Registration] (1) In semiconductor manufacturing equipment in which an object to be processed is immersed in a processing liquid facing an electrode plate and a voltage is applied between the object to be processed and the electrode plate, the object to be processed is exposed to O. A semiconductor manufacturing device characterized by being adsorbed onto a stage via a ring. (2) The semiconductor manufacturing apparatus according to claim 1, wherein the object to be processed is disposed horizontally in the processing liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12972590U JPH0487639U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12972590U JPH0487639U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487639U true JPH0487639U (en) | 1992-07-30 |
Family
ID=31877116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12972590U Pending JPH0487639U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487639U (en) |
-
1990
- 1990-11-30 JP JP12972590U patent/JPH0487639U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0167739U (en) | ||
| JPH0487639U (en) | ||
| JPH0389168U (en) | ||
| JPS62184737U (en) | ||
| JPS6096832U (en) | electrostatic chuck | |
| JPH0165860U (en) | ||
| JPH01147268U (en) | ||
| JPH03128943U (en) | ||
| JPS61164030U (en) | ||
| JPS6150631U (en) | ||
| JPH0339840U (en) | ||
| JPS645445U (en) | ||
| JPH02122067U (en) | ||
| JPS6292646U (en) | ||
| JPH02120832U (en) | ||
| JPH0330427U (en) | ||
| JPH01147265U (en) | ||
| JPS61125041U (en) | ||
| JPS5984839U (en) | semiconductor manufacturing equipment | |
| JPH01140824U (en) | ||
| JPH0350329U (en) | ||
| JPH01161334U (en) | ||
| JPS62147338U (en) | ||
| JPS6314570U (en) | ||
| JPS6287436U (en) |