JPH0511665B2 - - Google Patents
Info
- Publication number
- JPH0511665B2 JPH0511665B2 JP62040147A JP4014787A JPH0511665B2 JP H0511665 B2 JPH0511665 B2 JP H0511665B2 JP 62040147 A JP62040147 A JP 62040147A JP 4014787 A JP4014787 A JP 4014787A JP H0511665 B2 JPH0511665 B2 JP H0511665B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin
- envelope
- mounting
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4014787A JPS63208253A (ja) | 1987-02-25 | 1987-02-25 | 半導体回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4014787A JPS63208253A (ja) | 1987-02-25 | 1987-02-25 | 半導体回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63208253A JPS63208253A (ja) | 1988-08-29 |
| JPH0511665B2 true JPH0511665B2 (de) | 1993-02-16 |
Family
ID=12572657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4014787A Granted JPS63208253A (ja) | 1987-02-25 | 1987-02-25 | 半導体回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63208253A (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4941555B2 (ja) * | 2007-11-30 | 2012-05-30 | パナソニック株式会社 | 放熱構造体基板 |
| JP2017212344A (ja) * | 2016-05-25 | 2017-11-30 | 株式会社三社電機製作所 | 半導体装置 |
| JP2023181607A (ja) * | 2022-06-13 | 2023-12-25 | 富士電機株式会社 | 半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60244051A (ja) * | 1984-05-17 | 1985-12-03 | Mitsubishi Electric Corp | 半導体装置 |
-
1987
- 1987-02-25 JP JP4014787A patent/JPS63208253A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63208253A (ja) | 1988-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |