JPH0512712B2 - - Google Patents
Info
- Publication number
- JPH0512712B2 JPH0512712B2 JP62119420A JP11942087A JPH0512712B2 JP H0512712 B2 JPH0512712 B2 JP H0512712B2 JP 62119420 A JP62119420 A JP 62119420A JP 11942087 A JP11942087 A JP 11942087A JP H0512712 B2 JPH0512712 B2 JP H0512712B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- powder
- conductive
- chip
- isotropic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62119420A JPS63284591A (ja) | 1987-05-15 | 1987-05-15 | 表示パネルモジュ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62119420A JPS63284591A (ja) | 1987-05-15 | 1987-05-15 | 表示パネルモジュ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63284591A JPS63284591A (ja) | 1988-11-21 |
| JPH0512712B2 true JPH0512712B2 (2) | 1993-02-18 |
Family
ID=14761018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62119420A Granted JPS63284591A (ja) | 1987-05-15 | 1987-05-15 | 表示パネルモジュ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63284591A (2) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5130833A (en) | 1989-09-01 | 1992-07-14 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal device and manufacturing method therefor |
| JP2893070B2 (ja) * | 1989-09-01 | 1999-05-17 | 株式会社 半導体エネルギー研究所 | 液晶電気光学装置 |
-
1987
- 1987-05-15 JP JP62119420A patent/JPS63284591A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63284591A (ja) | 1988-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |