JPH0513532B2 - - Google Patents
Info
- Publication number
- JPH0513532B2 JPH0513532B2 JP14462087A JP14462087A JPH0513532B2 JP H0513532 B2 JPH0513532 B2 JP H0513532B2 JP 14462087 A JP14462087 A JP 14462087A JP 14462087 A JP14462087 A JP 14462087A JP H0513532 B2 JPH0513532 B2 JP H0513532B2
- Authority
- JP
- Japan
- Prior art keywords
- solid electrolytic
- electrolytic capacitor
- shape memory
- memory alloy
- foamed resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 claims description 30
- 239000007787 solid Substances 0.000 claims description 25
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 9
- 238000005187 foaming Methods 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000007743 anodising Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体電解コンデンサに係り、特に形状
記憶合金を固体電解コンデンサに内臓させた構造
に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a solid electrolytic capacitor, and particularly to a structure in which a shape memory alloy is incorporated in a solid electrolytic capacitor.
一般に固体電解コンデンサの故障モードは、短
絡故障が多く、大きな短絡電流が流れると、コン
デンサ素子が発熱し焼損に至ることもある。この
過度の短絡電流による故障発生の際には、回路構
成素子を保護するため、故障モードを短絡(シヨ
ート)から開放(オーブン)にすることが必要で
あり、第4図のようなヒユーズを用いる手段が知
られている。従来技術としては、例えば特公昭59
−250974号公報のようにヒユーズを内臓させた固
体電解コンデンサがある。
In general, the failure mode of solid electrolytic capacitors is often short-circuit failure, and when a large short-circuit current flows, the capacitor element generates heat and may even burn out. In the event of a failure due to this excessive short-circuit current, it is necessary to change the failure mode from short circuit (short circuit) to open (oven) in order to protect the circuit components, using a fuse as shown in Figure 4. The means are known. As a conventional technology, for example,
There is a solid electrolytic capacitor with a built-in fuse, as shown in Publication No. -250974.
第4図において、本固体電解コンデンサは、固
体電解コンデンサ素子5と、陽極リード8を介し
て外部に引き出した陽極外部端子7と、ヒユーズ
6を介して外部に引き出した陰極外部端子3と、
外装樹脂4とを備えている。 In FIG. 4, the present solid electrolytic capacitor includes a solid electrolytic capacitor element 5, an anode external terminal 7 drawn out to the outside via an anode lead 8, and a cathode external terminal 3 drawn out to the outside via a fuse 6.
An exterior resin 4 is provided.
前述した従来のヒユーズ付き固体電解コンデン
サは、第4図に示すように、発泡樹脂2で表面の
少なくとも1部を被覆したヒユーズ6を、コンデ
ンサ素子5と陰極外部端子3との間に、はんだに
より介挿接続したものである。そのため、第1の
欠点として、はんだ付けの際、コンデンサ素子が
破損しない程度の低温はんだを用いなければなら
ず、これでは固着力がよくない。固着力を高める
ため、高温はんだを用いると、コンデンサが高熱
に耐えられないという欠点がある。第2の欠点と
して、発泡樹脂面積が狭く、このためにユーズの
溶断が完全になされず、溶断後のヒユーズ材料が
再び付着し、短絡(シヨート)状態になり、電気
的な接続を保持し続けてしまうという欠点があ
る。
In the conventional solid electrolytic capacitor with a fuse described above, as shown in FIG. This is an interposed connection. Therefore, the first drawback is that during soldering, low temperature solder must be used that does not damage the capacitor element, which does not provide good adhesion. If high-temperature solder is used to increase adhesion, the drawback is that the capacitor cannot withstand high heat. The second drawback is that the area of the foamed resin is small, which prevents the fuse from being completely blown, resulting in the fuse material being reattached after being blown, resulting in a short circuit and continuing to maintain electrical connection. It has the disadvantage of being
本発明の目的は、前記欠点が解決され、短絡事
故の際すみやかに溶断し、再び短絡することのな
いようにした固体電解コンデンサを提供すること
にある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a solid electrolytic capacitor which solves the above-mentioned drawbacks, which quickly melts down in the event of a short circuit accident, and which prevents short circuits from occurring again.
本発明の固体電解コンデンサの構成は、断熱性
を有する発泡樹脂で表面の少なくとも一部を、被
覆した形状記憶合金を固体電解コンデンサ素子と
外部端子との間に介挿接続し、絶縁外装したこと
を特徴とする。
The structure of the solid electrolytic capacitor of the present invention is such that a shape memory alloy whose surface is coated at least in part with a foamed resin having heat insulating properties is inserted and connected between a solid electrolytic capacitor element and an external terminal, and an insulating exterior is provided. It is characterized by
次に本発明について図面を参照して詳細に説明
する。
Next, the present invention will be explained in detail with reference to the drawings.
第1図は本発明の一実施例の固体電解コンデン
サの断面図である。同図において、本固体電解コ
ンデンサは、例えばタンタルなどの弁作用金属の
陽極体を陽極酸化し、その上に二酸化マンガン層
5a、カーボン層5b、銀ペースト層5cを順次
被着させ、最外層に陽極部を有する固体電解コン
デンサ素子(以後素子と略称)5が形成される。
さらに、この素子5に植立された陽極リード8
と、陽極外部端子7とを、溶接等の手段により接
続する。次に、素子5と形状記憶合金1の端部1
aとを導電性接着剤等で接続した後、この形状記
憶合金1のもう一方の端部1bを陰極外部端子3
と接触接続し、その後、エポキシ等の外装樹脂4
で絶縁外装し、固体電解コンデンサを形成する。 FIG. 1 is a sectional view of a solid electrolytic capacitor according to an embodiment of the present invention. In the figure, the present solid electrolytic capacitor is constructed by anodizing an anode body made of a valve metal such as tantalum, and sequentially depositing a manganese dioxide layer 5a, a carbon layer 5b, and a silver paste layer 5c thereon. A solid electrolytic capacitor element (hereinafter abbreviated as element) 5 having an anode portion is formed.
Furthermore, an anode lead 8 planted on this element 5
and the anode external terminal 7 are connected by means such as welding. Next, the element 5 and the end portion 1 of the shape memory alloy 1
a and then connect the other end 1b of the shape memory alloy 1 to the cathode external terminal 3.
and then apply exterior resin 4 such as epoxy.
with an insulated exterior to form a solid electrolytic capacitor.
第2図は、前述第1図の形状記憶合金1の介挿
接続部分の拡大した断面図である。第2図に示す
如く、例えばジグザグに折り曲げた形状記憶合金
1の端部1aを素子5と導電性接着剤等で接続
し、もう一方の端部1bを陰極外部端子3と接触
接続する。 FIG. 2 is an enlarged cross-sectional view of the insertion connection portion of the shape memory alloy 1 shown in FIG. 1. As shown in FIG. 2, for example, an end portion 1a of the shape memory alloy 1 bent in a zigzag manner is connected to the element 5 using a conductive adhesive or the like, and the other end portion 1b is contact-connected to the cathode external terminal 3.
次に熱可塑性樹脂のエマルジヨンに発泡材を加
えた発泡樹脂材料等の、内部に気泡を発生させう
る発泡樹脂2で橋絡した形状記憶合金1の少なく
とも1部を覆うように被着させたのち、発泡処理
をする。 Next, a foamed resin material 2 that can generate air bubbles inside, such as a foamed resin material made by adding a foaming material to a thermoplastic resin emulsion, is applied so as to cover at least a portion of the bridged shape memory alloy 1. , perform foaming treatment.
この発泡処理により、形状記憶合金1の表面
は、気泡を含んだ発泡樹脂2にて覆われる。 By this foaming treatment, the surface of the shape memory alloy 1 is covered with the foamed resin 2 containing air bubbles.
本実施例では、気体を含んで膨れた発泡樹脂2
で形状記憶合金1の周囲が覆われているので、そ
の断熱効果により比較的低い電流で形状記憶合金
1が収縮変形し、陰極外部端子3と素子5とを切
り離し、直ちに開放状態にできる。 In this embodiment, the foamed resin 2 swelled with gas is used.
Since the periphery of the shape memory alloy 1 is covered with the heat insulating effect, the shape memory alloy 1 contracts and deforms with a relatively low current, and the cathode external terminal 3 and the element 5 can be separated and immediately opened.
第3図は本発明の他の実施例の固体電解コンデ
ンサ断面図である。同図において、本実施例の固
体電解コンデンサは、前記一実施例と同様にし
て、銀ペースト層5a、カーボン層5b、二酸化
マンガン層5c等を有する固体電解コンデンサ素
子5を形成する。次に、この素子5に植立された
陽極リード8と、断面形状L字状に形成した陽極
外部端子7とを、溶接等の手段により、接続す
る。次に、陰極外部端子3の端部3aと、形状記
憶合金1の端部1bとを導電性接着材等により接
続した後、形状記憶合金1のもう一方の端部1a
を素子5の陰極部に接触接続し、その後樹脂デツ
プ等の手段により、エポキシ等の外装樹脂4で絶
縁外装し、固体電解コンデンサを形成する。 FIG. 3 is a sectional view of a solid electrolytic capacitor according to another embodiment of the present invention. In the figure, in the solid electrolytic capacitor of this embodiment, a solid electrolytic capacitor element 5 having a silver paste layer 5a, a carbon layer 5b, a manganese dioxide layer 5c, etc. is formed in the same manner as in the previous embodiment. Next, the anode lead 8 planted on this element 5 and the anode external terminal 7 formed into an L-shaped cross section are connected by means such as welding. Next, after connecting the end 3a of the cathode external terminal 3 and the end 1b of the shape memory alloy 1 with a conductive adhesive or the like, the other end 1a of the shape memory alloy 1 is connected.
is connected to the cathode portion of the element 5, and then insulated with an exterior resin 4 such as epoxy using a resin dip or the like to form a solid electrolytic capacitor.
次に、熱可塑性樹脂のエマルジヨンに発泡材を
加えた発泡樹脂材料等の、内部に気泡を発生させ
うる発泡樹脂2、橋絡した形状記憶合金1の少な
くとも1部を覆うように被着させたのち発泡処理
をする。 Next, a foamed resin material 2 that can generate air bubbles inside, such as a foamed resin material made by adding a foaming material to a thermoplastic resin emulsion, was applied so as to cover at least a portion of the bridged shape memory alloy 1. Later, foaming treatment is performed.
この発泡処理により、形状記憶合金1の表面は
気泡を含んだ発泡樹脂2にて覆われる。 By this foaming treatment, the surface of the shape memory alloy 1 is covered with the foamed resin 2 containing air bubbles.
以上説明したように、本発明は次の効果があ
る。
As explained above, the present invention has the following effects.
(i) 形状記憶合金を、形状変形の妨害とならない
発泡樹脂で覆うことができるので、固体電解コ
ンデンサ素子と外部端子とを完全に開放(オー
プン)状態にすることができる。(i) Since the shape memory alloy can be covered with a foamed resin that does not interfere with shape deformation, the solid electrolytic capacitor element and the external terminal can be completely opened.
(ii) 形状記憶合金を発泡樹脂で覆うことにより、
形状記憶合金から周囲への熱電導が少なくな
り、形状記憶合金の形状変形電流を低く押える
ことができるので、コンデンサ素子が過渡に発
熱し、燃えるなどの事故を防止することができ
る。(ii) By covering the shape memory alloy with foamed resin,
Since the heat conduction from the shape memory alloy to the surroundings is reduced and the shape deformation current of the shape memory alloy can be kept low, accidents such as the capacitor element overheating and burning can be prevented.
(iii) 形状記憶合金を接続する際、特に導電性接着
剤等を利用し接続できるので、はんだ溶け等に
よる短絡故障を防止することができる。(iii) When connecting shape memory alloys, it is possible to use a conductive adhesive or the like to prevent short-circuit failures due to solder melting, etc.
第1図は本発明の一実施例の固体電解コンデン
サの断面図、第2図は第1図のコンデンサの主要
部を拡大した断面図、第3図は本発明の他の実施
例の固体電解コンデンサの断面図、第4図は従来
のヒユーズ付き固体電解コンデンサの断面図であ
る。
1……形状記憶合金、2……発泡樹脂、3……
陰極外部端子、4……外装樹脂、5a……二酸化
マンガン層、5b……カーボン層、5c……銀ペ
ースト層、5……(固体電解コンデンサ)素子、
6……ヒユーズ、7……陽極外部端子、8……陽
極リード。
FIG. 1 is a sectional view of a solid electrolytic capacitor according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the main part of the capacitor shown in FIG. 4 is a sectional view of a conventional solid electrolytic capacitor with a fuse. 1... Shape memory alloy, 2... Foamed resin, 3...
Cathode external terminal, 4... Exterior resin, 5a... Manganese dioxide layer, 5b... Carbon layer, 5c... Silver paste layer, 5... (Solid electrolytic capacitor) element,
6...Fuse, 7...Anode external terminal, 8...Anode lead.
Claims (1)
一部を被覆した形状記憶合金を、固体電解コンデ
ンサ素子と陰極外部端子との間に介挿接続し、絶
縁外装したことを特徴とする固体電解コンデン
サ。 2 発泡樹脂が熱可塑性樹脂に発泡材を加えた材
料からなる特許請求の範囲第1項記載の固体電解
コンデンサ。[Claims] 1. A shape memory alloy whose surface is at least partially covered with a foamed resin having heat insulating properties is inserted and connected between a solid electrolytic capacitor element and a cathode external terminal to form an insulating exterior. solid electrolytic capacitor. 2. The solid electrolytic capacitor according to claim 1, wherein the foamed resin is made of a material obtained by adding a foaming material to a thermoplastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14462087A JPS63307716A (en) | 1987-06-09 | 1987-06-09 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14462087A JPS63307716A (en) | 1987-06-09 | 1987-06-09 | Solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63307716A JPS63307716A (en) | 1988-12-15 |
| JPH0513532B2 true JPH0513532B2 (en) | 1993-02-22 |
Family
ID=15366270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14462087A Granted JPS63307716A (en) | 1987-06-09 | 1987-06-09 | Solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63307716A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106028A (en) * | 1988-10-15 | 1990-04-18 | Matsushita Electric Ind Co Ltd | Molded chip tantalum solid electrolytic capacitor |
| JP2010066458A (en) * | 2008-09-10 | 2010-03-25 | Konica Minolta Holdings Inc | Actuator and driving device |
-
1987
- 1987-06-09 JP JP14462087A patent/JPS63307716A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63307716A (en) | 1988-12-15 |
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