JPH0519992Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Field of the Invention> This invention relates to a solid-state relay that controls switching of loads using power semiconductor elements such as thyristors and triacs.

<Prior art and its problems> Conventionally, as this type of relay, as shown in FIG. 11, a power semiconductor element (not shown) such as a triac is built in the base side of a heat sink 201 having a fin portion 201a. Electrically insulating case 202
There is one in which the heat sink 203 is exposed and fixed, and the case 202 is attached to the heat sink 201 with the heat sink 203 in contact with the base of the heat sink 201.

By the way, in this type of relay, in order to minimize the installation space, the heat radiator 101 is
There is a desire to reduce the width W of the device to make it thinner.

However, in the above configuration, since the heat sink 203 is arranged along the surface of the base of the heat sink 201, when the width dimension W becomes smaller, the heat sink 203
The contact area between the heat radiator 201 and the heat radiator 201 becomes smaller, resulting in a decrease in the heat radiation effect.

<Purpose of the invention> This invention was made in view of the above circumstances.
The purpose of the present invention is to provide a solid state relay that can be made thinner without reducing heat dissipation.

<Structure and Effects of the Invention> The solid state relay according to the invention has a groove formed in the front surface of the base of the heatsink having a mounting part on the tip side of the fin part, and an electrically insulating case containing at least a power semiconductor element as described above. Press fit into the groove and install.
A heat radiating plate, which is disposed vertically with respect to the front surface of the base of the radiator and is fixed to the case in an exposed state, is brought into contact with the inner wall of the groove.

According to this invention, since the heat sink is vertical to the front surface of the base of the heat sink, when the case is press-fitted into the groove formed at the base of the heat sink, the heat sink has a large area on the inner wall of the groove. This makes it possible to achieve an effective heat dissipation effect, and as a result, the thickness can be reduced.

<Description of Embodiment> An embodiment of this invention will be described below with reference to the drawings.

FIGS. 1 and 2 are a perspective view and an electric circuit block diagram, respectively, showing an example of a solid state relay according to this invention.

In the figure, 1 is a relay main body, 2 is a power circuit cartridge, 3 is a heat radiator that requires a fin portion 3a, and 4 is a mounting device as a mounting portion that is mounted on the tip side of the fin portion 3a. The relay body 1 is 1
It consists of a control circuit block 10 having a pair of input terminals 5 ₁ , 5 ₂ and load terminals 6 ₁ , 6 ₂ and incorporating a control circuit 9 consisting of an input circuit 7 and a trigger circuit 8 , and the heat sink 3 . , control circuit block 10
is mounted on the front surface 3c side of the base 3b of the radiator 3. The power circuit cartridge 2 has a built-in power circuit 13 having a power semiconductor element driven by the trigger circuit 8 to open and close a load (not shown), such as a triax 11 and an absorber circuit 12 for absorbing surges, and is connected to the relay. It is adapted to be attached to the main body 1 side in a detachable and electrically connectable manner.

The solid state relay described above will be described in detail below. Third
The figure is an exploded perspective view of the solid state relay.

In the figure, 21 is a base made of insulating synthetic resin in the aforementioned control circuit block 10;
An opening 22 is formed approximately in the center of the rectangular bottom wall portion 21a, and a standing wall 21b is formed at one end in the width direction (left and right direction).
A box-shaped bag-like part 21c for storing substrates is formed adjacent to the other end of the bottom wall part 21a in the width direction and protrudes rearward. Furthermore, the bottom wall portion 2
Nut holding portions 23 ₁ and 23 ₂ are formed at both longitudinal ends of 1a, and pier-shaped input terminal holding portions 24 ₁ and 24 are formed at the open end of bag-like portion 21c. ₂ is installed protrudingly. 25 ₁ ,
Nuts 25 ₂ are for load terminals fitted into the nut holding parts 23 ₁ and 23 ₂ , respectively, and nuts 26 ₁ and 26 ₂ are input terminal nuts installed in the input terminal holding parts 24 ₁ and 24 ₂ .

Reference numeral 27 denotes a printed wiring board housed in the bag-shaped portion 21c with the board surface extending in the front-rear direction, that is, perpendicular to the front surface 3c of the base of the radiator 3 as shown in FIGS. 4 and 5. , the control circuit component 28, an operation display light emitting element 29, etc. are mounted. 30 ₁ and 30 ₂ are the bag-like portions 21c.
This is a board insertion guide groove formed on the inner wall of the board, and also has a positioning function.

The input terminals 5 ₁ , 5 ₂ are made of U-shaped metal fittings, and are fixed to predetermined positions on the printed wiring board 27 with solder or the like and electrically connected to the input circuit 7 . The input terminal nuts 26 ₁ and 26 ₂ are held between the input terminal holding parts 24 ₁ and 24 ₂ at the respective positions.
31 ₁ , 31 ₂ are input terminal screws 32 ₁ , 32 ₂ formed in the input terminals 5 ₁ , 5 _{2 ,} respectively _, which are screwed into the input terminal nuts 26 ₁ , 26 ₂ ; 33 ₂ is wassiya.

At both ends of the printed wiring board 27 in the longitudinal direction, there are a pair of trigger signal terminal plates 34 ₁ , 34 ₂ each consisting of a pair of thin metal plates for obtaining a trigger signal from the load line to the above-mentioned triax 11 .
are electrically connected and fixed by soldering, and each terminal board 34 ₁ , 34 ₂ has the load terminal nut 25 ₁ ,
Holes 35 ₁ and 35 ₂ are formed corresponding to the holes 25 ₂ , respectively.

The load terminals 6 ₁ and 6 ₂ are connected to the terminal plates 34 ₁ and 3
4 ₂ , and the load terminal screw 36 ₁ ,
Through holes 37 ₁ and 37 ₂ of 36 ₂ are formed, and sockets 38 and 39 for connecting the T ₁ and T ₂ terminals of the triac 11 are connected, respectively. 40 ₁ and 40 ₂ are the nut holding parts 23 ₁ and 2
3 Load terminal positioning frame piece formed in ₂ , 4
Reference numeral 1 denotes a gate socket 42 1 , 4 electrically connected and fixed to the wiring board 27 by soldering or the like as shown in FIG. 4 in parallel with the T ₁ terminal connection socket ₃₈ .
2 ₂ is a load terminal washer.

43 ₁ and 43 ₂ are the input terminals 5 ₁ and 5 ₂ , respectively.
The terminal pieces are electrically connected to the base end portions _21a and _21b of the base 1 through lead wires 441 and 442, and shaft holes ₄₅₁ and ₄₅₂ formed in the base end portions 21a and 21b of the base 1 are fitted to support pins 46 formed in the vertical wall portion 21b of the base 1 as shown in FIG.
_The solid-state relays are rotatably fitted into the control circuit block ₁₀ and are configured to be retractably protruded from the width direction side of the control circuit block 10 so as to be connected to the input terminals of the adjacent relays when a plurality of solid-state relays are used in series.

Reference numeral 49 denotes a substantially box-shaped case made of synthetic resin with an open rear end that is fitted onto the base 21, and has a through portion 50 that corresponds to the opening 22 and communicates from the front side to the rear side.
are formed, and further input terminal exposure windows 51 ₁ , 51 ₂
, load terminal exposure windows 52 ₁ , 52 ₂ , an operation display window 53 , and entrance/exit holes 54 ₁ , 54 ₂ (FIG. 4) for connecting terminal pieces 43 ₁ , 43 ₂ , etc. are formed.
Further, both side walls 49a in the width direction of the case 49,
Engagement protrusions 56, 56 are formed on each inner surface of 49b to engage with engagement grooves 55, 55 formed along the longitudinal direction on both sides of the base 3b of the radiator 3 in the width direction. There is. At the center of each of the side walls 49a, 49b, there are recessed notches 57, 57 extending in the front-rear direction.
are formed respectively.

58, 59 and 60 are the triacs 11 in the power circuit cartridge 2, respectively.
The triax 11, which is the _T1 terminal, _T2 terminal and gate terminal, and is formed into a thin plate shape, is shown in Fig. 6A-
As shown in C, it is sandwiched between the T ₁ terminal 58 and the T ₂ terminal 59 in a sandwich shape, and is bonded and fixed with solder or the like. The area of _T2 terminal 59 is
It is set wide in order to lower the thermal resistance against the heat generated by the triac 11. 61 and 62 are respectively
The sockets 38 and 39 are connected to the T ₁ and T ₂ terminals 58 and 59 via lead portions 58a and 59a, respectively.
The connecting blade piece 63 is led out to a position corresponding to the gate terminal 60 via the lead portion 60a to a position corresponding to the gate terminal socket 41, that is, a position parallel to the connecting blade piece 61. This is a connecting blade for gate terminals. A protruding piece 64 that protrudes forward is formed on the connecting blade piece 61, and a thermo label 6 for displaying the temperature of the triax 11 is provided on the bent surface of the tip of this protruding piece 64.
5 is attached.

66 is a heat sink for transmitting the heat of the triax 11 to the heat sink 3;
It is disposed in a vertical position with respect to the front surface 3c of the base, and a convex portion 66a is integrally formed on the surface on the side of the triax 11. 67 is the heat sink 66 and the above
This is an insulating plate inserted between the _T2 terminal 59 to ensure insulation between the triax 11 and the heat sink 66, and the area corresponding to the _T2 terminal 59 is metalized. There is.

Reference numeral 68 denotes an electrically insulating case in the power circuit cartridge 2, and as shown in FIGS. 7 and 8, a terminal accommodating portion 69 and a
The board installation section 70 is connected to the front side of the board, and is formed into a substantially L-shaped box shape as a whole. 7
Reference numeral 1 denotes an opening formed in one side wall of the terminal accommodating portion 69. 72 is an opening of the substrate installation section 70. Reference numeral 73 denotes a rod-shaped portion formed of the side wall of the terminal accommodating portion 69 and extending in the front-rear direction, and is a wedge-shaped portion between the periphery of the heat sink 66 and the insulating plate 67 when the block 74 such as the triax 11 is accommodated. It has a function of fitting into the gap 75 (FIG. 6C) and guiding it. Reference numeral 76 denotes a heat sink insertion hole formed in the bottom wall of the board installation section 70. The triax block 74 accommodated in the terminal accommodating portion 69 is covered with silicone rubber 77, as shown in FIG. 8, to make it less susceptible to the effects of outside air and foreign matter.

78 is a leaf spring for pressing a metal heat sink;
A portion 78a facing the outer surface of the other side wall of the terminal accommodating portion 69 is formed into a substantially dogleg shape so as to be elastically deformable, and a holding piece 78b connected to the rear end is connected to the bottom wall of the terminal accommodating portion 69. It's locked.

Reference numeral 79 denotes a printed wiring board for setting an absorber circuit, on which a high-voltage chip varistor 80, a chip capacitor 81, etc. are mounted, and is arranged in the board installation section 70. Reference numerals 82 and 83 indicate cut grooves formed in the wiring board 79 into which the bases of the connection blade pieces 61 and 62 for the T ₁ and T ₂ terminals are inserted and positioned, respectively; 84 indicates the cut grooves in the wiring board 79;
This is a cutout portion into which the base of the connecting blade piece 63 for the gate terminal is inserted and positioned. Each of the connection blade pieces 61, 62 and 63 is connected to the wiring board 7.
9 and are electrically connected to each other by soldering.

Reference numeral 85 denotes a synthetic resin cartridge cover fitted to the front side of the cartridge case 68, and the see-through window 86 of the thermolabel 65 is provided on the front side.
is formed. Furthermore, this cartridge cover 85 has engaging protrusions 87, 8 formed on the side of the cartridge case 69 as shown in FIG.
an elastic piece 9 having engagement holes 89 and 90 that engage with 8;
1,92 are provided protrudingly. Reference numerals 93 and 94 denote first and second slits formed in the elastic pieces 91 and 92, respectively, and the connecting blade pieces 61 and 62
The position of each tip is regulated. 95 is elastic piece 9
This is a third slit formed in the third slit 2 to restrict the position of the tip end side of the gate terminal connecting blade piece 63.

A plurality of grooves 96 ₁ , 96 ₂ extending in the longitudinal direction are formed by pultrusion on the base 3 b of the radiator 3 , and one groove 96 ₁ is a bag-shaped portion of the base 21 of the control circuit block 10 . 21c, and the other groove 96 ₂
is set as a fitting recess for the terminal accommodating portion 69 in the power cartridge 2. When the terminal accommodating portion 69 is fitted into the groove portion 96 ₂ , the heat dissipating plate 66 is pressed against the inner wall of the groove portion 96 ₂ by the spring force of the dogleg 78 a of the leaf spring 78 .

Reference numeral 97 denotes a connecting piece portion that integrally connects the distal end sides of the fin portions 3a of the heat radiator 3, and is formed by pultrusion molding of the heat radiator 3. The connecting piece portions 97 are located at both ends of the radiator 3 in the width direction.
, rib walls 99 ₁ and 99 ₂ are formed to face each other in the longitudinal direction, and opposite ends 98 of the mounting board 98 in the width direction are formed on each opposing surface of the rib walls 99 ₁ and 99 ₂ .
grooves 100 ₁ into which a and 98b are fitted, respectively;
100 ₂ is formed when the heat sink 3 is pultruded.

The mounting board 98 is a press-molded substantially rectangular metal plate, and integrally has mounting pieces 101 and 102 for screwing, which are used when screwing to a control panel (not shown), etc., at both ends in the longitudinal direction. It is installed protrudingly. Reference numeral 103 designates a fixing piece that is protruded from one end of the mounting board 98 in the longitudinal direction and is caulked to one end surface of the connecting piece 97;
It functions as a stopper from coming off in one direction in the longitudinal direction. Reference numeral 104 denotes a regulating piece bent forward at the other end of the mounting board 98 in the longitudinal direction, that is, toward the radiator 3 side, and is in contact with the other end surface of the connecting piece 97 to prevent the mounting board 98 from being bent in the longitudinal direction. It functions as a stopper for the other side.

A pair of vertical wall pieces 105 ₁ , 105 ₂ are bent and formed on both sides of the mounting board 98 in the longitudinal direction and stand upright from the surface of the mounting board ₉₈ in the longitudinal direction. As shown in FIG. 5, 105 ₂ includes a fitting groove 107 into which one rail piece 106 a of the rail member 106 is fitted, and a support that supports the rail piece 106 a away from the rib walls 99 ₁ and 99 _{2 .} A protrusion 108 is formed.

The other end 98d of the mounting board 98 in the longitudinal direction is formed in a raised step shape, and the step portion 98
A notch hole 109 is formed in e. 110
is a fixture rail formed from a metal plate with a substantially U-shaped cross section, and is disposed in the space between the other end portion 98d and the connecting piece portion 97, and is movable forward and backward in the longitudinal direction of the mounting board 98. The other rail piece 106 of the rail member 106 protrudes from the notch hole 109 at one end thereof.
A fitting portion 110a that fits into b is integrally formed.

111 is a long hole formed in the fixture rail 110 and passing through the regulating piece 104;
The elongated hole 111 and the regulating piece 104 guide the movement of the fixture rail 110. Reference numeral 112 denotes a spring seat piece 113 bent and formed on the fixture rail 110 and the regulating piece 104.
This is a coil spring interposed between and applies a spring force to the fixture rail 110 in the advancing direction (direction of arrow a). Reference numeral 114 indicates an operation piece for unfitting that is bent toward the other end of the fixture rail 110, and 115 indicates an operation piece formed on the inner wall of the cutout hole 109 in the mounting board 98 to support the other rail piece portion 106b of the rail member 106. It is a supporting piece.

The procedure for assembling the solid state relay described above is as follows.

Nut holding parts 23 ₁ , 23 ₂ in the base 21
Insert the load terminal nuts 25 ₁ and 25 ₂ into the nut holding parts 24 ₁ and 24 2, and insert the input terminal nuts 2 into the nut holding parts 24 1 and 24 _2.
After installing 6 ₁ and 26 ₂ , the control circuit component 28
, input terminals 5 ₁ , 5 ₂ , and terminal boards 34 ₁ , 3
The printed wiring board 27 with the circuit board 4 ₂ mounted thereon is inserted into the board insertion grooves 30 ₁ and 30 ₂ and housed in the bag-shaped portion 21c as shown in FIGS. 4 and 5. As a result, the input terminal nuts 26 ₁ , 26 ₂ are held between the nut holding parts 24 ₁ , 24 ₂ and the input terminals 5 ₁ , 5 ₂ , and the terminal plates 34 ₁ , 34 ₂ are held against the load. It is arranged opposite to the terminal nuts 25 ₁ and 25 ₂ . Next, the pair of load terminals 6 ₁ and 6 ₂ are installed on the terminal plates 34 ₁ and 34 ₂ as shown in FIG. 4.

On the other hand, the fixture rail 110 is connected to the coil spring 1
12 to the mounting board 98, the mounting board 98 is inserted between the grooves 100 ₁ and 100 ₂ on the radiator 3 side, and the fixing piece 103 is caulked to the connecting piece 97. Fix it to the heat sink 3.

Further, the bag-shaped portion 21c of the base 21 is fitted into one of the groove portions 96 ₁ on the radiator 3 side. Furthermore, connect the connecting terminal pieces 43 ₁ , 43 ₂ to the support pins 4 on the base 21 side.
6 ₁ and 46 ₂ , the control circuit block side case 49 is externally fitted onto the base 21, and the engagement protrusions 56, 56 of the case 49 are inserted into the engagement grooves 55, 56 of the radiator 3, respectively. 55, the base 21 is placed between the case 49 and the radiator 3.
are sandwiched and held, a pair of input terminals 31 ₁ and 31 ₂ are exposed through exposure windows 51 ₁ and 51 ₂ , and a pair of load terminals 6 ₁ and 6 ₂ are further exposed through exposure windows 52 ₁ and 52 ₂ . . Next, the input terminal nuts 26 ₁ , 26 ₂
Screw the input terminal screws 32 ₁ , 32 ₂ into the load terminal nuts 25 1 , 25 2 , and screw the load terminal screws 36 ₁ , 36 ₂ into the load terminal nuts 25 1 , 25 ₂ .
36 Screw on ₂ .

On the other hand, the tryk 11 is fixed with solder or the like so as to be sandwiched between the _T1 terminal 58 and the _T2 terminal 59 in a sandwich-like manner, and the gate terminal 60 is also connected to the tryk 1.
Connect to 1. Furthermore, a heat sink 66 is bonded to the opposite side of the _T2 terminal 58 via an insulating plate 67, as shown in FIG. 6A.
A block 74 shown in .about.C is constructed. The gap 75 between the periphery of the insulating plate 67 and the periphery of the heat sink 66 in this block 74 is
The heat dissipation insertion hole 76 is fitted and guided by the wedge-shaped part 73 of the
When the heat radiating plate 66 is inserted into the terminal accommodating portion 69, the heat radiating plate 66 is joined to the outer surface of the lattice portion 73 so as to close the opening 71. Silicone rubber 77 is injected into the terminal accommodating portion 69 to cover the triax 11 and the like. Further, a leaf spring 78 is attached to the outer surface of the terminal accommodating portion 69.

Thereafter, the printed wiring board 79 on which the absorber circuit components 80, 81, etc. are mounted is installed on the cartridge case 68 side, and the cut groove 8
After fitting the connecting blade pieces 61 and 62 into the notches 2 and 83 respectively, and fitting the connecting blade piece 63 into the notch 84, these connecting blade pieces 61 to 63 are attached to the printed wiring board 79.
Connect electrically with solder. The engagement holes 89 and 90 of the cartridge cover 85 are engaged with the engagement protrusions 87 and 88 on the case 68 side, thereby coupling the cover 85 and the case 68 as shown in FIGS. 7 and 8. As a result, the thermolabel 65 is set to correspond to the see-through window 86, and the power circuit cartridge 2 is configured.

Finally, the power circuit cartridge 2 is fitted into the penetration part 50 of the case 47 in the control circuit block 10, and the terminal accommodating part 69 is inserted into the base 21.
When the heat sink plate 66 is inserted into the other groove 96 ₂ on the side of the radiator 3 through the opening 22 , the spring force of the leaf spring 78 acts, and the heat radiator plate 66 is pressed against the inner wall surface of the groove 96 ₂ . At this time, the connecting blade pieces 61, 62, and 63 are fitted into the sockets 38, 39, and 41, respectively, and the _T1 terminal and _T2 terminal 58, 59 are electrically connected to the pair of load terminals ₆₁ , _62, respectively. The gate terminal 60 is also connected to a predetermined circuit.

In the above configuration, the mounting device 4 is used for mounting during use. When mounting on a panel surface (not shown), the mounting piece 10 on the mounting board 98
1, 102 is screwed to the panel surface and attached to the rail member 106, the fitting part 110a on the tip side of the fixture rail 110 and the fitting groove 1
07, the rail pieces 106a and 106b may be inserted between them.

(not shown) is connected to a pair of load terminals 6 ₁ , 6 ₂ and an input signal is applied between a pair of input terminals 5 ₁ , 5 ₂ , the light emitting element 29 lights up, and this is displayed in the operation display window. It can be visually recognized from 53. Upon application of the input signal, the trigger circuit 8 operates via the input circuit 7, the triac 11 becomes conductive, and power is supplied to the load.

When the triac 11 generates heat due to the operation of the triac 11, the heat is radiated by the heat radiator 3 via the heat radiating plate 66. On the other hand, if there is a temperature rise due to the above heat generation, the thermolabel 65 will change color, and this can be seen through the see-through window 86 of the cartridge side cover 85, so that the heat generation state of the triac 11 can be easily grasped.

If the triac 11 is destroyed due to a short circuit or abnormal heat generation, the power circuit cartridge 2 may be replaced. That is, if you pull out the power circuit cartridge 2 forward,
Each connecting blade piece 61, 62 and 63 connects to the socket piece 3.
8, 39 and 41, the power circuit cartridge 2 may be removed from the relay main body 1 side, and a new power circuit cartridge 2 may be inserted and installed. In this case, since the power circuit cartridge 2 can be attached and detached by inserting and removing it, replacement work can be performed quickly.

By replacing this power circuit cartridge 2,
Since absorber circuit parts that are prone to deterioration can also be replaced at the same time, the service life can be extended and reliability can be increased.

Furthermore, since the connection state of the load terminals 6 ₁ and 6 ₂ can be left as is, it is possible to contribute to speeding up the above-mentioned replacement work, and there is no risk of incorrect wiring occurring during maintenance.

In particular, since the heat sink 66 in the power circuit cartridge 2 is arranged vertically to the base front surface 3c of the heat sink 3, the groove 9 of the heat sink
By setting the depth of 6 ₂ in accordance with the length of the heat sink 66 in the front-rear direction, the entire exposed surface of the heat sink 66 comes into contact with the inner wall of the groove 96 ₂ as shown in FIG. 9, creating a wide contact. Heat can be effectively radiated under the surface, and in other words, the width W (FIG. 1) of the radiator 3 can be set small. This can be achieved by connecting a plurality of solid state relays M ₁ and M ₂ as shown in FIG.
This is advantageous when ₁ and 5 ₂ are connected in parallel via the connecting terminal pieces 43 ₁ and 43 ₂ . In other words, you can use solid state relays without worrying about heat dissipation.
M ₁ and M ₂ can be made thinner, and as a result, the installation space can be reduced.

Further, the heat dissipation plate 66 is connected to the groove portion 96 by a leaf spring 78.
Since the power circuit cartridge ₂ is in pressure contact with the inner wall of the power circuit cartridge 2, even if dust or the like is attached to the heat dissipation plate 66 or the inner wall of the groove ₉₆₂ ,
Since this can be removed by grinding, the heat dissipation plate 6
Good contact between the groove 96 2 and the inner wall of the groove 96 ₂ can be ensured. Moreover, the spring force of the plate spring 78 prevents rattling when the case is fitted, thereby providing vibration resistance, and in combination with the good contact condition, further improvement of the heat dissipation performance can be ensured. .

Furthermore, in the above example, since the holding piece 78b on the proximal end side of the leaf spring 78 is placed in contact with the heat sink 66, there is an advantage that concentration of the stress of the leaf spring on the case 68 can be avoided.

Further, in the above example, the leaf spring 78 is made of metal, but it may be formed integrally with the case 68 made of synthetic resin.
In this case, the number of parts is reduced.

Furthermore, it is also possible to use a U-shaped one as the heat sink 66 so that it is exposed on both sides of the case 68. In that case, not only can heat dissipation performance be further improved, but also the case 68 can be protected. There are some effects that can be achieved.

Further, the leaf spring 78 may be made of a shape memory alloy material or a bimetal material that deforms to increase the spring force applied to the heat dissipation plate 66 when the temperature becomes high.

In the above embodiment, the power circuit cartridge 2 and the control circuit block 10 are configured separately, but the present invention is not limited to this.

[Brief explanation of the drawing]

Figures 1 and 2 are a perspective view and an electric circuit block diagram showing an example of the solid state relay according to this invention with a power circuit cartridge inserted and removed, respectively, Figure 3 is an exploded perspective view of the entire solid state relay, and Figure 4 5 is a partially cutaway front view and a partially cutaway side view respectively showing the same solid state relay in a power circuit cartridge installed state, and FIGS. 6A, B and C are side views respectively showing a triax block in the same power circuit cartridge. , a bottom view and a rear view, FIGS. 7 and 8 are a partially cutaway side view and a bottom sectional view showing the same power circuit cartridge, respectively, FIG. 9 is a schematic explanatory view of the installed state of the same cartridge, and FIG. 10 11 is an explanatory diagram of a case where a plurality of the same solid state relays are used in series, and FIG. 11 is a schematic explanatory diagram of the conventional solid state relay. 3... Heatsink, 3a... Fin part, 3b... Base, 3c... Front, 4... Mounting part, 11... Power semiconductor element, 66... Heat sink, 68... Case, 78... Board Spring, 96 ₂ ...Groove.

Claims (1)

[Claims for Utility Model Registration] (1) A heatsink having a mounting part on the tip side of the fin part and at least a power semiconductor element built therein, which is mounted by press-fitting into a groove formed in the front surface of the base of the heatsink. An electrically insulating case is arranged in a vertical position with respect to the front surface of the base of the heatsink, and is held in an exposed state by the case, so that when the case is press-fitted into the groove, the inner wall of the groove A solid-state relay comprising: a heat radiator plate that is in contact with the power semiconductor element and transmits heat from the power semiconductor element to a radiator. (2) The solid state relay according to claim 1, wherein the case is provided with a leaf spring that presses the heat dissipation plate against the inner wall of the groove.