JPH0184481U - - Google Patents
Info
- Publication number
- JPH0184481U JPH0184481U JP1987180175U JP18017587U JPH0184481U JP H0184481 U JPH0184481 U JP H0184481U JP 1987180175 U JP1987180175 U JP 1987180175U JP 18017587 U JP18017587 U JP 18017587U JP H0184481 U JPH0184481 U JP H0184481U
- Authority
- JP
- Japan
- Prior art keywords
- heatsink
- case
- groove
- semiconductor element
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図および第２図はそれぞれこの考案に係る
固体継電器の一例をパワー回路カートリツジ脱挿
状態で示す斜視図および電気回路ブロツク図、第
３図は同固体継電器全体の分解斜視図、第４図お
よび第５図はそれぞれ同固体継電器をパワー回路
カートリツジ装着状態で示す一部破断前面図およ
び一部破断側面図、第６図Ａ，ＢおよびＣはそれ
ぞれ同パワー回路カートリツジにおけるトライア
ツクブロツクを示す側面図、下面図および後面図
、第７図および第８図はそれぞれ同パワー回路カ
ートリツジを示す一部破断側面図および下面断面
図、第９図は同カートリツジの装着状態の概略説
明図、第１０図は同固体継電器を複数個連設して
使用する場合の説明図、第１１図は従来の固体継
電器の概略説明図である。
３……放熱器、３ａ……フイン部、３ｂ……基
部、３ｃ……前面、４……取付部、１１……パワ
ー半導体素子、６６……放熱板、６８……ケース
、７８……板ばね、９６２……溝部。
Figures 1 and 2 are a perspective view and an electric circuit block diagram showing an example of the solid state relay according to this invention with a power circuit cartridge inserted and removed, respectively, Figure 3 is an exploded perspective view of the entire solid state relay, and Figure 4 5 is a partially cutaway front view and a partially cutaway side view respectively showing the same solid state relay in a power circuit cartridge installed state, and FIGS. 6A, B and C are side views respectively showing a triax block in the same power circuit cartridge. , a bottom view and a rear view, FIGS. 7 and 8 are a partially cutaway side view and a bottom sectional view showing the same power circuit cartridge, respectively, FIG. 9 is a schematic explanatory view of the installed state of the same cartridge, and FIG. 10 11 is an explanatory diagram of a case where a plurality of the same solid state relays are used in series, and FIG. 11 is a schematic explanatory diagram of a conventional solid state relay. 3... Heatsink, 3a... Fin part, 3b... Base, 3c... Front, 4... Mounting part, 11... Power semiconductor element, 66... Heat sink, 68... Case, 78... Board Spring, 96 2 ... Groove.
Claims (1)
と、少なくともパワー半導体素子を内蔵し、上記
放熱器の基部前面に形成された溝部に圧入して装
着される電気絶縁性のケースと、上記放熱器の基
部前面に対して鉛直姿勢に配設されるとともに上
記ケースに露出状態で保持されて、上記ケースが
溝部に圧入された際、上記溝部の内壁に接触して
上記パワー半導体素子の熱を放熱器へ伝達する放
熱板とを具備したことを特徴とする固体継電器。 (2) 上記ケースに放熱板を上記溝部の内壁に圧
接する板ばねを設けてなる実用新案登録請求の範
囲第１項記載の固体継電器。[Claims for Utility Model Registration] (1) A heatsink having a mounting part on the tip side of the fin part, and a heatsink containing at least a power semiconductor element, which is press-fitted into a groove formed in the front surface of the base of the heatsink. An electrically insulating case is arranged in a vertical position with respect to the front surface of the base of the heatsink, and is held in an exposed state by the case, so that when the case is press-fitted into the groove, the inner wall of the groove A solid state relay comprising: a heat radiator plate that is in contact with the power semiconductor element and transmits heat from the power semiconductor element to a radiator. (2) The solid state relay according to claim 1, wherein the case is provided with a leaf spring that presses the heat dissipation plate against the inner wall of the groove.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18017587U JPH0519992Y2 (en) | 1987-11-26 | 1987-11-26 | |
| US07/271,220 US5018050A (en) | 1987-11-17 | 1988-11-14 | Solid state relay |
| US07/651,457 US5144155A (en) | 1987-11-17 | 1991-02-05 | Power source apparatus using time sensitive switching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18017587U JPH0519992Y2 (en) | 1987-11-26 | 1987-11-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0184481U true JPH0184481U (en) | 1989-06-05 |
| JPH0519992Y2 JPH0519992Y2 (en) | 1993-05-25 |
Family
ID=31471699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18017587U Expired - Lifetime JPH0519992Y2 (en) | 1987-11-17 | 1987-11-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519992Y2 (en) |
-
1987
- 1987-11-26 JP JP18017587U patent/JPH0519992Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519992Y2 (en) | 1993-05-25 |
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