JPH0528495B2 - - Google Patents

Info

Publication number
JPH0528495B2
JPH0528495B2 JP60199569A JP19956985A JPH0528495B2 JP H0528495 B2 JPH0528495 B2 JP H0528495B2 JP 60199569 A JP60199569 A JP 60199569A JP 19956985 A JP19956985 A JP 19956985A JP H0528495 B2 JPH0528495 B2 JP H0528495B2
Authority
JP
Japan
Prior art keywords
resin
parts
manufactured
modified resin
modified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60199569A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6261336A (ja
Inventor
Teru Okunoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP60199569A priority Critical patent/JPS6261336A/ja
Publication of JPS6261336A publication Critical patent/JPS6261336A/ja
Publication of JPH0528495B2 publication Critical patent/JPH0528495B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Graft Or Block Polymers (AREA)
  • Die Bonding (AREA)
JP60199569A 1985-09-11 1985-09-11 半導体素子 Granted JPS6261336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60199569A JPS6261336A (ja) 1985-09-11 1985-09-11 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60199569A JPS6261336A (ja) 1985-09-11 1985-09-11 半導体素子

Publications (2)

Publication Number Publication Date
JPS6261336A JPS6261336A (ja) 1987-03-18
JPH0528495B2 true JPH0528495B2 (de) 1993-04-26

Family

ID=16410009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60199569A Granted JPS6261336A (ja) 1985-09-11 1985-09-11 半導体素子

Country Status (1)

Country Link
JP (1) JPS6261336A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same
JPH03173007A (ja) * 1989-12-01 1991-07-26 Kao Corp 導電性ペースト及び導電性塗膜

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966129A (ja) * 1982-10-08 1984-04-14 Toshiba Chem Corp 半導体素子

Also Published As

Publication number Publication date
JPS6261336A (ja) 1987-03-18

Similar Documents

Publication Publication Date Title
JPH0528495B2 (de)
JP2748318B2 (ja) 半導体装置
JPH0793331B2 (ja) 半導体素子
JPH0212509B2 (de)
JPH0212508B2 (de)
JPH0528494B2 (de)
JPH0793330B2 (ja) 半導体素子
JPS5966129A (ja) 半導体素子
JP3348131B2 (ja) 化合物半導体装置
JPH0527251B2 (de)
JP2741677B2 (ja) 半導体素子
JP2767606B2 (ja) 半導体素子
JPH05342910A (ja) 導電性ペースト
JPH064814B2 (ja) 半導体ペレット搭載用ペースト
JPH03134907A (ja) 導電性ペースト
JPH07278273A (ja) 化合物半導体装置
JPS63126114A (ja) 導電性ペ−スト
JP3440446B2 (ja) 導電性ペースト
JPS58153338A (ja) 半導体素子
JP2785246B2 (ja) 導電性ペースト
JPH052915A (ja) 半導体装置
JP2004087268A (ja) 導電性ペースト
JPH08245765A (ja) 化合物半導体装置
JPH04274335A (ja) 絶縁ペースト
JPH04274336A (ja) 化合物半導体装置