JPS6261336A - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JPS6261336A
JPS6261336A JP60199569A JP19956985A JPS6261336A JP S6261336 A JPS6261336 A JP S6261336A JP 60199569 A JP60199569 A JP 60199569A JP 19956985 A JP19956985 A JP 19956985A JP S6261336 A JPS6261336 A JP S6261336A
Authority
JP
Japan
Prior art keywords
resin
epoxy
modified resin
modified
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60199569A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528495B2 (de
Inventor
Teru Okunoyama
奥野山　輝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP60199569A priority Critical patent/JPS6261336A/ja
Publication of JPS6261336A publication Critical patent/JPS6261336A/ja
Publication of JPH0528495B2 publication Critical patent/JPH0528495B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors

Landscapes

  • Graft Or Block Polymers (AREA)
  • Die Bonding (AREA)
JP60199569A 1985-09-11 1985-09-11 半導体素子 Granted JPS6261336A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60199569A JPS6261336A (ja) 1985-09-11 1985-09-11 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60199569A JPS6261336A (ja) 1985-09-11 1985-09-11 半導体素子

Publications (2)

Publication Number Publication Date
JPS6261336A true JPS6261336A (ja) 1987-03-18
JPH0528495B2 JPH0528495B2 (de) 1993-04-26

Family

ID=16410009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60199569A Granted JPS6261336A (ja) 1985-09-11 1985-09-11 半導体素子

Country Status (1)

Country Link
JP (1) JPS6261336A (de)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2239244A (en) * 1989-11-14 1991-06-26 David Durand Moisture-resistant electrically conductive cements
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
US5158708A (en) * 1989-12-01 1992-10-27 Kao Corporation Conductive paste and conductive coating film
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966129A (ja) * 1982-10-08 1984-04-14 Toshiba Chem Corp 半導体素子

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5966129A (ja) * 1982-10-08 1984-04-14 Toshiba Chem Corp 半導体素子

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5156771A (en) * 1989-05-31 1992-10-20 Kao Corporation Electrically conductive paste composition
GB2239244A (en) * 1989-11-14 1991-06-26 David Durand Moisture-resistant electrically conductive cements
US5180523A (en) * 1989-11-14 1993-01-19 Poly-Flex Circuits, Inc. Electrically conductive cement containing agglomerate, flake and powder metal fillers
US5183593A (en) * 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
GB2239244B (en) * 1989-11-14 1994-06-01 David Durand Moisture resistant electrically conductive cements and methods for making and using same
US5326636A (en) * 1989-11-14 1994-07-05 Poly-Flex Circuits, Inc. Assembly using electrically conductive cement
US5158708A (en) * 1989-12-01 1992-10-27 Kao Corporation Conductive paste and conductive coating film

Also Published As

Publication number Publication date
JPH0528495B2 (de) 1993-04-26

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