JPH0528777Y2 - - Google Patents

Info

Publication number
JPH0528777Y2
JPH0528777Y2 JP1987151665U JP15166587U JPH0528777Y2 JP H0528777 Y2 JPH0528777 Y2 JP H0528777Y2 JP 1987151665 U JP1987151665 U JP 1987151665U JP 15166587 U JP15166587 U JP 15166587U JP H0528777 Y2 JPH0528777 Y2 JP H0528777Y2
Authority
JP
Japan
Prior art keywords
external lead
lead
unconnected
wide
wide part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987151665U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6457654U (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987151665U priority Critical patent/JPH0528777Y2/ja
Publication of JPS6457654U publication Critical patent/JPS6457654U/ja
Application granted granted Critical
Publication of JPH0528777Y2 publication Critical patent/JPH0528777Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987151665U 1987-10-05 1987-10-05 Expired - Lifetime JPH0528777Y2 (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987151665U JPH0528777Y2 (2) 1987-10-05 1987-10-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987151665U JPH0528777Y2 (2) 1987-10-05 1987-10-05

Publications (2)

Publication Number Publication Date
JPS6457654U JPS6457654U (2) 1989-04-10
JPH0528777Y2 true JPH0528777Y2 (2) 1993-07-23

Family

ID=31425908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987151665U Expired - Lifetime JPH0528777Y2 (2) 1987-10-05 1987-10-05

Country Status (1)

Country Link
JP (1) JPH0528777Y2 (2)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57115256U (2) * 1981-01-09 1982-07-16
JPS59112954U (ja) * 1983-01-21 1984-07-30 サンケン電気株式会社 絶縁物封止半導体装置

Also Published As

Publication number Publication date
JPS6457654U (2) 1989-04-10

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