JPH05299568A - Method of manufacturing semiconductor device and semiconductor device - Google Patents

Abstract

(57) [Abstract] [Purpose] Regarding a semiconductor device that is resin-sealed using a lead frame, the number of steps of the semiconductor chip mounting process should be increased so that the semiconductor chip mounting process and wire bonding process during manufacturing can be easily inline. The purpose is to shorten the time. A die stage 3 includes a die stage 3 and a plurality of leads 2 arranged around the die stage 3, and the die stage 3 has a central portion 5 having an opening 4 and a pair of clampers 6 and a central portion 5 for sandwiching opposite side surfaces of a semiconductor chip. A step of placing the semiconductor chip C on the central portion 5 and sandwiching it by the clamper 6 for mounting the semiconductor chip on the die stage 3 using the lead frame 1 provided with the tension spring 7 provided over the clamper 6; Vacuum suction (V) from the lower side of the central portion 5 through the opening 4
While performing wire bonding (wire 8),
While performing similar vacuum suction V, a step of performing resin sealing (formation of sealing resin 9) while leaving a passage portion of the vacuum suction V is configured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device which is resin-sealed using a lead frame and a semiconductor device employing the manufacturing method.

The above semiconductor device is manufactured by mounting a semiconductor chip on a die stage of a lead frame, wire-bonding the ends of the leads to each other, and sealing the semiconductor chip, the wires, and the ends of the leads with a resin.

Conventionally, since it takes a long time from mounting a semiconductor chip to wire bonding, the present invention seeks to shorten the time.

[0004]

2. Description of the Related Art A semiconductor device which is resin-sealed with a lead frame is manufactured by using a die stage and a lead frame having a plurality of leads around which tips are arranged, and a semiconductor chip is mounted on the die stage.

Wire bonding is performed between the semiconductor chip and the tip of the lead. By die transfer molding, the die stage, the semiconductor chip, the wires, and the tips of the leads are resin-sealed.

The process is completed after cutting the leads and other post-processes. It is based on the method of sequentially performing. In the conventional example of this manufacturing method, the die stage is a flat plate, and in the above step, a semiconductor chip is attached to the die stage using silver paste,
The semiconductor chip is fixed by heating the silver paste by heating at about 150 ° C.

[0007]

However, in this conventional example, even if the above-mentioned pasting is carried out in a short time, it takes about 3 hours for the above-mentioned heating, so that the above-mentioned turn becomes long,
There is a problem that it is difficult to put the semiconductor chip mounting process and the wire bonding process in-line.

Therefore, the present invention relates to a method of manufacturing a semiconductor device in which a lead frame is used for resin encapsulation, and shortens the number of steps in the semiconductor chip mounting process so that the semiconductor chip mounting process and the wire bonding process can be easily made inline. It is an object of the present invention to provide a semiconductor device adopting the manufacturing method.

[0009]

In order to achieve the above object, a method of manufacturing a semiconductor device according to the present invention comprises a die stage on which a semiconductor chip is mounted and a plurality of leads around which a tip portion is arranged. The die stage uses a lead frame including a central portion having an opening and a pair of clampers for sandwiching opposite side surfaces of a semiconductor chip to be mounted, and a lead frame extending from the central portion to the clamper. The step of mounting the semiconductor chip on the central part and sandwiching it by the clamper as mounting on the die stage, while vacuum suctioning the semiconductor chip mounted on the die stage from the lower side of the central part through the opening. Wire bonding between the semiconductor chip and the tip of the lead, and then vacuum sucking the semiconductor chip from the lower side of the central portion through the opening. While, the wire and the lead tip of the die stage and the semiconductor chip and wire bonding, is characterized by a step of resin-sealing while leaving a passage portion of the vacuum suction.

Further, the semiconductor device is a semiconductor device manufactured by mounting a semiconductor chip on a die stage of a lead frame and sealing it with a resin, and the die stage has a central portion having an opening and opposite side surfaces of the semiconductor chip. It is characterized in that it is provided with a pair of clampers sandwiching the clamps and a tension spring extending from the central portion to the clamper.

[0011]

The mounting of the semiconductor chip on the die stage does not require the silver paste used in the conventional example because the clamper supports the semiconductor chip. Therefore, it is not necessary to heat the silver paste to harden it, and the number of steps in the semiconductor chip mounting process is greatly shortened. This allows the semiconductor chip mounting process and the wire bonding process to be in-line.

In the wire bonding and the resin sealing, the fixing strength of the semiconductor chip is insufficient only by the support by the clamper, but the shortage is compensated by the vacuum suction, so that no trouble occurs.

According to this manufacturing method, the silver paste is removed from the resin-sealed member of the conventional example, and the sealing resin is less likely to crack due to the difference in temperature expansion. Further, since the semiconductor device adopts this manufacturing method, the die stage is as described above.

[0014]

Embodiments of the present invention will be described below with reference to FIGS. 1 is a plan view of a lead frame of the embodiment and a side view in order of manufacturing steps, FIG. 2 is a perspective view for explaining a semiconductor chip mounting step, and FIG. 3 is an in-line configuration diagram of the semiconductor chip mounting step and wire bonding step. is there.

In FIG. 1, the lead frame 1 to be used
Is shown in the plan view of (a), which is obtained by processing a metal flat plate like the lead frame of the conventional example, 2 is a lead,
3 is a die stage.

Like the lead frame of the conventional example, the leads 2 have their tip portions arranged around the die stage 3. The die stage 3 is where a semiconductor chip is to be mounted, but is largely different from the lead frame of the conventional example, and the center portion 5 having the opening 4 as a flat plate and the bent and raised portion 6a.
And four tension springs 7 which are arranged in a zigzag pattern as a flat plate and are provided from the central portion 5 to each clamper 6. The clampers 6 are paired in the left-right direction and the up-down direction in the figure, and the distance between the bent and raised portions 6a facing each other is smaller than the distance between the facing side surfaces of the mounted semiconductor chip.

The essential parts of the manufacturing process of the embodiment using the lead frame 1 are shown in side views of (b1) to (b3). First, as for mounting the semiconductor chip C on the die stage 3, as shown in (b1), the semiconductor chip C is placed on the central portion 5 and the opposite side surface of the semiconductor chip C is sandwiched between the bent and raised portions 6a of the clamper 6. The pinching method is shown in FIG. 2, and each clamper 6 is attached to the claw 10 as shown in FIG.
Then, the claw 10 is removed from the clamper 6 after the semiconductor chip C is placed as shown in FIG. The force clamped by the clamper 6 depends on the tension of the tension spring 7. No silver paste is used here. The semiconductor chip C is supported on the central portion 5 by being clamped by the clamper 6.

Then, as shown in (b2), the semiconductor chip C
While performing vacuum suction (V in the drawing) from below the central portion 5 through the opening 4, wire bonding is performed between the semiconductor chip C and the tip portion of the lead 2. Reference numeral 8 is a wire for wire bonding. Here, the fixing strength of the semiconductor chip C is insufficient only by the support by the clamper 6, but the vacuum suction V compensates for the lack.

Then, as shown in (b3), the semiconductor chip C
While vacuum suction (V in the figure) from the lower side of the central portion 5 through the opening 4, the die stage 3, the semiconductor chip C, the wire 8 and the tip of the lead 2 are transferred by transfer molding.
Resin sealing is performed while leaving the passage portion of the vacuum suction V to form a sealing resin 9 that becomes a package. Here too, the fixing strength of the semiconductor chip C is insufficient only by the support by the clamper 6, but the vacuum suction V compensates for the lack. This vacuum suction V is
This is easily possible by adding a vacuum suction device to the transfer molding machine and adapting the structure of the molding die.

When the process up to now is applied to the conventional process,
The steps up to the conventional example have been completed. The sealing resin 9 exposes the bottom surface of the semiconductor chip C through the opening 4, but rarely deteriorates the characteristics of the semiconductor device. If there is a possibility that the characteristics may deteriorate, the exposed portion may be filled with a separate resin.

After that, the semiconductor device is completed in the same manner as the process of the conventional example. The die stage 3 at the time of completion remains in the state in which the semiconductor chip C was mounted.

According to the above-described method, the mounting of the semiconductor chip C, which is the process of the conventional example, is significantly shortened compared to the case of the conventional example, so that the inline process of the semiconductor chip mounting process and the wire bonding process is easy. Becomes The inline configuration is shown in FIG. In the figure, 11 is an in-loader, 12 is a semiconductor chip mounting portion, 13 is a wire bonding portion, and 14 is an unloader. By supplying the lead frame 1 and the semiconductor chip C to the inloader 11, the semiconductor chip mounting process and the wire bonding process can be automatically advanced, and the wire bonding process-completed product can be taken out from the unloader 14. it can.

[0023]

As described above, according to the present invention, a method of manufacturing a semiconductor device in which a lead frame is used for resin encapsulation and a semiconductor device adopting the manufacturing method are shortened. This has the effect of facilitating the inline operation of the semiconductor chip mounting process and the subsequent wire bonding process. Moreover, the silver paste can be made unnecessary in the semiconductor chip mounting process, and due to the difference in temperature expansion This has the effect of reducing the risk of the resin breaking.

[Brief description of drawings]

FIG. 1 is a plan view of a lead frame and a side view in order of manufacturing steps according to an embodiment.

FIG. 2 is a perspective view for explaining a method of holding a semiconductor chip.

[FIG. 3] In-line configuration diagram of semiconductor chip mounting process and wire bonding process

[Explanation of symbols]

 1 Lead Frame 2 Lead 3 Die Stage 4 Opening Hole 5 Central Part 6 Clamper 6a Bending and Raising Part of Clamper 7 Tensile Spring 8 Wire 9 Sealing Resin 10 Claw 11 Inloader 12 Semiconductor Chip Mounting Part 13 Wire Bonding Part 14 Unloader C Semiconductor Chip V Vacuum suction

Claims (2)

[Claims] 1. A die stage on which a semiconductor chip is mounted, and a plurality of leads having tip portions arranged around the die stage. The die stage sandwiches a central portion having an opening and opposite side surfaces of the semiconductor chip to be mounted. A lead frame comprising a pair of clampers and a tension spring extending from the central portion to the clamper is used, and the semiconductor chip is mounted on the central portion and clamped by the clamper for mounting the semiconductor chip on the die stage. And a step of wire-bonding the semiconductor chip mounted on the die stage between the semiconductor chip and the tip of the lead while vacuum-sucking the semiconductor chip from the lower side of the central portion through the opening. While vacuum-sucking the semiconductor chip from the lower side of the central portion through the opening, the die stage, the semiconductor chip, the wire for wire bonding, and the wire And a step of resin-sealing the leading end of the card while leaving the passage portion for vacuum suction. 2. A semiconductor device manufactured by mounting a semiconductor chip on a die stage of a lead frame and sealing with a resin, wherein the die stage sandwiches a central portion having an opening and an opposite side surface of the semiconductor chip. A semiconductor device comprising a pair of clampers and a tension spring extending from the central portion to the clampers.