JPH054217Y2 - - Google Patents
Info
- Publication number
- JPH054217Y2 JPH054217Y2 JP1987118973U JP11897387U JPH054217Y2 JP H054217 Y2 JPH054217 Y2 JP H054217Y2 JP 1987118973 U JP1987118973 U JP 1987118973U JP 11897387 U JP11897387 U JP 11897387U JP H054217 Y2 JPH054217 Y2 JP H054217Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- pin
- header
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Multi-Conductor Connections (AREA)
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案はピンコネクターに関し、特に薄いプリ
ント基板を三層接続するエレクトロニクス製品に
適する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a pin connector, and is particularly suitable for electronic products that connect three layers of thin printed circuit boards.
（従来の技術）
一般にこの種のピンコネクターには、例えば、
実開昭58−123571号公報に記載のもののように、
電気接続用ピンの中央にリング状圧入部を形成し
て突出させ、プリント基板の穴に圧入して固定し
ていた。(Prior art) Generally, this type of pin connector includes, for example,
Like the one described in Utility Model Application Publication No. 58-123571,
A ring-shaped press-fitting part was formed in the center of the electrical connection pin so that it protruded, and the pin was press-fitted into a hole in the printed circuit board to fix it.
しかし、このようなプレスフイツトピンは、プ
リント基板の厚さが1.6m／ｍ以下では用いるこ
とができない欠点を有していた。 However, such press fit pins have a drawback that they cannot be used when the thickness of the printed circuit board is 1.6 m/m or less.
（考案が解決しようとする問題点）
そこで本考案は、プリント基板の厚さが
1.6m／ｍ以下の薄いものにも用いることができ
るピンコネクターを提供することを目的とする。(Problem that the invention attempts to solve) Therefore, the invention aims to reduce the thickness of the printed circuit board.
The purpose of the present invention is to provide a pin connector that can be used even for thin objects of 1.6 m/m or less.
（問題点を解決するための手段）
即ち、本考案に係るピンコネクターは、電気接
続用ピンをプリント基板の穴に貫通突出させてプ
リント基板に固定するためのピンコネクターにお
いて、ほぼ直方体の絶縁体からなる一対のピンヘ
ツダーとピンレスヘツダーとを有し、ピンヘツダ
ーは、複数の電気接続用ピンをその内部に貫通さ
せた状態で電気接続用ピンと一体に構成し、ピン
レスヘツダーのプリント基板側の面に電気接続用
ピンの数およびプリント基板の穴の位置に対応さ
せた複数の凹所を設け、その凹所には電気接続用
ピンが貫通しうる複数の貫通穴を設け、かつ、そ
の凹所の内部空間に、電気接続用ピンが貫通しう
る複数のハンダリングを設け、ピンヘツダー上に
プリント基板、ハンダリングおよびピンレスヘツ
ダーを順に重ねてハンダリングの熱溶融により電
気接続用ピンをプリント基板に固定した構成を特
徴とする。(Means for solving the problem) That is, the pin connector according to the present invention is a pin connector for fixing an electrical connection pin to a printed circuit board by projecting it through a hole in the printed circuit board. The pin header has a pair of pin headers and a pinless header, and the pin header is configured integrally with the electrical connection pins with a plurality of electrical connection pins passing through the inside thereof, and the electrical connection pins are formed on the printed circuit board side surface of the pinless header. A plurality of recesses are provided corresponding to the number of pins and the positions of the holes on the printed circuit board, and the recesses are provided with a plurality of through holes through which electrical connection pins can pass, and the internal space of the recesses is , is characterized by a configuration in which a plurality of soldering rings through which electrical connection pins can pass are provided, a printed circuit board, solder rings, and a pinless header are stacked in order on the pin header, and the electrical connection pins are fixed to the printed circuit board by thermally melting the solder rings. do.
（作用）
従つて、本考案の構成によれば、ハンダリング
がプリント基板とピンレスヘツダーとの間にピン
を貫通させて設けられているので、ハンダリング
を熱で溶融させることにより、プリント基板の厚
さに関係なく電気接続用ピンをプリント基板に固
定できる。また、ハンダリングをピンレスヘツダ
ーに一括保持させることもできると共に、ピンヘ
ツダーとピンレスヘツダーをプリント基板間の間
隔を一定にするスペーサとすることができる。(Function) Therefore, according to the configuration of the present invention, since the solder ring is provided between the printed circuit board and the pinless header by penetrating the pin, the thickness of the printed circuit board can be reduced by melting the solder ring with heat. Electrical connection pins can be fixed to the printed circuit board regardless of the size. Moreover, the soldering can be held all at once on the pinless header, and the pin header and the pinless header can be used as spacers that keep the distance between the printed circuit boards constant.
（実施例）
以下に本考案を図面の実施例に基いて説明す
る。(Embodiments) The present invention will be described below based on embodiments shown in the drawings.
第１図及び第２図に示すように、プリント基板
１は電気接続用ピン２を貫通する穴３を形成して
おり、本実施例では２本のピン２がプリント基板
１に並列に多数並んでいる。このプリント基板１
の上下面には一対のピンヘツダー４、ピンレスヘ
ツダー５がプリント基板１を挟さむように配置さ
れている。下方のピンヘツダー４はピン２と一体
に構成されており、上方のピンレスヘツダー５は
その下面にハンダリング６を多数固着している。
また、これらのハンダリング６の固着位置はプリ
ント基板１の穴３の位置に対応するもので、第２
図に一点鎖線でその対応する位置を示している。 As shown in FIGS. 1 and 2, the printed circuit board 1 has holes 3 through which electrical connection pins 2 pass, and in this embodiment, a large number of two pins 2 are arranged in parallel on the printed circuit board 1. I'm here. This printed circuit board 1
A pair of pin headers 4 and pinless headers 5 are arranged on the upper and lower surfaces of the board so as to sandwich the printed circuit board 1 therebetween. The lower pin header 4 is constructed integrally with the pin 2, and the upper pinless header 5 has a number of solder rings 6 fixed to its lower surface.
Furthermore, the fixing positions of these soldering rings 6 correspond to the positions of the holes 3 of the printed circuit board 1, and
In the figure, the corresponding positions are indicated by dashed lines.
これら各部品の組込みは、第２図に示すよう
に、先ず、プリント基板１の下方にピン２を有す
るピンヘツダー４を置き、プリント基板１の下方
にハンダリング６付きのピンレスヘツダー５を配
置する。そして第１図に示すように一対のピンヘ
ツダー４、とピンレスヘツダー５でプリント基板
１をのを挟持した状態に保持する。この保持は図
示しないが、第２図の一対のピンヘツダー４、と
ピンレスヘツダー５をその両端で締付装置を用い
て挟持固定する。この後にハンダリング６に熱を
与えてハンダを溶融し、ハンダをプリント基板１
の穴３内に流入させて固定させる。従つて、ハン
ダはピン２をつたわつてプリント基板１の穴３内
に入り、穴内にハンダが充満すると残りのハンダ
は穴付近のプリント基板上に残り固定する。この
場合、第１図に示すように一方のピンレスヘツダ
ー５はほぼハンダリング６の厚さ寸法の高さの支
持部７を形成しており、ピンレスヘツダー５の高
さを変えることでプリント基板１上に設けられた
チツプ部品等の高さに対応することができ、ま
た、ピンヘツダー４とピンレスヘツダー５の高さ
を調節することによりいわゆる三層接続の場合
に、スペーサとしての役割も果している。また、
一対のピンヘツダー４、とピンレスヘツダー５は
プリント基板１のピンコネクター近傍の補強部材
としても機能し、厚さが1.6m／ｍ以下のプリン
ト基板１に最適である。またハンダリング６を一
方のピンレスヘツダー５に固定または保持させる
ことにより他のチツプ部品と同様に半田リフロー
を用いてのピンコネクターの量産が容易である。 To assemble these parts, as shown in FIG. 2, first, a pin header 4 having pins 2 is placed below the printed circuit board 1, and a pinless header 5 with a solder ring 6 is placed below the printed circuit board 1. As shown in FIG. 1, the printed circuit board 1 is held between a pair of pin headers 4 and a pinless header 5. Although this holding is not shown, the pair of pin header 4 and pinless header 5 shown in FIG. 2 are clamped and fixed at both ends using a tightening device. After this, heat is applied to the soldering ring 6 to melt the solder, and the solder is transferred to the printed circuit board 1.
Let it flow into the hole 3 and fix it. Therefore, the solder passes through the pin 2 and enters the hole 3 of the printed circuit board 1, and when the hole is filled with solder, the remaining solder remains on the printed circuit board near the hole and is fixed. In this case, as shown in FIG. 1, one of the pinless headers 5 forms a support portion 7 with a height approximately equal to the thickness of the solder ring 6, and by changing the height of the pinless header 5, it can be placed on the printed circuit board 1. It can correspond to the height of the provided chip parts, etc., and also serves as a spacer in the case of so-called three-layer connection by adjusting the heights of the pin header 4 and pinless header 5. Also,
The pair of pin headers 4 and pinless headers 5 also function as reinforcing members near the pin connectors of the printed circuit board 1, and are most suitable for the printed circuit board 1 with a thickness of 1.6 m/m or less. Furthermore, by fixing or holding the soldering ring 6 to one of the pinless headers 5, it is easy to mass produce pin connectors using solder reflow like other chip parts.
（考案の効果）
このように、本考案の構成によると、プリント
基板を一対のピンヘツダーとピンレスヘツダーで
挟持し、その上下方向に電気接続用ピンを貫通突
出させると共に、ピンレスヘツダーとプリント基
板との間にピンに貫通されたハンダリングを介在
させ固定させたので、プリント基板の厚さに左右
されず、1.6m／ｍ以下の厚さのプリント基板に
も応用ができ、ピンヘツダーとピンレスヘツダー
がプリント基板上のスペーサの機能や、プリント
基板の補強機能を与え、更には、ピンコネクター
の自動化による量産にも適する。(Effect of the invention) As described above, according to the configuration of the invention, a printed circuit board is sandwiched between a pair of pin headers and a pinless header, and electrical connection pins are penetrated and protruded in the vertical direction, and between the pinless header and the printed circuit board. Since the soldering is inserted through the pins and fixed, it is not affected by the thickness of the printed circuit board and can be applied to printed circuit boards with a thickness of 1.6 m/m or less, and pin headers and pinless headers can be attached to the printed circuit board. It provides spacer functions and printed circuit board reinforcement functions, and is also suitable for mass production by automating pin connectors.
図面は本考案に係る一実施例を示すもので、第
１図はピンコネクターの要部縦断面図、そして第
２図はプリント基板と一対のピンヘツダーとピン
レスヘツダーとの位置関係を示す斜視図である。
１……プリント基板、２……ピン、３……穴、
４……ピンヘツダー、５……ピンレスヘツダー、
６……ハンダリング。
The drawings show one embodiment of the present invention, and FIG. 1 is a vertical cross-sectional view of a main part of a pin connector, and FIG. 2 is a perspective view showing the positional relationship between a printed circuit board, a pair of pin headers, and a pinless header. . 1...Printed circuit board, 2...pin, 3...hole,
4...Pin header, 5...Pinless header,
6...Holdering.
Claims (1)
させてプリント基板に固定するためのピンコネク
ターにおいて、ほぼ直方体の絶縁体からなる一対
のピンヘツダーとピンレスヘツダーとを有し、ピ
ンヘツダーは、複数の電気接続用ピンをその内部
に貫通させた状態で電気接続用ピンと一体に構成
し、ピンレスヘツダーのプリント基板側の面に電
気接続用ピンの数およびプリント基板の穴の位置
に対応させた複数の凹所を設け、その凹所には電
気接続用ピンが貫通しうる複数の貫通穴を設け、
かつ、その凹所の内部空間に、電気接続用ピンが
貫通しうる複数のハンダリングを設け、ピンヘツ
ダー上にプリント基板、ハンダリングおよびピン
レスヘツダーを順に重ねてハンダリングの熱溶融
により電気接続用ピンをプリント基板に固定した
ことを特徴とするピンコネクター。 A pin connector for fixing an electrical connection pin to a printed circuit board by projecting it through a hole in the printed circuit board, which has a pair of pin headers and a pinless header made of an approximately rectangular parallelepiped insulator, and the pin header is used for multiple electrical connections. It is constructed integrally with the electrical connection pin with the pin penetrated inside, and multiple recesses are provided on the printed circuit board side surface of the pinless header corresponding to the number of electrical connection pins and the position of the hole on the printed circuit board. , a plurality of through holes are provided in the recess through which electrical connection pins can pass,
In addition, a plurality of solder rings through which electrical connection pins can pass are provided in the internal space of the recess, and the printed circuit board, solder rings, and pinless header are sequentially stacked on top of the pin header, and the electrical connection pins are attached by thermally melting the solder rings. A pin connector characterized by being fixed to a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118973U JPH054217Y2 (en) | 1987-08-03 | 1987-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987118973U JPH054217Y2 (en) | 1987-08-03 | 1987-08-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6423880U JPS6423880U (en) | 1989-02-08 |
| JPH054217Y2 true JPH054217Y2 (en) | 1993-02-02 |
Family
ID=31363796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987118973U Expired - Lifetime JPH054217Y2 (en) | 1987-08-03 | 1987-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH054217Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4872846A (en) * | 1988-07-21 | 1989-10-10 | Clark Thomas C | Solder containing electrical connector and method for making same |
| JPH0732042B2 (en) * | 1990-10-11 | 1995-04-10 | 富士通株式会社 | Through-hole connection type electronic device and its mounting method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53125854U (en) * | 1977-03-16 | 1978-10-06 |
-
1987
- 1987-08-03 JP JP1987118973U patent/JPH054217Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6423880U (en) | 1989-02-08 |
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