JPH0559875U - Circuit board device - Google Patents
Circuit board deviceInfo
- Publication number
- JPH0559875U JPH0559875U JP000921U JP92192U JPH0559875U JP H0559875 U JPH0559875 U JP H0559875U JP 000921 U JP000921 U JP 000921U JP 92192 U JP92192 U JP 92192U JP H0559875 U JPH0559875 U JP H0559875U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- parent
- lead terminals
- flat portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 abstract description 9
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【目的】回路基板装置のリード端子を親基板の表面側に
面実装できるようにしてその実装効率をアップする。
【構成】基板下端部６を各リード端子１８それぞれの一
対の挟持部１８ｂ，１８ｂ間で挟持するとともに、各リ
ード端子１８それぞれの平坦部１８ａを介して当該回路
基板２を親基板１２上に載置した状態では各平坦部１８
ａによって当該回路基板２が親基板１２上に自立可能と
し、これによって、親基板１２にはリード端子１８を取
り付けるためにはスルーホールではなく電極ランド２０
を設けるだけとし、そのスルーホールを不要としてデッ
ドスペースをなくし部品等の実装効率をアップする。
(57) [Abstract] [Purpose] To improve the mounting efficiency by allowing the lead terminals of a circuit board device to be surface-mounted on the front side of a parent board. [Structure] A lower end portion 6 of a substrate is sandwiched between a pair of sandwiching portions 18b, 18b of each lead terminal 18, and the circuit board 2 is mounted on a parent substrate 12 via a flat portion 18a of each lead terminal 18. Each flat portion 18 when placed
The circuit board 2 can be self-supported on the parent board 12 by a, so that in order to attach the lead terminal 18 to the parent board 12, not the through holes but the electrode lands 20.
Only by providing the through hole, the dead space is eliminated and the mounting efficiency of components and the like is improved.
Description
【０００１】[0001]
本考案は、回路基板と複数のリード端子とを有し、該回路基板における同一の 基板端部側に複数のリード端子を取り付けてなる回路基板装置に関する。 The present invention relates to a circuit board device having a circuit board and a plurality of lead terminals, and a plurality of lead terminals attached to the same board end portion side of the circuit board.
【０００２】[0002]
図６は従来例の回路基板装置における回路基板を親基板上に立設する前の状態 を示す斜視図であり、図７は立設した状態での回路基板装置と親基板との断面図 である。 FIG. 6 is a perspective view showing a state before the circuit board in the conventional circuit board device is erected on the parent board, and FIG. 7 is a sectional view of the circuit board device and the parent board in the erected state. is there.
【０００３】 これらの図を参照して従来例の回路基板装置１について説明すると、回路基板 ２には両面上に複数の回路部品４が所要の電気回路を構成するように図示してい ない適宜の配線上に半田付けで固定されている。そして、回路基板２の下端部６ には複数のこの例では４つのリード端子８が所定の間隔毎に取り付けられている 。これら各リード端子８は、一対の挟持部１０を有しており、該一対の挟持部１ ０間に基板下端部６が挟持されている。親基板１２には各リード端子８の先端が 挿通可能なスルーホール１４が各リード端子８の数および配置に合わせてこの例 では４つ形成されており、回路基板下端部６に取り付けられた各リード端子８の 先端が親基板１２の表面側１２ａから各スルーホール１４を挿通されてその裏面 側１２ｂに貫通され、該裏面側１２ｂで適宜に半田付けされて固定されることで 、親基板１２に回路基板２が実装される。そして、このように親基板１２にはこ のような回路基板装置１が図示していないが、複数、適宜に実装されている。The circuit board device 1 of the conventional example will be described with reference to these drawings. The circuit board 2 is not illustrated so that a plurality of circuit components 4 on both sides form a required electric circuit. It is fixed on the wiring by soldering. A plurality of four lead terminals 8 in this example are attached to the lower end portion 6 of the circuit board 2 at predetermined intervals. Each of these lead terminals 8 has a pair of holding portions 10, and the substrate lower end portion 6 is held between the pair of holding portions 10. In this example, four through holes 14 through which the tips of the lead terminals 8 can be inserted are formed in the parent board 12 in accordance with the number and arrangement of the lead terminals 8. The leading end of the lead terminal 8 is inserted through each through hole 14 from the front surface side 12a of the parent board 12 and penetrates through the back surface side 12b thereof, and is appropriately soldered and fixed on the back surface side 12b. The circuit board 2 is mounted on. Although not shown in the drawing, the plurality of circuit board devices 1 are mounted on the parent board 12 as described above.
【０００４】[0004]
従来例の回路基板装置１においては、前記実装のためには親基板１２側に多数 のスルーホール１４を形成させる必要がある構造であったから、親基板１２の表 面側１２ａではともかく、その裏面側１２ｂにはスルーホール１４形成のための スペースをあけておく必要がある。このようなスペースは、親基板１２側にとっ ては、その裏面側１２ｂに他の回路基板とか電子部品などを実装させることがで きない、いわゆるデッドスペースとなってしまい、親基板１２の回路基板とか他 の部品等に対する実装効率を大幅にダウンさせていた。 Since the circuit board device 1 of the conventional example has a structure in which a large number of through holes 14 need to be formed on the parent board 12 side for the mounting, the rear surface of the parent board 12 is not limited to the front surface side 12a. It is necessary to leave a space for forming the through hole 14 on the side 12b. On the parent board 12 side, such a space becomes a so-called dead space in which other circuit boards or electronic components cannot be mounted on the back surface side 12b, and the circuit of the parent board 12 is formed. The mounting efficiency for the board and other parts was greatly reduced.
【０００５】 したがって、本考案においては、親基板側における回路基板などの実装効率を アップできるような回路基板装置を提供することを目的としている。Therefore, it is an object of the present invention to provide a circuit board device capable of increasing the mounting efficiency of a circuit board or the like on the parent board side.
【０００６】[0006]
このような目的を達成するために、本考案の回路基板装置においては、回路基 板と複数のリード端子とを有し、該回路基板における同一の基板端部側に複数の リード端子を取り付けてなり、これら各リード端子が親基板側にそれぞれ固定さ れることで当該回路基板が親基板上に立設状態で実装されるものであって、前記 複数のリード端子のそれぞれを前記取り付け状態で基板厚方向に延びる平坦部と 、この平坦部上に互いに対向状態で立設された一対の挟持部とを有したものにし 、基板端部を各リード端子それぞれの一対の挟持部間で挟持し、かつ、各リード 端子それぞれの平坦部を介して当該回路基板を親基板上に載置した状態では各平 坦部によって当該回路基板が親基板上に自立可能にしてあることを特徴としてい る。 In order to achieve such an object, the circuit board device of the present invention has a circuit board and a plurality of lead terminals, and a plurality of lead terminals are attached to the same board end side of the circuit board. By fixing each of these lead terminals to the main board side, the circuit board is mounted in an upright state on the main board, and each of the plurality of lead terminals is mounted on the board in the mounting state. A flat part extending in the thickness direction and a pair of sandwiching parts standing upright on the flat part so as to be opposed to each other are provided, and the substrate end is sandwiched between the pair of sandwiching parts of each lead terminal, Further, it is characterized in that the circuit board can be self-supported on the parent board by each flat portion in a state where the circuit board is placed on the parent board through the flat portion of each lead terminal.
【０００７】[0007]
複数のリード端子のそれぞれを、前記取り付け状態で基板厚方向に延びる平坦 部と、この平坦部上に互いに対向状態で立設された一対の挟持部とを有したもの にし、基板端部を各リード端子それぞれの一対の挟持部間で挟持するとともに、 各リード端子それぞれの平坦部を介して当該回路基板を親基板上に載置した状態 では各平坦部によって当該回路基板が親基板上に自立可能にしたから、例えば親 基板の片面側に各リード端子の平坦部位置に合わせた電極を形成し、その電極上 に回路基板を安定的に自立させておくことができる。 Each of the plurality of lead terminals has a flat portion extending in the thickness direction of the substrate in the attached state, and a pair of sandwiching portions erected on the flat portion so as to be opposed to each other, and the substrate end portions are respectively The lead terminals are sandwiched between a pair of sandwiching sections, and when the circuit board is placed on the parent board via the flat sections of the lead terminals, the flat sections cause the circuit board to stand on the parent board. Since this is made possible, for example, it is possible to form an electrode on one side of the parent board in accordance with the position of the flat portion of each lead terminal, and to make the circuit board stably stand on its own.
【０００８】[0008]
【実施例】 以下、本考案の一実施例を図面を参照して詳細に説明する。Embodiment An embodiment of the present invention will be described in detail below with reference to the drawings.
【０００９】 図１は、本考案の実施例に係る回路基板装置とこの回路基板装置における回路 基板が実装される親基板との要部斜視図であり、図２は、その側面図であり、図 ３は回路基板装置のみの平面図である。これらの図において、従来例に係る図６ および図７と対応する部分には同一の符号を付し、その同一の符号に係る部分に ついての詳しい説明は省略する。FIG. 1 is a perspective view of a main part of a circuit board device according to an embodiment of the present invention and a parent board on which a circuit board in the circuit board device is mounted, and FIG. 2 is a side view thereof. FIG. 3 is a plan view of only the circuit board device. In these figures, portions corresponding to those of FIGS. 6 and 7 according to the conventional example are denoted by the same reference numerals, and detailed description of the portions having the same reference numerals is omitted.
【００１０】 本実施例装置１６においては、回路基板２の構成は前述と同様であるが、その 基板下端部６に取り付けられるリード端子１８のそれぞれの形状に特徴がある。 すなわち、各リード端子１８は、図で基板厚の左右両方向に延びる平坦部１８ａ と、この平坦部１８ａ上に互いに対向状態で該平坦部１８ａの面に対して略垂直 に立設された一対の挟持部１８ｂ，１８ｂとを有した形状になっている。そして 、各リード端子１８は、それぞれ、一対の挟持部１８ｂ，１８ｂの互いの対向面 間に基板下端部６が圧入されることで、回路基板２に取り付けられている。そし て、この取り付け状態では各リード端子１８それぞれの平坦部１８ａの面は、回 路基板２の基板面方向に向いており、これによって、回路基板２はその平坦部１ ８ａによって親基板１２の面上に自立可能にされている。一方、親基板１２の表 面側１２ａにはリード端子１８の配置数と配置間隔とに合わせた複数の電極ラン ド２０が形成されている。そして、当該回路基板下端部６に取り付けてある各リ ード端子１８の平坦部１８ａを、親基板１２の表面側１２ａ上の各電極ランド２ ０に位置合わせして載置させると、回路基板２はその電極ランド２０に自立する 。In the device 16 of the present embodiment, the structure of the circuit board 2 is the same as that described above, but each lead terminal 18 attached to the lower end portion 6 of the board is characterized by its shape. That is, each lead terminal 18 includes a flat portion 18a extending in both left and right directions of the substrate thickness in the drawing, and a pair of flat portions 18a standing on the flat portion 18a so as to face each other substantially perpendicularly to the surface of the flat portion 18a. It has a shape including the holding portions 18b and 18b. Each lead terminal 18 is attached to the circuit board 2 by press-fitting the board lower end portion 6 between the opposing surfaces of the pair of sandwiching portions 18b, 18b. Then, in this attached state, the surface of the flat portion 18a of each lead terminal 18 faces the board surface direction of the circuit board 2, whereby the circuit board 2 is attached to the parent board 12 by the flat portion 18a. Being able to stand on its own. On the other hand, on the front surface side 12a of the parent substrate 12, a plurality of electrode lands 20 are formed in accordance with the number of lead terminals 18 arranged and the arrangement intervals. Then, when the flat portions 18a of the lead terminals 18 attached to the lower end portion 6 of the circuit board are aligned with the electrode lands 20 on the front surface side 12a of the parent board 12 and placed, 2 stands on its electrode land 20.
【００１１】 この自立状態で各平坦部１８ａを電極ランド２０に半田付けすることで当該回 路基板２は親基板１２の表面側１２ａ上に面実装される。By soldering each flat portion 18 a to the electrode land 20 in this self-supporting state, the circuit board 2 is surface-mounted on the front surface side 12 a of the parent board 12.
【００１２】 なお、上記実施例での各リード端子１８それぞれの平坦部１８ａは、図上、回 路基板２を間にして左右両方向に延びているが、平坦部１８ａが基板厚の一方向 にのみ、例えば図４のように左側４つのリード端子１８ではその平坦部１８ａが 左側方向に延び、右側３つのリード端子１８ではその平坦部１８ａが右側方向に 延びるようにして千鳥足状にしたものでもよく、また、上記実施例ではリード端 子１８の数が図１ないし図３の実施例では４つ、図４の実施例では７つで、その 平坦部の長さはいずれも同一であったが、図５のように左側端部側と右側端部側 との各平坦部１８ａをそれぞれ左右に方向に長くし、図示していない他の平坦部 はそれよりも短くしたものであってもよい。Although the flat portion 18a of each lead terminal 18 in the above embodiment extends in both the left and right directions with the circuit board 2 in between in the figure, the flat portion 18a extends in one direction of the substrate thickness. For example, even if the four lead terminals 18 on the left side have flat portions 18a extending in the left direction and the three lead terminals 18 on the right side have flat portions 18a extending in the right direction as shown in FIG. Well, in the above embodiment, the number of lead terminals 18 is four in the embodiment of FIGS. 1 to 3, and seven in the embodiment of FIG. 4, and the flat portions have the same length. However, as shown in FIG. 5, even if the flat portions 18a on the left end side and the right end side are lengthened in the left-right direction, and other flat portions not shown are shorter than that, Good.
【００１３】[0013]
以上のように本考案によれば、複数のリード端子のそれぞれを、前記取り付け 状態で基板厚方向に延びる平坦部と、この平坦部上に互いに対向状態で立設され た一対の挟持部とを有したものにし、基板端部を各リード端子それぞれの一対の 挟持部間で挟持するとともに、各リード端子それぞれの平坦部を介して当該回路 基板を親基板上に載置した状態では各平坦部によって当該回路基板が親基板上に 自立可能にしたから、例えば親基板の片面側に各リード端子の平坦部位置に合わ せた電極を形成し、その電極上に回路基板を安定的に自立させておくことができ ることになり、その結果、親基板側には従来のように回路基板側のリード端子を 裏面側に貫通させ該裏面側で半田付け固定させるための該貫通用のスルーホール を設ける必要がなくなり、例えば親基板の表面側にリード端子の平坦部を載置さ せる電極ランドを形成しておき、その平坦部を電極ランド上で半田付けして該回 路基板を面実装できるから、そのスルーホールをなくして親基板の裏面側を他の 部品の実装に活用できるようになり、該親基板の実装効率をアップさせることが できる。 As described above, according to the present invention, each of the plurality of lead terminals is provided with a flat portion extending in the board thickness direction in the mounted state, and a pair of sandwiching portions erected on the flat portion so as to face each other. In addition to holding the circuit board edge part between the pair of pinching parts of each lead terminal, the flat part is placed on the parent board via the flat part of each lead terminal. Since the circuit board can be made self-supporting on the main board by, for example, an electrode aligned with the flat part position of each lead terminal is formed on one side of the main board, and the circuit board is made to be stable and self-supporting on the electrode. As a result, the through-holes for penetrating the lead terminals on the circuit board side are formed on the parent board side in the same manner as in the conventional case, and are fixed by soldering on the back surface side. Need to provide Since, for example, an electrode land for mounting the flat portion of the lead terminal is formed on the front surface side of the parent board and the flat portion can be soldered on the electrode land, the circuit board can be surface-mounted. By eliminating the through hole, the back side of the parent board can be used for mounting other components, and the mounting efficiency of the parent board can be improved.
【図１】本考案の一実施例に係る回路基板装置と該装置
の回路基板が実装される親基板との要部の斜視図であ
る。FIG. 1 is a perspective view of a main part of a circuit board device according to an embodiment of the present invention and a main board on which a circuit board of the device is mounted.
【図２】図１の側面図である。FIG. 2 is a side view of FIG.
【図３】図１の平面図である。FIG. 3 is a plan view of FIG.
【図４】本考案の他の実施例の回路基板装置の平面図で
ある。FIG. 4 is a plan view of a circuit board device according to another embodiment of the present invention.
【図５】本考案のさらに他の実施例の回路基板装置の平
面図である。FIG. 5 is a plan view of a circuit board device according to still another embodiment of the present invention.
【図６】従来例に係る回路基板装置とそれが実装される
親基板との要部の斜視図である。FIG. 6 is a perspective view of a main part of a circuit board device according to a conventional example and a main board on which the circuit board device is mounted.
【図７】図６の側面断面図である。FIG. 7 is a side sectional view of FIG.
２ 回路基板 ４ 回路部品 ６ 回路基板下端部 １２ 親基板 １６ 回路基板装置 １８ リード端子 １８ａ 平坦部 １８ｂ 挟持部 ２０ 電極ランド 2 circuit board 4 circuit component 6 circuit board lower end 12 parent board 16 circuit board device 18 lead terminal 18a flat portion 18b sandwiching portion 20 electrode land
Claims (1)
該回路基板における同一の基板端部側に複数のリード端
子を取り付けてなり、これら各リード端子が親基板側に
それぞれ固定されることで当該回路基板が親基板上に立
設状態で実装される回路基板装置であって、 前記複数のリード端子のそれぞれを前記取り付け状態で
基板厚方向に延びる平坦部と、この平坦部上に互いに対
向状態で立設された一対の挟持部とを有したものにし、
基板端部を各リード端子それぞれの一対の挟持部間で挟
持し、かつ、各リード端子それぞれの平坦部を介して当
該回路基板を親基板上に載置した状態では各平坦部によ
って当該回路基板が親基板上に自立可能にしてあること
を特徴とする回路基板装置。1. A circuit board and a plurality of lead terminals,
A plurality of lead terminals are attached to the same board end portion side of the circuit board, and the respective lead terminals are fixed to the parent board side, so that the circuit board is mounted in an upright state on the parent board. A circuit board device having a flat portion extending in the board thickness direction of each of the plurality of lead terminals in the mounted state, and a pair of sandwiching portions erected on the flat portion so as to face each other. West,
The circuit board is sandwiched between the pair of sandwiching portions of the respective lead terminals, and when the circuit board is placed on the parent board via the flat portions of the respective lead terminals, the circuit board is formed by the flat portions. The circuit board device is characterized in that it can stand on a parent board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP000921U JPH0559875U (en) | 1992-01-14 | 1992-01-14 | Circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP000921U JPH0559875U (en) | 1992-01-14 | 1992-01-14 | Circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0559875U true JPH0559875U (en) | 1993-08-06 |
Family
ID=11487154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP000921U Pending JPH0559875U (en) | 1992-01-14 | 1992-01-14 | Circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0559875U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009147223A (en) * | 2007-12-17 | 2009-07-02 | Toppan Printing Co Ltd | Module part, module and method of manufacturing module part |
| US11991493B2 (en) | 2021-12-22 | 2024-05-21 | Samsung Electronics Co., Ltd. | Microphone package and electronic apparatus including the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4116177B2 (en) * | 1999-01-14 | 2008-07-09 | エスアイアイ・ナノテクノロジー株式会社 | Thermal analyzer |
-
1992
- 1992-01-14 JP JP000921U patent/JPH0559875U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4116177B2 (en) * | 1999-01-14 | 2008-07-09 | エスアイアイ・ナノテクノロジー株式会社 | Thermal analyzer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009147223A (en) * | 2007-12-17 | 2009-07-02 | Toppan Printing Co Ltd | Module part, module and method of manufacturing module part |
| US11991493B2 (en) | 2021-12-22 | 2024-05-21 | Samsung Electronics Co., Ltd. | Microphone package and electronic apparatus including the same |
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