JPH0548760B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention provides a
This invention relates to an improved electrode structure for a so-called IC card that encloses a CPU chip or a memory chip and processes and stores various information.

[Technical background of the invention and its problems] Recently, inside a card-like plastic board,
So-called IC cards, which have increased functionality by incorporating a CPU chip or memory chip, are beginning to be used. This IC card is equipped with electrodes connected to the CPU chip, memory chip, etc. sealed inside, and information is exchanged via these electrodes.

By the way, in the smart IC card, the electrode for transmitting and receiving the information is provided on the surface of the card body in such a manner that it can be directly contacted with a finger. This IC
Since cards are used by people holding them directly in their hands, the disadvantage of conventional cards is that the static electricity accumulated in people is discharged through these electrodes, and there is a high possibility that the CPU chip and memory chip installed inside the card will be destroyed. be. In addition, when using this IC card, you put it in and take it out from your clothes or a special card holder, so static electricity is generated due to friction between the IC card and the clothes or card holder, and this static electricity is discharged through the electrodes and internally. There is also a high possibility that the CPU chip and memory chip of the computer will be destroyed.
Another drawback is that the internal CPU chip and memory chip may malfunction due to the electric field caused by static electricity accumulated on the card.

[Object of the Invention] This invention has been made in consideration of the above circumstances, and its purpose is to provide an IC card that is strong against static electricity.

[Summary of the Invention] In order to achieve the above object, the present invention encapsulates a semiconductor integrated circuit chip in a plate-shaped card body made of an insulating member, and a hole is formed so as to extend through the front and back of the card body. A ground electrode connected to the reference potential of the semiconductor integrated circuit chip is provided around the hole on both the front and back sides of the card body. An electrode is provided.

[Embodiments of the Invention] Hereinafter, embodiments of the invention will be described with reference to the drawings.

Figure 1 was conceived during the process of this invention.
FIG. 2 is a plan view showing the structure of the IC card, and FIG. 2 is a sectional view taken along line a-b in FIG. 1. In FIGS. 1 and 2, reference numeral 10 denotes an IC card body on a plate made of an insulating member, such as insulating plastic. A CPU chip 11 including a memory portion is enclosed inside this IC card body 10. Further, a plurality of holes 12 are formed on the surface of this IC card body 10 at a depth that does not reach the back surface, and an electrode 13 is provided at the bottom of each hole 12. The CPU chip 11 is connected to each of the electrodes 13 via internal lead electrodes 14.

Furthermore, a grounding electrode 15 made of a conductive material is formed on the surface of the IC card body 10, and although this electrode 15 is not shown,
It is connected to the reference potential of the board of the CPU chip 11, etc. Note that this electrode 15 is connected to the IC card body 10 on the side where the CPU chip 11 is formed.
is provided on the surface of the

According to an IC card having such a configuration, the electrode 1
3 is a hole 1 formed on the surface of the IC card body 10
Since the structure is such that it is impossible to directly touch the electrode 13 with a finger, there is no risk of static electricity accumulated in humans being discharged through the electrode 13 as in the conventional case. Therefore, due to electrostatic discharge,
There is almost no possibility that CPU chip 11 will be destroyed. In addition, static electricity generated due to friction with clothing or the card holder when using this IC card is released to the reference potential via the grounding electrode 15 formed on the surface of the IC card body 10. The internal CPU chip 11 is also protected from destruction. Furthermore, the static electricity accumulated on the IC card body 10 is released to the reference potential via the grounding electrode 15 in the same manner as described above, so that no electric field is generated due to this static electricity, and malfunctions of the CPU chip 11 can be prevented. .

In addition, this IC card has a grounding electrode 15.
is formed only on a part of the surface of the IC card body 10, but it may be formed to cover the entire surface except for the portion where the hole 12 is formed, or it may also be formed on the back surface.

FIG. 3 is a plan view showing a structure of an IC card different from the above, which was conceived during the course of the invention. The IC card shown in FIG. 3 is different from those shown in FIGS. 1 and 2 above in that the hole 12 is provided in common for a plurality of electrodes 13. Therefore, the planar shape of this hole 12 is horizontally elongated.

FIG. 4 is a plan view showing the structure of an embodiment of the IC card according to the present invention, and FIG. 5 is a sectional view taken along line c-d in FIG. 4. In FIGS. 1 to 3 above, a plurality of holes 12 are formed on the surface of the IC card body 10 at a depth that does not reach the back surface, and an electrode 13 is provided at the bottom of each hole 12. However, in this embodiment, each hole 12 is formed to penetrate to the back surface,
Electrodes 13 are provided on the side surfaces of each hole 12, respectively.

In the case of this embodiment, since the electrode 13 is provided on the side surface of each hole 12, the possibility of contact with the electrode 12 is lower than in the case of the above embodiment, and the CPU chip 11 provided inside is protected from static electricity. There is almost no possibility that it will be destroyed by electrical discharge.

[Effects of the Invention] As explained above, according to the present invention, it is possible to provide an IC card that is strong against static electricity.

[Brief explanation of the drawing]

Figure 1 was conceived during the process of this invention.
FIG. 2 is a plan view showing the structure of an IC card, FIG. 2 is a cross-sectional view thereof, FIG. FIG. 5 is a plan view showing the structure of the IC card according to the embodiment, and FIG. 5 is a cross-sectional view thereof. 10...IC card body, 11...CPU chip,
12...hole, 13...electrode, 14...internal lead electrode, 15...earth electrode.

Claims (1)

[Scope of Claims] 1. A plate-shaped card body made of an insulating member; a semiconductor integrated circuit chip sealed within the card body; a hole formed so as to penetrate the front and back sides of the card body; An IC card characterized by comprising an electrode for transmitting and receiving information, which is provided on the side surface of the inside of the hole and connected to the semiconductor integrated circuit chip. 2. A plate-shaped card body made of an insulating material, a semiconductor integrated circuit chip sealed within the card body, a hole formed so as to pass through the front and back of the card body, and a hole provided on the side surface inside the hole. an electrode for transmitting and receiving information connected to the semiconductor integrated circuit chip; and a grounding electrode formed around the hole on both the front and back sides of the card body and connected to the reference potential of the semiconductor integrated circuit chip. An IC card characterized by being equipped with.