JPH0552666B2 - - Google Patents

Info

Publication number
JPH0552666B2
JPH0552666B2 JP58220925A JP22092583A JPH0552666B2 JP H0552666 B2 JPH0552666 B2 JP H0552666B2 JP 58220925 A JP58220925 A JP 58220925A JP 22092583 A JP22092583 A JP 22092583A JP H0552666 B2 JPH0552666 B2 JP H0552666B2
Authority
JP
Japan
Prior art keywords
metal film
metal
bump
plating
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58220925A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60113446A (ja
Inventor
Hiroshi Nakatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP58220925A priority Critical patent/JPS60113446A/ja
Publication of JPS60113446A publication Critical patent/JPS60113446A/ja
Publication of JPH0552666B2 publication Critical patent/JPH0552666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Magnetic Heads (AREA)
  • Electroplating Methods And Accessories (AREA)
JP58220925A 1983-11-24 1983-11-24 バンプ電極の製造方法 Granted JPS60113446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58220925A JPS60113446A (ja) 1983-11-24 1983-11-24 バンプ電極の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58220925A JPS60113446A (ja) 1983-11-24 1983-11-24 バンプ電極の製造方法

Publications (2)

Publication Number Publication Date
JPS60113446A JPS60113446A (ja) 1985-06-19
JPH0552666B2 true JPH0552666B2 (cs) 1993-08-06

Family

ID=16758697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58220925A Granted JPS60113446A (ja) 1983-11-24 1983-11-24 バンプ電極の製造方法

Country Status (1)

Country Link
JP (1) JPS60113446A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62252951A (ja) * 1986-04-22 1987-11-04 Oki Electric Ind Co Ltd バンプ電極の製造方法
JP2633586B2 (ja) * 1987-10-21 1997-07-23 株式会社東芝 バンプ構造を有する半導体装置

Also Published As

Publication number Publication date
JPS60113446A (ja) 1985-06-19

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