JPH0554261B2 - - Google Patents

Info

Publication number
JPH0554261B2
JPH0554261B2 JP59023110A JP2311084A JPH0554261B2 JP H0554261 B2 JPH0554261 B2 JP H0554261B2 JP 59023110 A JP59023110 A JP 59023110A JP 2311084 A JP2311084 A JP 2311084A JP H0554261 B2 JPH0554261 B2 JP H0554261B2
Authority
JP
Japan
Prior art keywords
die
film
push
bonding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59023110A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60167337A (ja
Inventor
Kyoshi Mayahara
Yutaka Makino
Takeichi Yoshida
Kenichi Oku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59023110A priority Critical patent/JPS60167337A/ja
Publication of JPS60167337A publication Critical patent/JPS60167337A/ja
Publication of JPH0554261B2 publication Critical patent/JPH0554261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Die Bonding (AREA)
JP59023110A 1984-02-09 1984-02-09 ダイスボンデイング装置 Granted JPS60167337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59023110A JPS60167337A (ja) 1984-02-09 1984-02-09 ダイスボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59023110A JPS60167337A (ja) 1984-02-09 1984-02-09 ダイスボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60167337A JPS60167337A (ja) 1985-08-30
JPH0554261B2 true JPH0554261B2 (2) 1993-08-12

Family

ID=12101330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59023110A Granted JPS60167337A (ja) 1984-02-09 1984-02-09 ダイスボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60167337A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5479961B2 (ja) * 2010-03-16 2014-04-23 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP6519761B2 (ja) * 2017-08-25 2019-05-29 上野精機株式会社 電子部品受渡し装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56120136A (en) * 1980-02-28 1981-09-21 Toshiba Corp Pellet mounting method

Also Published As

Publication number Publication date
JPS60167337A (ja) 1985-08-30

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term