JPS60167337A - ダイスボンデイング装置 - Google Patents

ダイスボンデイング装置

Info

Publication number
JPS60167337A
JPS60167337A JP59023110A JP2311084A JPS60167337A JP S60167337 A JPS60167337 A JP S60167337A JP 59023110 A JP59023110 A JP 59023110A JP 2311084 A JP2311084 A JP 2311084A JP S60167337 A JPS60167337 A JP S60167337A
Authority
JP
Japan
Prior art keywords
die
collet
film
bonding
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59023110A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0554261B2 (2
Inventor
Kiyoshi Mayahara
馬屋原　潔
Yutaka Makino
豊 牧野
Takeichi Yoshida
吉田　竹一
Kenichi Oku
健一 奥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59023110A priority Critical patent/JPS60167337A/ja
Publication of JPS60167337A publication Critical patent/JPS60167337A/ja
Publication of JPH0554261B2 publication Critical patent/JPH0554261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Die Bonding (AREA)
JP59023110A 1984-02-09 1984-02-09 ダイスボンデイング装置 Granted JPS60167337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59023110A JPS60167337A (ja) 1984-02-09 1984-02-09 ダイスボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59023110A JPS60167337A (ja) 1984-02-09 1984-02-09 ダイスボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60167337A true JPS60167337A (ja) 1985-08-30
JPH0554261B2 JPH0554261B2 (2) 1993-08-12

Family

ID=12101330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59023110A Granted JPS60167337A (ja) 1984-02-09 1984-02-09 ダイスボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60167337A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011192927A (ja) * 2010-03-16 2011-09-29 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2019041007A (ja) * 2017-08-25 2019-03-14 上野精機株式会社 電子部品受渡し装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56120136A (en) * 1980-02-28 1981-09-21 Toshiba Corp Pellet mounting method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56120136A (en) * 1980-02-28 1981-09-21 Toshiba Corp Pellet mounting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011192927A (ja) * 2010-03-16 2011-09-29 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2019041007A (ja) * 2017-08-25 2019-03-14 上野精機株式会社 電子部品受渡し装置

Also Published As

Publication number Publication date
JPH0554261B2 (2) 1993-08-12

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Legal Events

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