JPH0555367B2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Field of Industrial Application This invention relates to the production of electronic components in which electronic components are arrayed on a tape in order to supply electronic components such as resistance networks and semiconductor elements to an automatic mounting device. Regarding the taping method.

(b) Prior art Currently, as a means of supplying electronic components to an automatic mounting device that automatically mounts electronic components onto a board,
A flexible tape with electronic components arranged in rows on its upper edge is used.

The conventional method of arranging electronic components on tape, that is, the taping method of electronic components, has been changed from
This will be explained below with reference to FIGS. 4a and 4b.

FIG. 4a shows leads 13, .
13 are provided protrudingly, and electronic components 14, .
4 is a plan view showing a state in which the

The lead binding portions 13a, . . . , 13a are cut along the cutting line a-a shown by the broken line in FIG. Separated electronic components 14, ...,
14 is the lead cutting part 13b,..., 13b.
The paper tapes 16a and 16b are sandwiched and supported between the paper tapes 16a and 16b, and are arranged in rows at predetermined intervals on the tape 15 composed of the two paper tapes 16a and 16b (FIG. 4b).

Electronic components 14 taped in this manner,...
..., 14 are connected to the lead 1 along the cutting line b-b indicated by the broken line in FIG. 4b in the automatic mounting device.
By cutting 3,...,13, tape 1
5 and mounted on the board.

(C) Problems to be Solved by the Invention In the above-mentioned conventional taping method for electronic components, the lead cutting portions 13b, ..., of the electronic component 14 are
Since the leads 13b are sandwiched and supported between the paper tapes 16a and 16b, the leads 13, . There was the inconvenience of increased costs.

Also, the leads 13, ..., 13 of the electronic component 14
As the tape 15 becomes longer, the pitch between the electronic components 14, .

Additionally, the lead frames used for taping have longer leads than regular lead frames.
It has to be manufactured separately, and there is an inconvenience that equipment for the lead frame for taping is required in addition to the equipment for the normal lead frame in the manufacturing process for installing electronic components on the lead frame.

In order to solve the above-mentioned problem, as shown in FIG. 4c, the tie bar 12 is cut to separate it into separate electronic components 14, . A method of supporting each lead 13,...,13 is also considered.
is short-circuited by the tie bar 12, so the tape 1
A new inconvenience arises in that it is not possible to perform a functional test of the electronic component 14 by bringing a probe or the like into contact with the leads 13, . . . , 13 of the electronic component 14 on the electronic component 5.

The present invention was made in view of the above-mentioned disadvantages, and provides a taping method for electronic components that reduces the cost of materials for lead frames, eliminates the pitch shift of electronic components, and allows processing with equipment for ordinary lead frames. is intended to provide.

(d) Means for Solving the Problems In order to solve the above-mentioned disadvantages, the method for taping electronic components of the present invention has a method for taping electronic components, in which the leads of the electronic components are tied together so that each electronic component is Remove a predetermined portion so that tie bar pieces that do not touch each other are left in the lead binding part,
These tie bar pieces are supported by the tape, and the parts are arranged in rows on the tape.

(E) Effect In the method for taping electronic components of the present invention, a tie bar piece is left at the base end of the lead of the electronic component, and this is supported by the tape.
The lead length of the lead frame can be made as short as that of a normal lead frame. Also,
Since each tie bar piece is not in contact with other tie bar pieces, it is possible to perform a functional test of the electronic component while it is provided on the tape.

(F) Embodiment An embodiment of the present invention will be described below based on FIGS. 1 to 3.

In this embodiment, the present invention is applied to the taping of a resistor network, and FIG. 2 shows a resistor network (electronic components) 4,...
..., 4 are arranged in a row. Leads 3,... are attached to the upper edge of the tie bar 2 made of a thin metal plate.
. . , 3 are bound by binding portions 3 a, . A circuit element (not shown) provided with a resistor is attached to the tips of these leads 3,..., 3, and the circuit element and the tips of the leads 3,..., 3 are protected by coating with paint, etc., and a resistor net is installed. Workpieces 4, . . . , 4 are provided. Note that the small holes 2b arranged in rows in the tie bar 2,...
..., 2b are for positioning the tie bar 2.

Next, as shown in FIG. 3, the tie bar 2 is provided with removal parts 2c, . A portion of the tie bar 2 left between these removed parts 2c, . . . , 2c is a tie bar piece 2a, .
Therefore, one tie bar piece 2a is provided for one lead 3. In this embodiment, the removal parts 2c, . . . , 2c are provided so as to pass above and below the small holes 2b, . However, the design is not limited to this, and the design can be changed as appropriate.

Next, the resistance network 4, .
By being sandwiched and supported by the paper tapes 6a and 6b, the paper tapes 6a and 6b are arranged in rows at predetermined intervals on the upper edge of the tape 5 (see FIG. 1). The small holes 5a, . . . , 5a formed in the tape 5 are for engagement by sprocket pawls or the like for tape feeding or positioning in an automatic mounting device.

Each resistor network 4,...,4 arranged in a row on this tape 5 has its leads 3,...,3
By bringing a probe or the like into contact with the surface, the inspection can be carried out in the conventional manner. The resistance networks 4,...,4 are connected to the automatic mounting device so that their leads 3,...,3 are connected, for example, to the dotted line B-- in FIG.
By cutting along the line B, it is separated from the tape 5 and attached to the substrate.

Although the above embodiment shows an example in which the present invention is applied to taping of a resistor network, the present invention can be widely applied to electronic components such as semiconductor devices.

(g) Effects of the Invention The electronic component taping method of the present invention uses tie bar pieces that do not touch each other at each lead binding portion, rather than a tie bar on which electronic components are arranged in a row by binding the leads of the electronic components. In this method, predetermined portions of the tie bars are removed, and these tie bar pieces are supported by the tape, and the electronic components are arranged on the tape.Therefore, there is no need to make the leads longer than usual, and the lead This has the advantage that the material cost of the frame can be reduced, and tie bars for regular products can be used as they are as lead frames for taping, and manufacturing equipment can be shared.

In addition, since the leads can be short, there is less error in the pitch of electronic components arranged in a row on the tape, which has the advantage of effectively preventing incorrect mounting of electronic components to the board in automatic mounting equipment. .

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a state in which electronic components are arranged in rows on a tape in an embodiment of the present invention;
FIG. 2 is a plan view showing a state in which electronic components are arranged in rows on tie bars in the same embodiment, and FIG.
FIG. 4a is a plan view showing a state in which a predetermined portion of the tie bar has been removed in the same embodiment. FIG. FIG. 4c is a plan view showing a state in which electronic components are arranged on a tape in the same taping method, and FIG. 4c is a plan view showing a modification of the same taping method. 2...Tie bar, 2a...2a...Tie bar piece, 2
c...2c...Removal part, 3...3...Lead, 3
a...3a...binding portion, 4...4...resistance network (electronic component), 5...tape.

Claims (1)

[Claims] 1. Remove a predetermined portion from a tie bar on which electronic components are arranged in a row by binding the leads of electronic components so that tie bar pieces that do not touch each other are left at each lead binding part, and remove these tie bar pieces. A method of taping electronic components, in which the electronic components are supported by the tape and arranged in rows on the tape.